FormFactor, Inc.

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Technologies

Intl Class Technology # of Patents Rank
 
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 20517
 
 
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 6358
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 33237
 
 
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 2181
 
 
 
G06F ELECTRIC DIGITAL DATA PROCESSING 13315
 
 
 
H01P WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE 941
 
 
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 665
 
 
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 657
 
 
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 530
 
 
 
H03H IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS 454

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2014/0043,054 VERTICAL PROBES FOR MULTI-PITCH FULL GRID CONTACT ARRAYAug 09, 13Feb 13, 14[G01R]
2014/0044,985 PROBE FABRICATION USING COMBINED LASER AND MICRO-FABRICATION TECHNOLOGIESAug 09, 13Feb 13, 14[G01R, B23K]
2013/0271,175 Wiring Substrate With Filled Vias To Accommodate Custom TerminalsApr 03, 13Oct 17, 13[G01R]
2013/0169,301 Probes With Programmable MotionJan 02, 13Jul 04, 13[G01R]
2013/0140,057 Carbon Nanotube Contact Structures For Use With Semiconductor Dies And Other Electronic DevicesDec 31, 12Jun 06, 13[H01B, H01L]
2013/0135,001 Hybrid Electrical ContactorNov 20, 12May 30, 13[G01R]
2013/0103,338 METHODS AND APPARATUSES FOR DYNAMIC PROBE ADJUSTMENTNov 09, 12Apr 25, 13[G05B]
2013/0093,450 VERTICAL PROBE ARRAY ARRANGED TO PROVIDE SPACE TRANSFORMATIONDec 04, 12Apr 18, 13[G01R]
2013/0096,866 Method And Apparatus For Designing A Custom Test SystemDec 04, 12Apr 18, 13[G01R]
2013/0082,729 Probe With Cantilevered Beam Having Solid And Hollow SectionsSep 30, 11Apr 04, 13[G01R]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8,638,113 Temporary planar electrical contact device and method using vertically-compressible nanotube contact structuresMay 04, 10Jan 28, 14[G01R]
8,587,331 Test systems and methods for testing electronic devicesDec 27, 10Nov 19, 13[G01R]
8,581,610 Method of designing an application specific probe card test systemJun 13, 06Nov 12, 13[G01R]
8,528,885 Multi-stage spring systemApr 21, 08Sep 10, 13[F16F]
8,519,728 Compliance control methods and apparatusesDec 12, 08Aug 27, 13[G01R]
8,513,942 Method of forming a probe substrate by layering probe row structures and probe substrates formed therebyDec 21, 10Aug 20, 13[G01R]
8,513,965 Method and apparatus for providing active compliance in a probe card assemblyNov 02, 10Aug 20, 13[G01R]
8,513,969 Apparatus and method of testing singulated diesJun 08, 10Aug 20, 13[G01R]
RE44407 Space transformers employing wire bonds for interconnections with fine pitch contactsDec 23, 09Aug 06, 13[G01R]
8,485,418 Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played outNov 09, 10Jul 16, 13[B23K]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Filing Date Issue/Pub Date Intl Class
2011/0115,512 Integrated circuit tester with high bandwidth probe assemblyJul 12, 05May 19, 11[G01R, H03H]
2010/0263,432 METHODS FOR PLANARIZING A SEMICONDUCTOR CONTACTORApr 23, 10Oct 21, 10[B21D]
2010/0264,949 FLEXURE BAND AND USE THEREOF IN A PROBE CARD ASSEMBLYApr 15, 09Oct 21, 10[G01R]
2010/0120,267 WAFER LEVEL INTERPOSERJan 19, 10May 13, 10[H01R]
2010/0104,678 APPARATUS AND METHOD FOR MAKING AND USING A TOOLING DIEOct 28, 08Apr 29, 10[C25D, B28B]
2010/0088,888 LITHOGRAPHIC CONTACT ELEMENTSJul 07, 09Apr 15, 10[H01R]
2010/0065,963 METHOD OF WIREBONDING THAT UTILIZES A GAS FLOW WITHIN A CAPILLARY FROM WHICH A WIRE IS PLAYED OUTJul 09, 09Mar 18, 10[H01L]
2010/0039,133 PROBE HEAD CONTROLLING MECHANISM FOR PROBE CARD ASSEMBLIESAug 13, 08Feb 18, 10[G01R]
2010/0039,739 VOLTAGE FAULT DETECTION AND PROTECTIONOct 27, 09Feb 18, 10[H02H]
2010/0000,080 APPARATUS AND METHOD FOR MANAGING THERMALLY INDUCED MOTION OF A PROBE CARD ASSEMBLYJun 03, 09Jan 07, 10[H05K]
7,621,044 Method of manufacturing a resilient contactOct 22, 04Nov 24, 09[H01R]
7,618,281 Interconnect assemblies and methodsJan 30, 07Nov 17, 09[G01R]
7,609,082 System for measuring signal path resistance for an integrated circuit tester interconnect structureFeb 03, 09Oct 27, 09[G01R]
7,601,039 Microelectronic contact structure and method of making sameJul 11, 06Oct 13, 09[H05K]
7,593,872 Method and system for designing a probe cardAug 15, 06Sep 22, 09[G06Q]
7,583,101 Probing structure with fine pitch probesJan 18, 07Sep 01, 09[G01R]
2009/0212,790 METHOD OF ESTIMATING CHANNEL BANDWIDTH FROM A TIME DOMAIN REFLECTOMETER (TDR) MEASUREMENTApr 28, 09Aug 27, 09[G01R]
7,579,856 Probe structures with physically suspended electronic componentsApr 21, 06Aug 25, 09[G01R]
2009/0179,659 CLOSED-GRID BUS ARCHITECTURE FOR WAFER INTERCONNECT STRUCTUREMar 24, 09Jul 16, 09[G01R, H01R]
2009/0139,040 APPARATUSES AND METHODS FOR CLEANING TEST PROBESDec 02, 08Jun 04, 09[B08B]

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