FormFactor, Inc.

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Technologies

Intl Class Technology # of Patents/ App Rank in Class
 
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 20625
 
 
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 5269
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 33274
 
 
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 18113
 
 
 
G06F ELECTRIC DIGITAL DATA PROCESSING 14369
 
 
 
H01P WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE 844
 
 
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 773
 
 
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 688
 
 
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 537
 
 
 
H03H IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS 458

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2014/0139,250 Contactor Devices With Carbon Nanotube Probes Embedded In A Flexible Film And Processes Of Making SuchNov 20, 12May 22, 14[G01R]
2014/0118,016 Probes With Spring Mechanisms For Impeding Unwanted Movement In Guide HolesOct 31, 12May 01, 14[G01R]
2014/0043,054 VERTICAL PROBES FOR MULTI-PITCH FULL GRID CONTACT ARRAYAug 09, 13Feb 13, 14[G01R]
2014/0044,985 PROBE FABRICATION USING COMBINED LASER AND MICRO-FABRICATION TECHNOLOGIESAug 09, 13Feb 13, 14[G01R, B23K]
2013/0271,175 Wiring Substrate With Filled Vias To Accommodate Custom TerminalsApr 03, 13Oct 17, 13[G01R]
2013/0169,301 Probes With Programmable MotionJan 02, 13Jul 04, 13[G01R]
2013/0140,057 Carbon Nanotube Contact Structures For Use With Semiconductor Dies And Other Electronic DevicesDec 31, 12Jun 06, 13[H01B, H01L]
2013/0135,001 Hybrid Electrical ContactorNov 20, 12May 30, 13[G01R]
2013/0103,338 METHODS AND APPARATUSES FOR DYNAMIC PROBE ADJUSTMENTNov 09, 12Apr 25, 13[G05B]
2013/0093,450 VERTICAL PROBE ARRAY ARRANGED TO PROVIDE SPACE TRANSFORMATIONDec 04, 12Apr 18, 13[G01R]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8,781,779 Methods and apparatuses for dynamic probe adjustmentNov 09, 12Jul 15, 14[G01C]
8,756,802 Carbon nanotube contact structures for use with semiconductor dies and other electronic devicesDec 31, 12Jun 24, 14[H01R, H01K]
8,760,187 Thermocentric alignment of elements on parts of an apparatusDec 03, 08Jun 24, 14[G01R]
8,736,294 Probe card stiffener with decouplingDec 14, 10May 27, 14[G01R]
8,706,289 Pre-aligner searchMar 23, 12Apr 22, 14[G06F]
8,697,301 Fuel cell using carbon nanotubesJan 28, 11Apr 15, 14[H01M]
8,638,113 Temporary planar electrical contact device and method using vertically-compressible nanotube contact structuresMay 04, 10Jan 28, 14[G01R]
8,587,331 Test systems and methods for testing electronic devicesDec 27, 10Nov 19, 13[G01R]
8,581,610 Method of designing an application specific probe card test systemJun 13, 06Nov 12, 13[G01R]
8,528,885 Multi-stage spring systemApr 21, 08Sep 10, 13[F16F]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Filing Date Issue/Pub Date Intl Class
2011/0171,838 SEGMENTED CONTACTORMar 28, 11Jul 14, 11[H05K]
2011/0115,512 Integrated circuit tester with high bandwidth probe assemblyJul 12, 05May 19, 11[G01R, H03H]
2010/0263,432 METHODS FOR PLANARIZING A SEMICONDUCTOR CONTACTORApr 23, 10Oct 21, 10[B21D]
2010/0264,949 FLEXURE BAND AND USE THEREOF IN A PROBE CARD ASSEMBLYApr 15, 09Oct 21, 10[G01R]
2010/0252,317 CARBON NANOTUBE CONTACT STRUCTURES FOR USE WITH SEMICONDUCTOR DIES AND OTHER ELECTRONIC DEVICESApr 03, 09Oct 07, 10[H01R, H05K]
7,746,089 Method and apparatus for indirect planarizationSep 29, 06Jun 29, 10[G01R]
2010/0154,861 PRINTED SOLAR PANELDec 23, 08Jun 24, 10[H01L]
7,737,709 Methods for planarizing a semiconductor contactorAug 28, 07Jun 15, 10[G01R]
2010/0140,793 Process For Manufacturing Contact Elements For Probe Card AssemblesMay 22, 09Jun 10, 10[C23F, H01L]
7,731,503 Carbon nanotube contact structuresAug 21, 06Jun 08, 10[H01R]
7,731,546 Microelectronic contact structureSep 16, 05Jun 08, 10[H01R]
7,732,713 Method to build robust mechanical structures on substrate surfacesAug 07, 07Jun 08, 10[H01R, H05K]
7,729,878 Air bridge structures and methods of making and using air bridge structuresOct 28, 08Jun 01, 10[G06F]
7,722,371 Electrical contactor, especially wafer level contactor, using fluid pressureNov 25, 08May 25, 10[H01R]
7,724,004 Probing apparatus with guarded signal tracesDec 01, 06May 25, 10[G01R]
2010/0120,267 WAFER LEVEL INTERPOSERJan 19, 10May 13, 10[H01R]
7,714,235 Lithographically defined microelectronic contact structuresMar 30, 00May 11, 10[H01R, H05K]
7,710,106 Temporary planar electrical contact device and method using vertically-compressible nanotube contact structuresSep 16, 08May 04, 10[G01R]
2010/0104,678 APPARATUS AND METHOD FOR MAKING AND USING A TOOLING DIEOct 28, 08Apr 29, 10[C25D, B28B]
7,699,616 High density planar electrical interfaceFeb 20, 08Apr 20, 10[H01R]

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