FORMFACTOR, INC.

Patent Owner

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Details

Technologies

Intl Class Technology # of Patents Rank
 
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 20318
 
 
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 6855
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 34223
 
 
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 2479
 
 
 
G06F ELECTRIC DIGITAL DATA PROCESSING 13287
 
 
 
H01P WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE 939
 
 
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 662
 
 
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 565
 
 
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 530
 
 
 
H03H IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS 455

Top Patents (by citation)

Patent # Title Filing Date Issue Date Intl Class Cited #
5,476,211 Method of manufacturing electrical contacts, using a sacrificial memberNov 16, 93Dec 19, 95[B23K]353
5,772,451 Sockets for electronic components and methods of connecting to electronic componentsOct 18, 95Jun 30, 98[H01R]342
5,974,662 Method of planarizing tips of probe elements of a probe card assemblyNov 09, 95Nov 02, 99[H01R]340
5,917,707 Flexible contact structure with an electrically conductive shellNov 15, 94Jun 29, 99[H01R]288
5,806,181 Contact carriers (tiles) for populating larger substrates with spring contactsJan 24, 97Sep 15, 98[H01R, H05K]253
6,064,213 Wafer-level burn-in and testJan 15, 97May 16, 00[G01R]251
6,029,344 Composite interconnection element for microelectronic components, and method of making sameAug 12, 98Feb 29, 00[H01R]202
6,184,053 Method of making microelectronic spring contact elementsMay 06, 97Feb 06, 01[H01L]192
5,998,864 Stacking semiconductor devices, particularly memory chipsMay 27, 97Dec 07, 99[H01L, H05K]176
6,255,126 Lithographic contact elementsDec 02, 98Jul 03, 01[G01R]173

Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2013/0103,338 METHODS AND APPARATUSES FOR DYNAMIC PROBE ADJUSTMENTNov 09, 12Apr 25, 13[G05B]
2013/0093,450 VERTICAL PROBE ARRAY ARRANGED TO PROVIDE SPACE TRANSFORMATIONDec 04, 12Apr 18, 13[G01R]
2013/0096,866 Method And Apparatus For Designing A Custom Test SystemDec 04, 12Apr 18, 13[G01R]
2013/0082,729 Probe With Cantilevered Beam Having Solid And Hollow SectionsSep 30, 11Apr 04, 13[G01R]
2012/0242,363 Non-Linear Vertical Leaf SpringNov 03, 11Sep 27, 12[G01R, H01R]
2012/0239,339 WIRELESS PROBE CARD VERIFICATION SYSTEM AND METHODMar 13, 12Sep 20, 12[G06F]
2012/0146,679 PROBE CARD STIFFENER WITH DECOUPLINGDec 14, 10Jun 14, 12[G01R]
2012/0086,004 ELASTIC ENCAPSULATED CARBON NANOTUBE BASED ELECTRICAL CONTACTSOct 05, 11Apr 12, 12[H01L, B82Y]
2012/0007,626 TESTING TECHNIQUES FOR THROUGH-DEVICE VIASJun 29, 11Jan 12, 12[G01R]
2011/0267,085 METHOD AND APPARATUS FOR TESTING DEVICES USING SERIALLY CONTROLLED INTELLIGENT SWITCHESJul 08, 11Nov 03, 11[G01R]

View all Publication..

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8,427,183 Probe card assembly having an actuator for bending the probe substrateApr 22, 11Apr 23, 13[G01R]
8,427,186 Probe element having a substantially zero stiffness and applications thereofJan 12, 10Apr 23, 13[G01R]
8,400,173 Method and apparatus for thermally conditioning probe cardsJun 26, 09Mar 19, 13[G01R]
8,400,176 Wafer level contactorAug 18, 09Mar 19, 13[G01R]
8,383,958 Method to build robust mechanical structures on substrate surfacesMay 20, 10Feb 26, 13[H01R, H05K]
8,373,428 Probe card assembly and kit, and methods of making sameAug 04, 09Feb 12, 13[G01R]
8,354,855 Carbon nanotube columns and methods of making and using carbon nanotube columns as probesDec 07, 09Jan 15, 13[G01R]
8,350,191 Probe card thermal conditioning systemNov 10, 08Jan 08, 13[B65D, F24C]
8,336,188 Thin wafer chuckJul 17, 08Dec 25, 12[B23Q, B25B]
8,324,725 Stacked die moduleJun 24, 05Dec 04, 12[H01L]

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Top Inventors for This Owner

Inventor Name Address # of Patent/Pub
ELDRIDGE BENJAMIN N
DANVILLE, CA
307
Mathieu Gaetan L
Livermore, CA
209
KHANDROS IGOR Y
ORINDA, CA
182
Miller Charles A
Fremont, CA
145
Grube Gary W
Pleasanton, CA
121
Eldridge Benjamin N.
Not Provided
77
Hobbs Eric D
Livermore, CA
55
Miller Charles A.
Not Provided
55
Mathieu Gaetan L.
Not Provided
50
PEDERSEN DAVID V
SCOTTS VALLEY, CA
49