FSI INTERNATIONAL, INC.
Patent Owner
Stats
- 7 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- Mar 23, 2010 most recent publication
Details
- 7 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 4,716 Total Citation Count
- May 23, 1978 Earliest Filing
- 98 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
Rank in Class
Top Patents (by citation)
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Recent Publications
- No Recent Publications to Display
Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
7681581 Compact duct system incorporating moveable and nestable baffles for use in tools used to process microelectronic workpieces with one or more treatment fluidsMar 15, 06Mar 23, 10[B08B]
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
2009/0304,995 HYDROPHILIC FLUOROPOLYMER MATERIALS AND METHODSAbandonedJun 04, 09Dec 10, 09[B24B, B24C, B32B, B44C]
7312161 Advanced process control for low variation treatment in immersion processingExpiredMay 05, 06Dec 25, 07[H01L]
7238239 Liquid coating device with barometric pressure compensationExpiredJul 28, 03Jul 03, 07[B05C]
2006/0272,677 Cleaning process for semiconductor substratesAbandonedJun 20, 05Dec 07, 06[B08B, C23G]
2006/0266,737 Process for removal of metals and alloys from a substrateAbandonedMay 25, 06Nov 30, 06[B44C]
7134827 Reduced footprint tool for automated processing of microelectronic substratesExpiredSep 28, 04Nov 14, 06[B65G]
2006/0174,828 Processing system with multi-chamber pump, and related apparatus and methodsAbandonedFeb 07, 05Aug 10, 06[B05C]
2006/0105,683 Nozzle design for generating fluid streams useful in the manufacture of microelectronic devicesAbandonedNov 08, 05May 18, 06[B24C]
2006/0070,979 Using ozone to process wafer like objectsAbandonedSep 13, 05Apr 06, 06[C03C, H01L, B08B]
6979165 Reduced footprint tool for automated processing of microelectronic substratesExpiredNov 12, 02Dec 27, 05[B65H]
2005/0098,194 Semiconductor wafer immersion systems and treatments using modulated acoustic energyAbandonedSep 10, 04May 12, 05[B08B]
6854514 Temperature control apparatus and method with recirculated coolantExpiredAug 06, 01Feb 15, 05[F25B]
2005/0000,549 Wafer processing using gaseous antistatic agent during drying phase to control charge build-upAbandonedJul 03, 03Jan 06, 05[B08B]
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