FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.
Patent Owner
Stats
- 57 US PATENTS IN FORCE
- 2 US APPLICATIONS PENDING
- Mar 13, 2018 most recent publication
Details
- 57 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 1,473 Total Citation Count
- Jul 31, 1989 Earliest Filing
- 28 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
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Top Patents (by citation)
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Recent Publications
Publication #
Title
Filing Date
Pub Date
Intl Class
Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
9914902 Stripping compositions for removing photoresists from semiconductor substratesDec 28, 15Mar 13, 18[H01L, G03F, C11D]
9834746 Cleaning formulations for removing residues on surfacesSep 15, 14Dec 05, 17[H01L, G03F, C11D]
9777117 Process for the production of polyimide and polyamic ester polymersMar 06, 17Oct 03, 17[C08J, H01L, B05D, C08G, C09D]
9617386 Process for the production of polyimide and polyamic ester polymersMay 19, 14Apr 11, 17[C08G, C09D, C08K]
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
2012/0048,295 CLEANING FORMULATION FOR REMOVING RESIDUES ON SURFACESAbandonedMar 09, 10Mar 01, 12[C23G, C11D]
2008/0199,805 PHOTOSENSITIVE COMPOSITIONS EMPLOYING SILICON-CONTAINING ADDITIVESAbandonedFeb 08, 08Aug 21, 08[G03F]
2008/0199,814 Device manufacturing process utilizing a double patterning processAbandonedDec 04, 07Aug 21, 08[H01L]
7335319 Semiconductor stress buffer coating edge bead removal compositions and method for their useExpiredFeb 06, 03Feb 26, 08[B01F]
2006/0172,231 Use of an oxidizer to improve trace metals removal from photoresist and photoresist componentsAbandonedFeb 09, 06Aug 03, 06[G03C]
2006/0159,861 Additives to prevent degradation of alkyl-hydrogen siloxanesAbandonedFeb 24, 06Jul 20, 06[C23C, B32B]
7018776 Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systemsExpiredDec 10, 03Mar 28, 06[G03C]
2004/0224,516 Semiconductor stress buffer coating edge bead removal compositions and method for their useAbandonedJun 10, 04Nov 11, 04[H01L]
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