FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
G03F PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR 2381
 
  
 
C11D DETERGENT COMPOSITIONS 1649
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 15347
 
  
 
C09K MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR986
 
  
 
C08G MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS 6114
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 695
 
  
 
C09D COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR 488
 
  
 
C10L FUELS NOT OTHERWISE PROVIDED FOR; NATURAL GAS; SYNTHETIC NATURAL GAS OBTAINED BY PROCESSES NOT COVERED BY SUBCLASSES C10G OR C10K; LIQUEFIED PETROLEUM GAS; USE OF ADDITIVES TO FUELS OR FIRES; FIRE-LIGHTERS 438
 
  
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 432
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 384

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2016/0313,641 PHOTOSENSITIVE POLYIMIDE COMPOSITIONSApr 19, 16Oct 27, 16[H01L, G03F]
2015/0219,990 Novel Polyimide CompositionsJan 28, 15Aug 06, 15[B05D, C08G, C09D, G03F]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9914902 Stripping compositions for removing photoresists from semiconductor substratesDec 28, 15Mar 13, 18[H01L, G03F, C11D]
9834746 Cleaning formulations for removing residues on surfacesSep 15, 14Dec 05, 17[H01L, G03F, C11D]
9777117 Process for the production of polyimide and polyamic ester polymersMar 06, 17Oct 03, 17[C08J, H01L, B05D, C08G, C09D]
9771550 Cleaning formulation for removing residues on surfacesDec 09, 14Sep 26, 17[H01L, C11D]
9695284 Polymer and thermosetting composition containing sameMay 16, 14Jul 04, 17[C08G, C09D, C08K]
9617386 Process for the production of polyimide and polyamic ester polymersMay 19, 14Apr 11, 17[C08G, C09D, C08K]
9562211 Cleaning formulation for removing residues on surfacesDec 03, 14Feb 07, 17[H01L, C11D]
9519216 Positive photosensitive resin compositionsJan 30, 09Dec 13, 16[G03F]
9200372 Passivation composition and processOct 22, 12Dec 01, 15[C23C, H01L, C23F]
9034557 Chemically amplified positive photoresist compositionJun 01, 10May 19, 15[G03F]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2017/0255,100 DRY FILM STRUCTUREAbandonedApr 19, 16Sep 07, 17[H01L, G03F]
2012/0048,295 CLEANING FORMULATION FOR REMOVING RESIDUES ON SURFACESAbandonedMar 09, 10Mar 01, 12[C23G, C11D]
7947637 Cleaning formulation for removing residues on surfacesExpiredJun 28, 07May 24, 11[C11D]
2009/0111,050 Novel Photosensitive Resin CompositionsAbandonedOct 15, 08Apr 30, 09[C08G, G03F]
2009/0004,444 Novel Photosensitive Resin CompositionsAbandonedAug 21, 08Jan 01, 09[G03F]
2008/0305,431 PRETREATMENT COMPOSITIONSAbandonedJun 10, 08Dec 11, 08[H01L, G03F, B32B]
7416830 Photosensitive resin compositionsExpiredFeb 18, 05Aug 26, 08[G03F]
2008/0199,805 PHOTOSENSITIVE COMPOSITIONS EMPLOYING SILICON-CONTAINING ADDITIVESAbandonedFeb 08, 08Aug 21, 08[G03F]
2008/0199,814 Device manufacturing process utilizing a double patterning processAbandonedDec 04, 07Aug 21, 08[H01L]
7407731 Photosensitive resin compositionsExpiredMar 22, 06Aug 05, 08[G03F]
7399572 Pretreatment compositionsExpiredJun 02, 06Jul 15, 08[G03F]
7335319 Semiconductor stress buffer coating edge bead removal compositions and method for their useExpiredFeb 06, 03Feb 26, 08[B01F]
7220520 Photosensitive resin compositionsExpiredJun 02, 06May 22, 07[G03F]
7147798 Aqueous based metal etchantExpiredAug 19, 04Dec 12, 06[C09K]
2006/0240,358 Pretreatment compositionsAbandonedMar 22, 06Oct 26, 06[G03C]
7101652 Photosensitive resin compositionsExpiredMar 09, 04Sep 05, 06[G03F]
2006/0172,231 Use of an oxidizer to improve trace metals removal from photoresist and photoresist componentsAbandonedFeb 09, 06Aug 03, 06[G03C]
2006/0159,861 Additives to prevent degradation of alkyl-hydrogen siloxanesAbandonedFeb 24, 06Jul 20, 06[C23C, B32B]
7018776 Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systemsExpiredDec 10, 03Mar 28, 06[G03C]
2004/0224,516 Semiconductor stress buffer coating edge bead removal compositions and method for their useAbandonedJun 10, 04Nov 11, 04[H01L]

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