GARY C. HONEYCUTT NAVARRO IP LAW GROUP, P.C.

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Intl Class Technology # of Patents Rank
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2255
 
 
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1102

Top Patents (by citation)

Patent # Title Filing Date Issue Date Intl Class Cited #
6,232,662 System and method for bonding over active integrated circuitsJul 02, 99May 15, 01[H01L]64
6,329,722 Bonding pads for integrated circuits having copper interconnect metallizationJul 01, 99Dec 11, 01[H01L, H05K]28

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
6,329,722 Bonding pads for integrated circuits having copper interconnect metallizationJul 01, 99Dec 11, 01[H01L, H05K]
6,232,662 System and method for bonding over active integrated circuitsJul 02, 99May 15, 01[H01L]

Top Inventors for This Owner

Inventor Name Address # of Patent/Pub
Saran Mukul
Richardson, TX
1
Shih Wei-Yan
Plano, TX
1
Subido Willmar
Garland, TX
1
Wilson Arthur
Richardson, TX
1