Gary C. Honeycutt Navarro IP Law Group, P.C.

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Technologies

Intl Class Technology # of Patents/ App Rank in Class
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2318
 
 
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1128

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
6,329,722 Bonding pads for integrated circuits having copper interconnect metallizationJul 01, 99Dec 11, 01[H01L, H05K]
6,232,662 System and method for bonding over active integrated circuitsJul 02, 99May 15, 01[H01L]

Expired/Abandoned/Withdrawn Patents

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