GEM Services, Inc.
Patent Owner
Stats
- 49 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- Oct 15, 2013 most recent publication
Details
- 49 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 586 Total Citation Count
- May 15, 2001 Earliest Filing
- 13 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
Rank in Class
Top Patents (by citation)
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Recent Publications
- No Recent Publications to Display
Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
8358017 Semiconductor package featuring flip-chip die sandwiched between metal layersAug 05, 08Jan 22, 13[H01L]
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
2013/0105,974 SEMICONDUCTOR PACKAGE FEATURING FLIP-CHIP DIE SANDWICHED BETWEEN METAL LAYERSAbandonedDec 17, 12May 02, 13[H01L]
2013/0017,652 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE PACKAGE WITH A HEATSINKAbandonedJan 11, 12Jan 17, 13[H01L]
2013/0009,296 SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPINGAbandonedJan 11, 12Jan 10, 13[H01L]
2013/0009,297 SEMICONDUCTOR DEVICE PACKAGE HAVING CONFIGURABLE LEAD FRAME FINGERSAbandonedJan 11, 12Jan 10, 13[H01L]
2012/0181,677 SEMICONDUCTOR DEVICE PACKAGE WITH TWO COMPONENT LEAD FRAMEAbandonedJan 11, 12Jul 19, 12[H01L]
2011/0291,254 SEMICONDUCTOR DEVICE PACKAGE FEATURING ENCAPSULATED LEADFRAME WITH PROJECTING BUMPS OR BALLSAbandonedAug 09, 11Dec 01, 11[H01L]
2008/0142,936 Semiconductor device package diepad having features formed by electroplatingAbandonedFeb 19, 08Jun 19, 08[H01L]
2008/0135,991 SEMICONDUCTOR DEVICE PACKAGE FEATURING ENCAPSULATED LEADFRAME WITH PROJECTING BUMPS OR BALLSAbandonedDec 12, 06Jun 12, 08[H01L]
2007/0130,759 Semiconductor device package leadframe formed from multiple metal layersAbandonedMay 02, 06Jun 14, 07[H01L]
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