GEM Services, Inc.

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Patent Activity in the Last 10 Years

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Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 14348
 
  
 
1303 EQUIPMENT FOR DISTRIBUTION OR CONTROL OF ELECTRIC POWER467

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8558368 Bi-directional, reverse blocking battery switchOct 31, 11Oct 15, 13[H01L]
8358017 Semiconductor package featuring flip-chip die sandwiched between metal layersAug 05, 08Jan 22, 13[H01L]
8120154 Interconnection of lead frame to die utilizing flip chip processFeb 19, 10Feb 21, 12[H01L]
8106493 Semiconductor device package having features formed by stampingOct 13, 10Jan 31, 12[H01L]
8097945 Bi-directional, reverse blocking battery switchNov 21, 07Jan 17, 12[H01L]
7838339 Semiconductor device package having features formed by stampingAug 14, 08Nov 23, 10[H01L]
7691670 Interconnection of lead frame to die utilizing flip chip processJul 11, 08Apr 06, 10[H01L]
7667309 Space-efficient package for laterally conducting deviceMar 14, 08Feb 23, 10[H01L]
7553700 Chemical-enhanced package singulation processMay 11, 04Jun 30, 09[H01L]
D588557 4040-28J matrix leadframeOct 02, 07Mar 17, 09[1303]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2013/0105,974 SEMICONDUCTOR PACKAGE FEATURING FLIP-CHIP DIE SANDWICHED BETWEEN METAL LAYERSAbandonedDec 17, 12May 02, 13[H01L]
2013/0017,652 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE PACKAGE WITH A HEATSINKAbandonedJan 11, 12Jan 17, 13[H01L]
2013/0009,296 SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPINGAbandonedJan 11, 12Jan 10, 13[H01L]
2013/0009,297 SEMICONDUCTOR DEVICE PACKAGE HAVING CONFIGURABLE LEAD FRAME FINGERSAbandonedJan 11, 12Jan 10, 13[H01L]
2012/0181,676 POWER SEMICONDUCTOR DEVICE PACKAGINGAbandonedJan 11, 12Jul 19, 12[H01L]
2012/0181,677 SEMICONDUCTOR DEVICE PACKAGE WITH TWO COMPONENT LEAD FRAMEAbandonedJan 11, 12Jul 19, 12[H01L]
2011/0291,254 SEMICONDUCTOR DEVICE PACKAGE FEATURING ENCAPSULATED LEADFRAME WITH PROJECTING BUMPS OR BALLSAbandonedAug 09, 11Dec 01, 11[H01L]
2008/0142,936 Semiconductor device package diepad having features formed by electroplatingAbandonedFeb 19, 08Jun 19, 08[H01L]
2008/0135,991 SEMICONDUCTOR DEVICE PACKAGE FEATURING ENCAPSULATED LEADFRAME WITH PROJECTING BUMPS OR BALLSAbandonedDec 12, 06Jun 12, 08[H01L]
2008/0111,219 PACKAGE DESIGNS FOR VERTICAL CONDUCTION DIEAbandonedNov 14, 06May 15, 08[H01L]
2007/0130,759 Semiconductor device package leadframe formed from multiple metal layersAbandonedMay 02, 06Jun 14, 07[H01L]
2007/0007,640 Surface mount packageAbandonedSep 15, 06Jan 11, 07[H01L]
2005/0145,998 Surface mount packageAbandonedFeb 11, 05Jul 07, 05[H01L]

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