HARIMA CHEMICALS, INCORPORATED

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 2271
 
  
 
C22C ALLOYS 864
 
  
 
D21H PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C, D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR 731
 
  
 
C08L COMPOSITIONS OF MACROMOLECULAR COMPOUNDS 6110
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 6150
 
  
 
C08F MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS 5120
 
  
 
C09D COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR 488
 
  
 
C08K USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS 399
 
  
 
H01B CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES 371
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 3359

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0355,043 SOLDER ALLOY, SOLDER PASTE AND ELECTRONIC CIRCUIT BOARDFeb 24, 15Dec 14, 17[B23K, C22C]
2017/0253,683 POLYACRYLAMIDE RESIN, PAPERMAKING ADDITIVE, AND PAPEROct 14, 16Sep 07, 17[C08F]
2017/0205,159 HEAT EXCHANGER TUBE, HEAT EXCHANGER, AND BRAZING PASTEApr 27, 15Jul 20, 17[B23K, F28D, F28F, C22C]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9908959 Polyacrylamide resin, papermaking additive, and paperOct 14, 16Mar 06, 18[C08F]
9815963 Agglomerated silica, rubber composition, tire, producing method of agglomerated silica, and producing method of rubber compositionAug 27, 14Nov 14, 17[C08J, C09C, B60C, C08L, C08K]
9546234 Metal fine particle dispersant, metal fine particle dispersion liquid, and cured filmJan 16, 14Jan 17, 17[C08F, C09D, C08L, C08K]
9445508 Solder alloy, solder paste, and electronic circuit boardJun 25, 13Sep 13, 16[B23K, C22C, H05K]
9303361 Method for producing cationic surface sizing agent, and sizing agent obtained by methodAug 18, 11Apr 05, 16[C09D, D21H]
9233420 Fine metal particles and fine metal oxide particles in dry powder form, and use thereofJan 17, 14Jan 12, 16[B82Y, C04B, C09C, B22F, H05K]
9221129 Solder alloy, solder paste, and electronic circuit boardJun 25, 13Dec 29, 15[B23K, H05K, C22C]
9221132 Solder alloy, solder paste, and electronic circuit boardNov 16, 12Dec 29, 15[B23K, H05K, C22C]
9006296 Metal nanoparticle dispersion usable for ejection in the form of fine droplets to be applied in the layered shapeSep 10, 04Apr 14, 15[B05D, C09D, H01B, B22F, H05K]
8816031 Water-soluble polymer and additive for paper manufactureMar 06, 06Aug 26, 14[C08F]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2014/0083,567 SOLDERING PASTE FLUX AND SOLDERING PASTEAbandonedOct 07, 11Mar 27, 14[B23K]
2014/0053,954 FLUX FOR SOLDERING AND SOLDER PASTE COMPOSITIONAbandonedJul 11, 11Feb 27, 14[B23K]
2014/0023,872 METHOD FOR PRODUCING CATIONIC SURFACE SIZING AGENT, AND SIZING AGENT OBTAINED BY METHODAbandonedAug 18, 11Jan 23, 14[D21H]
2012/0308,792 RED FLUORESCENCE CONVERSION COMPOSITION AND RED FLUORESCENCE CONVERSION FILMAbandonedOct 28, 10Dec 06, 12[C09K, H05B, B32B]
2012/0291,921 FLUX FOR SOLDER PASTE, AND SOLDER PASTEAbandonedDec 06, 10Nov 22, 12[B23K]
2012/0291,922 SOLDER PASTEAbandonedDec 06, 10Nov 22, 12[B23K]
2012/0175,020 LOW SILVER SOLDER ALLOY AND SOLDER PASTE COMPOSITIONAbandonedMay 12, 11Jul 12, 12[B23K, C22C]
2012/0073,741 ADHESIVE COMPOSITIONAbandonedMay 20, 10Mar 29, 12[C09J, B32B]
2010/0270,365 SOLDER PASTE COMPOSITION HAVING SOLDER POWDER, FLUX AND METALLIC POWDERAbandonedJul 07, 10Oct 28, 10[B23K]
2010/0252,144 SOLDERING FLUX AND SOLDER PASTE COMPOSITIONAbandonedNov 25, 08Oct 07, 10[B23K]
2010/0243,717 SOLDERING FLUX, SOLDER PASTE COMPOSITION AND SOLDERING METHODAbandonedNov 25, 08Sep 30, 10[B23K]
2009/0297,882 Brazing filler metal, brazing filler metal paste, and heat exchangerAbandonedMay 29, 09Dec 03, 09[B23K, B22F, B32B]
2009/0162,642 PAPER CONTAINING PREGGREGATED FILLER AND PROCESS FOR PRODUCING THE SAMEAbandonedJan 26, 07Jun 25, 09[D21H, B32B]
7503958 Method of manufacturing the SnZnNiCu solder powder and the SnZnNiCu solder powderExpiredAug 25, 06Mar 17, 09[B22F]
2009/0068,485 Cationic Surface Sizing Agent and Newsprint PaperAbandonedOct 26, 06Mar 12, 09[C08G, B32B]
2009/0029,065 CONDUCTIVE CIRCUIT MANUFACTURING METHODAbandonedFeb 08, 06Jan 29, 09[B05D, B01J]
2008/0160,331 SOLDER PASTE COMPOSITION, SOLDER PRECOATING METHOD AND MOUNTED SUBSTRATEAbandonedFeb 27, 08Jul 03, 08[B23K, B22F]
2008/0053,571 Soldering flux and solder paste compositionAbandonedSep 05, 07Mar 06, 08[B23K]
2008/0053,572 Soldering flux and solder paste compositionAbandonedSep 05, 07Mar 06, 08[B23K]
2006/0286,301 Substrates and method of manufacturing sameAbandonedSep 10, 04Dec 21, 06[B05D]

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