HARVATEK CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 55307
 
  
 
F21V FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR 1298
 
  
 
H01J ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS 7121
 
  
 
1303 EQUIPMENT FOR DISTRIBUTION OR CONTROL OF ELECTRIC POWER665
 
  
 
G09G ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION 5146
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 4152
 
  
 
F21S NON-PORTABLE LIGHTING DEVICES OR SYSTEMS THEREOF 353
 
  
 
F21K LIGHT SOURCES NOT OTHERWISE PROVIDED FOR238
 
  
 
G08B SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS 292
 
  
 
H01S DEVICES USING STIMULATED EMISSION290

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0033,928 LIGHT EMITTING DIODE ASSEMBLY STRUCTUREMar 28, 17Feb 01, 18[H01L]
2017/0088,964 SYSTEM AND METHOD FOR RECOVERING METAL FROM METAL-CONTAINING WASTE LIQUIDApr 15, 16Mar 30, 17[C22B, C25C]
2005/0264,173 White light emitting diode light source and method for manufacturing the sameMay 28, 04Dec 01, 05[H05B]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9921359 Light source moduleFeb 17, 17Mar 20, 18[F21V]
9887179 Light emitting diode device and light emitting device using the sameMar 26, 15Feb 06, 18[F21V, H01L, F21Y, F21K]
9799810 Light emitting deviceMar 30, 17Oct 24, 17[H01L]
9685428 Display device and light-emitting array module thereofFeb 26, 16Jun 20, 17[H01L]
9563076 Display panel and composite display panel using the sameDec 07, 15Feb 07, 17[H05B, G02F]
9224718 White light emitting diodes package containing plural blue light-emitting diodesNov 11, 13Dec 29, 15[H01L, F21Y]
9074043 Compound for carrier transport, element and electronic device using the sameAug 17, 12Jul 07, 15[H01L, C08G]
8748209 Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making the sameJun 01, 11Jun 10, 14[H01L]
8623680 LED chip package structure using sedimentation and method for making the sameSep 14, 11Jan 07, 14[H01L]
8555492 Method for manufacturing a conductive substrate structure with conductive channels formed by using a two-sided cut approachDec 28, 11Oct 15, 13[H05K]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2015/0282,265 Display StructureAbandonedMar 27, 15Oct 01, 15[H05B]
2015/0060,902 PACKAGE OF LIGHT EMITTING DIODE CHIPSAbandonedJun 10, 14Mar 05, 15[H01L]
2012/0119,231 LED PACKAGE STRUCTURE WITH A DEPOSITED-TYPE PHOSPHOR LAYER AND METHOD FOR MAKING THE SAMEAbandonedJul 13, 11May 17, 12[H01L]
2012/0122,254 WHITE LIGHT-EMITTING DIODE PACKAGE STRUCTURE FOR SIMPLIFYING PACKAGE PROCESS AND METHOD FOR MAKING THE SAMEAbandonedDec 21, 11May 17, 12[H01L]
2012/0106,171 LED PACKAGE STRUCTUREAbandonedJul 06, 11May 03, 12[F21V]
2012/0094,407 WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND HEAT-DISSIPATING EFFECT AND METHOD FOR MANUFACTURING THE SAMEAbandonedDec 16, 11Apr 19, 12[H01L]
2012/0049,212 LED CHIP PACKAGE STRUCTURE WITH A HIGH-EFFICIENCY HEAT-DISSIPATING SUBSTRATE AND METHOD FOR MAKING THE SAMEAbandonedNov 09, 11Mar 01, 12[H01L]
2012/0037,937 LED PACKAGE STRUCTURE AND METHOD OF MAKING THE SAMEAbandonedJan 10, 11Feb 16, 12[H01L]
2012/0009,699 WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASE LIGHT-EMITTING EFFICIENCY AND METHOD FOR MAKING THE SAMEAbandonedSep 21, 11Jan 12, 12[H01L]
2012/0009,700 METHOD OF MANUFACTURING A LED CHIP PACKAGE STRUCTUREAbandonedSep 21, 11Jan 12, 12[H01L]
2012/0001,203 LED CHIP PACKAGE STRUCTUREAbandonedSep 19, 11Jan 05, 12[H01L]
2011/0304,020 WAFER LEVEL DIODE PACKAGE STRUCTUREAbandonedAug 25, 11Dec 15, 11[H01L]
2011/0215,357 LED PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAMEAbandonedJan 11, 11Sep 08, 11[H01L]
2011/0189,803 LED CHIP PACKAGE STRUCTURE IN ORDER TO PREVENT THE LIGHT-EMITTING EFFICIENCY OF FLUORESCENT POWDER FROM DECREASING DUE TO HIGH TEMPERATURE AND METHOD FOR MAKING THE SAMEAbandonedApr 15, 11Aug 04, 11[H01L]
2011/0156,060 Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereofAbandonedJul 28, 10Jun 30, 11[H01L]
2011/0156,061 Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereofAbandonedJul 28, 10Jun 30, 11[H01L]
2011/0156,083 Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereofAbandonedJul 28, 10Jun 30, 11[H01L, H05K]
2011/0157,868 Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereofAbandonedJul 28, 10Jun 30, 11[F21V, G02F, F21S]
2011/0147,774 WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND HEAT-DISSIPATING EFFECT AND METHOD FOR MANUFACTURING THE SAMEAbandonedApr 13, 10Jun 23, 11[H01L]
2011/0018,018 SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING ELECTRICAL CONNECTION WITHOUT USING WIRE-BONDING PROCESS AND METHOD FOR MAKING THE SAMEAbandonedDec 29, 09Jan 27, 11[H01L]

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