HARVATEK CORPORATION
Patent Owner
Stats
- 98 US PATENTS IN FORCE
- 3 US APPLICATIONS PENDING
- Mar 20, 2018 most recent publication
Details
- 98 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 1,627 Total Citation Count
- Jul 31, 1997 Earliest Filing
- 75 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
Rank in Class
Top Patents (by citation)
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Recent Publications
Publication #
Title
Filing Date
Pub Date
Intl Class
2017/0088,964 SYSTEM AND METHOD FOR RECOVERING METAL FROM METAL-CONTAINING WASTE LIQUIDApr 15, 16Mar 30, 17[C22B, C25C]
2005/0264,173 White light emitting diode light source and method for manufacturing the sameMay 28, 04Dec 01, 05[H05B]
Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
9887179 Light emitting diode device and light emitting device using the sameMar 26, 15Feb 06, 18[F21V, H01L, F21Y, F21K]
9224718 White light emitting diodes package containing plural blue light-emitting diodesNov 11, 13Dec 29, 15[H01L, F21Y]
9074043 Compound for carrier transport, element and electronic device using the sameAug 17, 12Jul 07, 15[H01L, C08G]
8748209 Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making the sameJun 01, 11Jun 10, 14[H01L]
8623680 LED chip package structure using sedimentation and method for making the sameSep 14, 11Jan 07, 14[H01L]
8555492 Method for manufacturing a conductive substrate structure with conductive channels formed by using a two-sided cut approachDec 28, 11Oct 15, 13[H05K]
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
2012/0119,231 LED PACKAGE STRUCTURE WITH A DEPOSITED-TYPE PHOSPHOR LAYER AND METHOD FOR MAKING THE SAMEAbandonedJul 13, 11May 17, 12[H01L]
2012/0122,254 WHITE LIGHT-EMITTING DIODE PACKAGE STRUCTURE FOR SIMPLIFYING PACKAGE PROCESS AND METHOD FOR MAKING THE SAMEAbandonedDec 21, 11May 17, 12[H01L]
2012/0094,407 WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND HEAT-DISSIPATING EFFECT AND METHOD FOR MANUFACTURING THE SAMEAbandonedDec 16, 11Apr 19, 12[H01L]
2012/0049,212 LED CHIP PACKAGE STRUCTURE WITH A HIGH-EFFICIENCY HEAT-DISSIPATING SUBSTRATE AND METHOD FOR MAKING THE SAMEAbandonedNov 09, 11Mar 01, 12[H01L]
2012/0037,937 LED PACKAGE STRUCTURE AND METHOD OF MAKING THE SAMEAbandonedJan 10, 11Feb 16, 12[H01L]
2012/0009,699 WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASE LIGHT-EMITTING EFFICIENCY AND METHOD FOR MAKING THE SAMEAbandonedSep 21, 11Jan 12, 12[H01L]
2012/0009,700 METHOD OF MANUFACTURING A LED CHIP PACKAGE STRUCTUREAbandonedSep 21, 11Jan 12, 12[H01L]
2011/0215,357 LED PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAMEAbandonedJan 11, 11Sep 08, 11[H01L]
2011/0189,803 LED CHIP PACKAGE STRUCTURE IN ORDER TO PREVENT THE LIGHT-EMITTING EFFICIENCY OF FLUORESCENT POWDER FROM DECREASING DUE TO HIGH TEMPERATURE AND METHOD FOR MAKING THE SAMEAbandonedApr 15, 11Aug 04, 11[H01L]
2011/0156,060 Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereofAbandonedJul 28, 10Jun 30, 11[H01L]
2011/0156,061 Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereofAbandonedJul 28, 10Jun 30, 11[H01L]
2011/0156,083 Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereofAbandonedJul 28, 10Jun 30, 11[H01L, H05K]
2011/0157,868 Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereofAbandonedJul 28, 10Jun 30, 11[F21V, G02F, F21S]
2011/0147,774 WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND HEAT-DISSIPATING EFFECT AND METHOD FOR MANUFACTURING THE SAMEAbandonedApr 13, 10Jun 23, 11[H01L]
2011/0018,018 SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING ELECTRICAL CONNECTION WITHOUT USING WIRE-BONDING PROCESS AND METHOD FOR MAKING THE SAMEAbandonedDec 29, 09Jan 27, 11[H01L]
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