HIGH CONNECTION DENSITY, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 16114
 
 
 
G11C STATIC STORES 4140
 
 
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 4145
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2337
 
 
 
B26D CUTTING; DETAILS COMMON TO MACHINES FOR SEVERING, e.g. BY CUTTING, PERFORATING, PUNCHING, STAMPING-OUT 132
 
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 1152
 
 
 
G06F ELECTRIC DIGITAL DATA PROCESSING 1423

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
6968354 Tamper-resistant modular multiplication methodAug 24, 01Nov 22, 05[G06F]
6846184 Low inductance electrical contacts and LGA connector systemJan 24, 03Jan 25, 05[H01R]
6742426 Precision cutter for elastomeric cableJun 01, 01Jun 01, 04[B26D]
6722893 Test and burn-in connectorDec 02, 02Apr 20, 04[H01R]
6723927 High-reliability interposer for low cost and high reliability applicationsMay 29, 01Apr 20, 04[H01R, H05K]
6712620 Coaxial elastomeric connector systemSep 12, 02Mar 30, 04[H01R]
6712621 Thermally enhanced interposer and methodJan 23, 02Mar 30, 04[H01R, H05R]
6705877 Stackable memory module with variable bandwidthJan 17, 03Mar 16, 04[H01R]
6663399 Surface mount attachable land grid array connector and method of forming sameJan 29, 02Dec 16, 03[H01R]
6659778 Contact assembly for land grid array interposer or electrical connectorAug 01, 02Dec 09, 03[H01R]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2004/0049,914 Method for making a coaxial electrical contactABANAug 05, 03Mar 18, 04[H01R, B23P]
2003/0068,920 HIGH DENSITY, HIGH FREQUENCY MEMORY CHIP MODULES HAVING THERMAL MANAGEMENT STRUCTURESABANDec 14, 99Apr 10, 03[H01R]
6449166 High capacity memory module with higher density and improved manufacturabilityExpiredAug 24, 00Sep 10, 02[H05K]
2002/0098,721 Shielded carrier for land grid array connectors and a process for fabricating sameABANFeb 12, 02Jul 25, 02[H05K]

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