HIGH CONNECTION DENSITY, INC.
Patent Owner
Stats
- 28 total patents issued
- 12 Total Apps Published
- Nov 22, 2005 most recent publication
Details
- 28 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 665 Total Citation Count
- Dec 09, 1999 Earliest Filing
- 1 Expired/Abandoned/Withdrawn Patents
Technologies
Intl Class
Technology
# of Patents
Rank
Top Patents (by citation)
Patent #
Title
Filing Date
Issue Date
Intl Class
Cited #
6,264,476 Wire segment based interposer for high frequency electrical connectionDec 09, 99Jul 24, 01[H01R]92
6,172,895 High capacity memory module with built-in-high-speed bus terminationsDec 14, 99Jan 09, 01[G11C]51
6,545,895 High capacity SDRAM memory module with stacked printed circuit boardsApr 22, 02Apr 08, 03[G11C]47
6,439,894 Contact assembly for land grid array interposer or electrical connectorJan 31, 01Aug 27, 02[H01R, H05K]33
6,663,399 Surface mount attachable land grid array connector and method of forming sameJan 29, 02Dec 16, 03[H01R]26
Recent Publications
Publication #
Title
Filing Date
Pub Date
Intl Class
2003/0156,443 HIGH CAPACITY MEMORY MODULE WITH BUILT-IN PERFORMANCE ENHANCING FEATURESFeb 19, 02Aug 21, 03[G11C]
2003/0068,920 HIGH DENSITY, HIGH FREQUENCY MEMORY CHIP MODULES HAVING THERMAL MANAGEMENT STRUCTURESDec 14, 99Apr 10, 03[H01R]
2002/0102,868 Contact assembly for land grid array interposer or electrical connectorJan 31, 01Aug 01, 02[H05K]
Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
6,723,927 High-reliability interposer for low cost and high reliability applicationsMay 29, 01Apr 20, 04[H01R, H05K]
6,663,399 Surface mount attachable land grid array connector and method of forming sameJan 29, 02Dec 16, 03[H01R]
6,659,778 Contact assembly for land grid array interposer or electrical connectorAug 01, 02Dec 09, 03[H01R]
Top Inventors for This Owner
Inventor Name
Address
# of Patent/Pub
