High Connection Density, Inc.
Patent Owner
Stats
- 26 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- Nov 22, 2005 most recent publication
Details
- 26 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 1,067 Total Citation Count
- Dec 09, 1999 Earliest Filing
- 5 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
Rank in Class
Top Patents (by citation)
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Recent Publications
- No Recent Publications to Display
Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
6723927 High-reliability interposer for low cost and high reliability applicationsMay 29, 01Apr 20, 04[H01R, H05K]
6663399 Surface mount attachable land grid array connector and method of forming sameJan 29, 02Dec 16, 03[H01R]
6659778 Contact assembly for land grid array interposer or electrical connectorAug 01, 02Dec 09, 03[H01R]
6661690 High capacity memory module with built-in performance enhancing featuresFeb 19, 02Dec 09, 03[G11C]
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
2004/0049,914 Method for making a coaxial electrical contactAbandonedAug 05, 03Mar 18, 04[B23P, H01R]
2003/0068,920 HIGH DENSITY, HIGH FREQUENCY MEMORY CHIP MODULES HAVING THERMAL MANAGEMENT STRUCTURESAbandonedDec 14, 99Apr 10, 03[H01R]
6449166 High capacity memory module with higher density and improved manufacturabilityExpiredAug 24, 00Sep 10, 02[H05K]
2002/0098,721 Shielded carrier for land grid array connectors and a process for fabricating sameAbandonedFeb 12, 02Jul 25, 02[H05K]
Top Inventors for This Owner
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