Hybond, Inc.

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
4884223 Dynamic force measurement systemExpiredMar 22, 88Nov 28, 89[G01M, B25J, G01F]
4857133 Method and apparatus for bonding with consistent uniform bond thicknessExpiredMay 20, 88Aug 15, 89[B23K]

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