INTEGRATED PROCESS EQUIPMENT CORP.
Patent Owner
Stats
- 17 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- May 22, 2001 most recent publication
Details
- 17 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 1,716 Total Citation Count
- Oct 19, 1990 Earliest Filing
- 25 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
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Top Patents (by citation)
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Recent Publications
- No Recent Publications to Display
Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
6234883 Method and apparatus for concurrent pad conditioning and wafer buff in chemical mechanical polishingOct 01, 97May 22, 01[B24B]
5543919 Apparatus and method for performing high spatial resolution thin film layer thickness metrologySep 20, 94Aug 06, 96[G01B]
5502564 Substrate thickness measurement using oblique incidence multispectral interferometrySep 13, 94Mar 26, 96[G01B]
5452953 Film thickness measurement of structures containing a scattering surfaceOct 12, 93Sep 26, 95[G01B]
5436725 Cofocal optical system for thickness measurements of patterned wafersOct 12, 93Jul 25, 95[G01B]
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
5855792 Rinse water recycling method for semiconductor wafer processing equipmentExpiredMay 14, 97Jan 05, 99[C02F]
5835226 Method for determining optical constants prior to film processing to be used improve accuracy of post-processing thickness measurementsExpiredNov 13, 97Nov 10, 98[G01B]
5610102 Method for co-registering semiconductor wafers undergoing work in one or more blind process modulesExpiredNov 15, 93Mar 11, 97[H01L]
5563709 Apparatus for measuring, thinning and flattening silicon structuresExpiredSep 13, 94Oct 08, 96[G01B]
5555472 Method and apparatus for measuring film thickness in multilayer thin film stack by comparison to a reference library of theoretical signaturesExpiredDec 22, 93Sep 10, 96[G01B]
5376224 Method and apparatus for non-contact plasma polishing and smoothing of uniformly thinned substratesExpiredFeb 27, 92Dec 27, 94[H01L, B44C]
5375064 Method and apparatus for moving a material removal tool with low tool accelerationsExpiredDec 02, 93Dec 20, 94[G06F]
5372674 Electrode for use in a plasma assisted chemical etching processExpiredJan 28, 94Dec 13, 94[H01L, B44C]
5364496 Highly durable noncontaminating surround materials for plasma etchingExpiredAug 20, 93Nov 15, 94[H01L, B44C]
5365031 Apparatus and method for shielding a workpiece holding mechanism from depreciative effects during workpiece processingExpiredMar 23, 92Nov 15, 94[B23K]
5352249 Apparatus for providing consistent, non-jamming registration of semiconductor wafersExpiredAug 28, 92Oct 04, 94[B23Q]
5336355 Methods and apparatus for confinement of a plasma etch region for precision shaping of surfaces of substances and filmsExpiredDec 13, 91Aug 09, 94[H01L]
5337150 Apparatus and method for performing thin film layer thickness metrology using a correlation reflectometerExpiredAug 04, 92Aug 09, 94[G01B]
5298103 Electrode assembly useful in confined plasma assisted chemical etchingExpiredJul 15, 93Mar 29, 94[H01L, B44C]
5292400 Method and apparatus for producing variable spatial frequency control in plasma assisted chemical etchingExpiredMar 23, 92Mar 08, 94[H01L, C03C, B44C]
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