INTEGRATED PROCESS EQUIPMENT CORP.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
G01B MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS1188
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 3359
 
  
 
B44C PRODUCING DECORATIVE EFFECTS 232
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 192
 
  
 
B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 165
 
  
 
C03C CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS159

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
6234883 Method and apparatus for concurrent pad conditioning and wafer buff in chemical mechanical polishingOct 01, 97May 22, 01[B24B]
5567255 Solid annular gas discharge electrodeOct 13, 94Oct 22, 96[H01L]
5555474 Automatic rejection of diffraction effects in thin film metrologyDec 21, 94Sep 10, 96[G01B]
5543919 Apparatus and method for performing high spatial resolution thin film layer thickness metrologySep 20, 94Aug 06, 96[G01B]
5515167 Transparent optical chuck incorporating optical monitoringSep 13, 94May 07, 96[G01B]
5502564 Substrate thickness measurement using oblique incidence multispectral interferometrySep 13, 94Mar 26, 96[G01B]
5452953 Film thickness measurement of structures containing a scattering surfaceOct 12, 93Sep 26, 95[G01B]
5436725 Cofocal optical system for thickness measurements of patterned wafersOct 12, 93Jul 25, 95[G01B]
5419803 Method of planarizing microstructuresNov 17, 93May 30, 95[C03C, B44C]
5386119 Apparatus and method for thick wafer measurementMar 25, 93Jan 31, 95[G01B]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
5855792 Rinse water recycling method for semiconductor wafer processing equipmentExpiredMay 14, 97Jan 05, 99[C02F]
5835226 Method for determining optical constants prior to film processing to be used improve accuracy of post-processing thickness measurementsExpiredNov 13, 97Nov 10, 98[G01B]
5755614 Rinse water recycling in CMP apparatusExpiredMar 17, 97May 26, 98[B24B]
5688415 Localized plasma assisted chemical etching through a maskExpiredMay 30, 95Nov 18, 97[B23K]
5610102 Method for co-registering semiconductor wafers undergoing work in one or more blind process modulesExpiredNov 15, 93Mar 11, 97[H01L]
5563709 Apparatus for measuring, thinning and flattening silicon structuresExpiredSep 13, 94Oct 08, 96[G01B]
5555472 Method and apparatus for measuring film thickness in multilayer thin film stack by comparison to a reference library of theoretical signaturesExpiredDec 22, 93Sep 10, 96[G01B]
5474647 Wafer flow architecture for production wafer processingExpiredNov 15, 93Dec 12, 95[H01L]
5391252 Plasma pressure control assemblyExpiredJun 02, 94Feb 21, 95[C23F]
5376224 Method and apparatus for non-contact plasma polishing and smoothing of uniformly thinned substratesExpiredFeb 27, 92Dec 27, 94[H01L, B44C]
5375064 Method and apparatus for moving a material removal tool with low tool accelerationsExpiredDec 02, 93Dec 20, 94[G06F]
5372674 Electrode for use in a plasma assisted chemical etching processExpiredJan 28, 94Dec 13, 94[H01L, B44C]
5364496 Highly durable noncontaminating surround materials for plasma etchingExpiredAug 20, 93Nov 15, 94[H01L, B44C]
5365031 Apparatus and method for shielding a workpiece holding mechanism from depreciative effects during workpiece processingExpiredMar 23, 92Nov 15, 94[B23K]
5362150 Fluid mixerExpiredDec 08, 92Nov 08, 94[B01F]
5352249 Apparatus for providing consistent, non-jamming registration of semiconductor wafersExpiredAug 28, 92Oct 04, 94[B23Q]
5336355 Methods and apparatus for confinement of a plasma etch region for precision shaping of surfaces of substances and filmsExpiredDec 13, 91Aug 09, 94[H01L]
5337150 Apparatus and method for performing thin film layer thickness metrology using a correlation reflectometerExpiredAug 04, 92Aug 09, 94[G01B]
5298103 Electrode assembly useful in confined plasma assisted chemical etchingExpiredJul 15, 93Mar 29, 94[H01L, B44C]
5292400 Method and apparatus for producing variable spatial frequency control in plasma assisted chemical etchingExpiredMar 23, 92Mar 08, 94[H01L, C03C, B44C]

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