INTERNATIONAL RECTIFIER CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 53892
 
  
 
G05F SYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES 13421
 
  
 
H02M APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF 7141
 
  
 
H03K PULSE TECHNIQUE 6174
 
  
 
H05B ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR 5957
 
  
 
H02H EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS 3743
 
  
 
H02P CONTROL OR REGULATION OF ELECTRIC MOTORS, GENERATORS, OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS 3552
 
  
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 17142
 
  
 
H03F AMPLIFIERS 1370
 
  
 
G05B CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS 1190

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9331005 Power semiconductor package with multi-section conductive carrierAug 13, 15May 03, 16[H01L]
9299793 Semiconductor device with a field plate trench having a thick bottom dielectricMay 01, 14Mar 29, 16[H01L]
9295124 System using shunt circuits to selectively bypass open loadsJul 30, 10Mar 22, 16[H05B]
9281306 Multi-transistor exposed conductive clip for semiconductor packagesDec 27, 12Mar 08, 16[H01L]
9281388 Composite semiconductor device with a SOI substrate having an integrated diodeJul 09, 12Mar 08, 16[H01L]
9269655 Method for fabricating a semiconductor package with conductive carrier integrated heat spreaderAug 13, 15Feb 23, 16[H01L]
9263439 III-nitride switching device with an emulated diodeMay 24, 10Feb 16, 16[H03K, H01L]
9257983 Level shifter utilizing a capacitive isolation barrierOct 30, 14Feb 09, 16[H03L, H03K]
9252256 III-nitride semiconductor device with reduced electric fieldJul 15, 14Feb 02, 16[H01L]
9252257 III-nitride semiconductor device with reduced electric field between gate and drainJul 16, 14Feb 02, 16[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2014/0264,373 III-Nitride Heterojunction DeviceAbandonedMay 29, 14Sep 18, 14[H01L]
2014/0210,768 Single Layer Touch SensorAbandonedJul 09, 13Jul 31, 14[G06F]
2013/0015,501 Nested Composite DiodeAbandonedJul 05, 12Jan 17, 13[H01L]
2012/0175,688 Semiconductor Package with Reduced On-Resistance and Top Metal Spreading Resistance with Application to Power Transistor PackagingAbandonedJul 20, 11Jul 12, 12[H01L]
7721443 Method for producing a vehicle axleExpiredSep 23, 03May 25, 10[B21D]
7656096 Hybrid ballast control circuit in a simplified packageExpiredApr 30, 04Feb 02, 10[H05B]
7633230 Dimmable fluorescent lamp packageExpiredApr 18, 07Dec 15, 09[H01J, H05B]
7615873 Solder flow stops for semiconductor die substratesExpiredApr 21, 05Nov 10, 09[H01L]
7602015 Process to control semiconductor wafer yieldExpiredAug 15, 06Oct 13, 09[H01L]
2009/0251,119 Three chip packageAbandonedAug 13, 08Oct 08, 09[H01L, G05F]
2008/0298,455 CLOCK GENERATOR INCLUDING A RING OSCILLATOR WITH PRECISE FREQUENCY CONTROLAbandonedDec 17, 07Dec 04, 08[H04L]
2008/0261,209 Electrophoretic Separation Method for Analyzing Gene ExpressionAbandonedSep 30, 05Oct 23, 08[C12Q]
2008/0230,867 Method of forming ohmic contact to a semiconductor bodyAbandonedApr 29, 08Sep 25, 08[H01L]
2008/0224,677 DEAD TIME TRIMMING IN A CO-PACKAGE DEVICEAbandonedMar 13, 08Sep 18, 08[G05F]
2008/0190,958 CONTAINER HAVING A SECONDARY RESERVOIR FOR METERED DOSING OF ADDITIVESAbandonedFeb 08, 08Aug 14, 08[B65D, B67D]
2008/0054,971 PULSE WIDTH MODULATION CONTROL CIRCUITAbandonedJul 06, 07Mar 06, 08[H03K]
2008/0054,984 HIGH VOLTAGE GATE DRIVER IC WITH RAMP DRIVERAbandonedJul 20, 07Mar 06, 08[H03K, G05F]
2008/0042,710 SELF-OSCILLATING DRIVER WITH SOFT START CIRCUITAbandonedOct 23, 07Feb 21, 08[H03K]
2007/0264,519 Copper-pillar plugs for semiconductor dieAbandonedMar 13, 07Nov 15, 07[H01L]
2007/0257,343 DIE-ON-LEADFRAME (DOL) WITH HIGH VOLTAGE ISOLATIONAbandonedMay 03, 07Nov 08, 07[H01L]

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