INVENSAS BONDING TECHNOLOGIES, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 60302
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM4153
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 291

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0301,656 HETEROGENEOUS ANNEALING METHOD AND DEVICEJun 30, 17Oct 19, 17[H01L]
2017/0179,029 INCREASED CONTACT ALIGNMENT TOLERANCE FOR DIRECT BONDINGDec 15, 16Jun 22, 17[H01L]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9852988 Increased contact alignment tolerance for direct bondingDec 15, 16Dec 26, 17[H01L]
9716033 3D IC method and deviceJul 30, 15Jul 25, 17[H01L]
9698126 Heterogeneous annealing method and deviceOct 09, 15Jul 04, 17[H01L]
9564414 Three dimensional device integration method and integrated deviceJun 22, 15Feb 07, 17[H01L]
9431368 Three dimensional device integration method and integrated deviceMar 08, 16Aug 30, 16[H01L]
9391143 Method for low temperature bonding and bonded structureDec 02, 15Jul 12, 16[H01L]
9385024 Room temperature metal direct bondingSep 02, 14Jul 05, 16[H01L, B23K]
9331149 Method for low temperature bonding and bonded structureJun 29, 15May 03, 16[H01L]
9184125 Heterogeneous annealing method and deviceOct 28, 13Nov 10, 15[H01L]
9171756 3D IC method and deviceMar 06, 14Oct 27, 15[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2006/0292,744 Three dimensional device integration method and integrated deviceAbandonedSep 01, 06Dec 28, 06[H01L]

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