INVENSAS CORPORATION

Patent Owner

Compare Create Portfolio
10Status Updates

Stats

Details

Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 42687
 
 
 
G11C STATIC STORES 8470
 
 
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 6473
 
 
 
G06F ELECTRIC DIGITAL DATA PROCESSING 34357
 
 
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 2059
 
 
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 1227
 
 
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 11104
 
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 9139
 
 
 
H01K ELECTRIC INCANDESCENT LAMPS 717
 
 
 
H03K PULSE TECHNIQUE 6116

Top Patents (by citation)

Upgrade to the Premium Level to View Top Patents for this Owner. Learn More

Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2015/0076,714 MICROELECTRONIC ELEMENT WITH BOND ELEMENTS TO ENCAPSULATION SURFACESep 16, 13Mar 19, 15[H01L]
2015/0069,639 Substrate-Less Stackable Package With Wire-Bond InterconnectSep 15, 14Mar 12, 15[H01L]
2015/0056,753 Semiconductor Die Having Fine Pitch Electrical InterconnectsSep 08, 14Feb 26, 15[H01L]
2015/0041,208 MICRO MECHANICAL ANCHOR FOR 3D ARCHITECTUREAug 07, 13Feb 12, 15[H01L, H05K]
2015/0041,988 ULTRA HIGH PERFORMANCE INTERPOSERAug 08, 13Feb 12, 15[H01L]
2015/0043,190 EMBEDDED PACKAGING WITH PREFORMED VIASAug 07, 13Feb 12, 15[H01L, H05K]
2015/0044,820 METHOD OF FABRICATING LOW CTE INTERPOSER WITHOUT TSV STRUCTUREOct 27, 14Feb 12, 15[H01L]
2015/0044,823 MICROELECTRONIC PACKAGE WITH INTEGRATED BEARING SURFACESAug 08, 13Feb 12, 15[H01L]
2015/0034,371 STRUCTURE FOR MICROELECTRONIC PACKAGING WITH BOND ELEMENTS TO ENCAPSULATION SURFACEOct 17, 14Feb 05, 15[H05K]
2015/0014,688 Thin Wafer Handling and Known Good Die Test MethodSep 29, 14Jan 15, 15[H01L]

View all Publication..

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8,978,247 TSV fabrication using a removable handling structureMay 22, 12Mar 17, 15[H01K, H01L]
8,980,693 Stackable microelectronic package structuresMar 18, 14Mar 17, 15[B81C, H01L]
8,981,547 Stub minimization for multi-die wirebond assemblies with parallel windowsApr 03, 14Mar 17, 15[G06F, H01L]
8,981,564 Metal PVD-free conducting structuresMay 20, 13Mar 17, 15[H01L]
8,975,616 Quantum efficiency of multiple quantum wellsJul 03, 12Mar 10, 15[H01S, H01L]
8,975,738 Structure for microelectronic packaging with terminals on dielectric massNov 12, 12Mar 10, 15[H01L]
8,970,028 Embedded heat spreader for package with multiple microelectronic elements and face-down connectionDec 29, 11Mar 03, 15[H01L]
8,963,335 Tunable composite interposerSep 13, 12Feb 24, 15[H01L]
8,951,845 Methods of fabricating a flip chip package for dram with two underfill materialsJan 24, 14Feb 10, 15[H01L]
8,945,987 Manufacture of face-down microelectronic packagesMar 15, 13Feb 03, 15[H01L]

View all patents..

Expired/Abandoned/Withdrawn Patents

Patent # Title Filing Date Issue/Pub Date Intl Class
2013/0247,372 MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICEMay 17, 13Sep 26, 13[H05K]
2013/0186,944 MICROELECTRONIC SUBSTRATE OR ELEMENT HAVING CONDUCTIVE PADS AND METAL POSTS JOINED THERETO USING BOND LAYERMar 12, 13Jul 25, 13[H01L]
2013/0119,117 BONDING WEDGENov 02, 12May 16, 13[H01L]
2013/0070,437 HYBRID INTERPOSERSep 20, 11Mar 21, 13[H01R, H05K]
2013/0068,516 HIGH IO SUBSTRATES AND INTERPOSERS WITHOUT VIASSep 19, 11Mar 21, 13[H05K]
2013/0037,312 HIGH DENSITY TRACE FORMATION METHOD BY LASER ABLATIONAug 10, 11Feb 14, 13[B05D, B32B, H05K]
2011/0197,655 MULTI-LAYERED CERAMIC MICRO-GAS CHROMATOGRAPH AND METHOD FOR MAKING THE SAMEDec 07, 10Aug 18, 11[G01N]
7,856,444 Performing a search using a search parameterDec 27, 04Dec 21, 10[G06F]
7,843,046 Flat leadless packages and stacked leadless package assembliesAug 27, 08Nov 30, 10[H01L]
2010/0242,270 Wiring circuit board, manufacturing method for the wiring circuit board, and circuit moduleFeb 16, 10Sep 30, 10[H01K]
2010/0071,944 CHIP CAPACITOR EMBEDDED PWBDec 17, 07Mar 25, 10[H05K]
2009/0106,488 STATIC RANDOM ACCESS MEMORY (SRAM) COMPATIBLE, HIGH AVAILABILITY MEMORY ARRAY AND METHOD EMPLOYING SYNCHRONOUS DYNAMIC RANDOM ACCESS MEMORY (DRAM) IN CONJUNCTION WITH A DATA CACHE AND SEPARATE READ AND WRITE REGISTERS AND TAG BLOCKSOct 20, 08Apr 23, 09[G06F]
2009/0071,707 Multilayer substrate with interconnection vias and method of manufacturing the sameAug 13, 08Mar 19, 09[H05K, C25D]
2008/0296,254 Multilayer wiring board for an electronic deviceJan 11, 08Dec 04, 08[C23F]
2008/0264,678 Member for Interconnecting Wiring Films and Method for Producing the SameSep 06, 05Oct 30, 08[H05K]
2008/0169,568 Structure and method of making interconnect element having metal traces embedded in surface of dielectricAug 29, 07Jul 17, 08[H01L]
2008/0136,041 Structure and method of making interconnect element having metal traces embedded in surface of dielectricMay 23, 07Jun 12, 08[H01L]
2008/0128,288 Method of manufacturing a multi-layer wiring board using a metal member having a rough surfaceJun 08, 07Jun 05, 08[C25D]
2007/0221,329 Apparatus and method for distributing a liquid onto a surface of an itemOct 23, 06Sep 27, 07[B44C, H01L]
2007/0069,377 CLOCK DISTRIBUTION NETWORKS AND CONDUCTIVE LINES IN SEMICONDUCTOR INTEGRATED CIRCUITSNov 14, 06Mar 29, 07[H01L]

View all patents..

Top Inventors for This Owner

Upgrade to the Premium Level to View Top Inventors for this Owner. Learn More

We are sorry but your current selection exceeds the maximum number of comparisons () for this membership level. Upgrade to our Level for up to -1 comparisons!

We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.