INVENSAS CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 52485
 
 
 
G11C STATIC STORES 9770
 
 
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 7376
 
 
 
G06F ELECTRIC DIGITAL DATA PROCESSING 36380
 
 
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 2458
 
 
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 1136
 
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 10141
 
 
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 10120
 
 
 
H03K PULSE TECHNIQUE 7117
 
 
 
H01K ELECTRIC INCANDESCENT LAMPS 617

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2016/0172,268 Bond Via Array for Thermal ConductivityDec 11, 14Jun 16, 16[H01L]
2016/0172,319 COMPACT SEMICONDUCTOR PACKAGE AND RELATED METHODSFeb 08, 16Jun 16, 16[H01L]
2016/0172,332 MEMORY MODULE IN A PACKAGEFeb 22, 16Jun 16, 16[H01L]
2016/0172,402 IMAGE SENSOR DEVICENov 18, 15Jun 16, 16[H01L]
2016/0163,639 Substrate-less Stackable Package with Wire-Bond InterconnectFeb 11, 16Jun 09, 16[H01L]
2016/0163,650 INTEGRATED CIRCUIT ASSEMBLIES WITH RIGID LAYERS USED FOR PROTECTION AGAINST MECHANICAL THINNING AND FOR OTHER PURPOSES, AND METHODS OF FABRICATING SUCH ASSEMBLIESMay 05, 15Jun 09, 16[H01L]
2016/0163,679 MICROELECTRONIC ASSEMBLIES HAVING STACK TERMINALS COUPLED BY CONNECTORS EXTENDING THROUGH ENCAPSULATIONJan 14, 16Jun 09, 16[H01L]
2016/0155,695 INTERPOSERS WITH CIRCUIT MODULES ENCAPSULATED BY MOLDABLE MATERIAL IN A CAVITY, AND METHODS OF FABRICATIONJan 25, 16Jun 02, 16[H01L]
2016/0133,600 MICROELECTRONIC ASSEMBLIES WITH INTEGRATED CIRCUITS AND INTERPOSERS WITH CAVITIES, AND METHODS OF MANUFACTUREDec 28, 15May 12, 16[H01L]
2016/0126,174 SUBSTRATES AND METHODS OF MANUFACTURENov 05, 14May 05, 16[H01L]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9,373,565 Stub minimization for assemblies without wirebonds to package substrateDec 16, 13Jun 21, 16[G11C, H01L]
9,373,585 Polymer member based interconnectSep 17, 14Jun 21, 16[H01L]
9,365,947 Method for preparing low cost substratesOct 04, 13Jun 14, 16[C25F, H01L, H05K]
9,368,477 Co-support circuit panel and microelectronic packagesMar 15, 13Jun 14, 16[G11C, H01L, H05K]
9,368,478 Microelectronic package and method of manufacture thereofJan 15, 15Jun 14, 16[H01L]
9,368,479 Thermal vias disposed in a substrate proximate to a well thereofMar 07, 14Jun 14, 16[H01L]
9,362,204 Tunable composite interposerFeb 23, 15Jun 07, 16[H01L]
9,355,905 Methods and structure for carrier-less thin wafer handlingMay 27, 15May 31, 16[H01L]
9,355,996 Microelectronic package with consolidated chip structuresAug 27, 15May 31, 16[H01L]
9,355,997 Integrated circuit assemblies with reinforcement frames, and methods of manufactureMay 27, 14May 31, 16[H01L]
9,356,006 Batch process fabrication of package-on-package microelectronic assembliesNov 30, 15May 31, 16[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
9,117,827 Making electrical components in handle wafers of integrated circuit packagesWithdrawnMay 02, 14Aug 25, 15[H01L]
2014/0008,676 OPTICAL ENHANCEMENT OF LIGHT EMITTING DEVICESABANJul 03, 12Jan 09, 14[H01L]
2013/0247,372 MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICEABANMay 17, 13Sep 26, 13[H05K]
2013/0186,944 MICROELECTRONIC SUBSTRATE OR ELEMENT HAVING CONDUCTIVE PADS AND METAL POSTS JOINED THERETO USING BOND LAYERABANMar 12, 13Jul 25, 13[H01L]
2013/0119,012 INTERCONNECTION ELEMENT FOR ELECTRIC CIRCUITSABANOct 26, 12May 16, 13[H01R]
2013/0119,117 BONDING WEDGEABANNov 02, 12May 16, 13[H01L]
2013/0070,437 HYBRID INTERPOSERABANSep 20, 11Mar 21, 13[H01R, H05K]
2013/0068,516 HIGH IO SUBSTRATES AND INTERPOSERS WITHOUT VIASABANSep 19, 11Mar 21, 13[H05K]
2013/0037,312 HIGH DENSITY TRACE FORMATION METHOD BY LASER ABLATIONABANAug 10, 11Feb 14, 13[B05D, B32B, H05K]
8,119,516 Bump structure formed from using removable mandrelExpiredNov 04, 08Feb 21, 12[H01L]
8,112,881 Method for manufacturing multilayer wiring boardExpiredSep 29, 05Feb 14, 12[H05K]
2011/0197,655 MULTI-LAYERED CERAMIC MICRO-GAS CHROMATOGRAPH AND METHOD FOR MAKING THE SAMEABANDec 07, 10Aug 18, 11[G01N]
7,856,444 Performing a search using a search parameterExpiredDec 27, 04Dec 21, 10[G06F]
7,843,046 Flat leadless packages and stacked leadless package assembliesExpiredAug 27, 08Nov 30, 10[H01L]
2010/0242,270 Wiring circuit board, manufacturing method for the wiring circuit board, and circuit moduleABANFeb 16, 10Sep 30, 10[H01K]
2010/0071,944 CHIP CAPACITOR EMBEDDED PWBABANDec 17, 07Mar 25, 10[H05K]
2010/0044,860 Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layerABANJul 30, 09Feb 25, 10[H01L]
2009/0106,488 STATIC RANDOM ACCESS MEMORY (SRAM) COMPATIBLE, HIGH AVAILABILITY MEMORY ARRAY AND METHOD EMPLOYING SYNCHRONOUS DYNAMIC RANDOM ACCESS MEMORY (DRAM) IN CONJUNCTION WITH A DATA CACHE AND SEPARATE READ AND WRITE REGISTERS AND TAG BLOCKSABANOct 20, 08Apr 23, 09[G06F]
2009/0071,707 Multilayer substrate with interconnection vias and method of manufacturing the sameABANAug 13, 08Mar 19, 09[H05K, C25D]
2008/0296,254 Multilayer wiring board for an electronic deviceABANJan 11, 08Dec 04, 08[C23F]

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