INVENSAS CORPORATION

Patent Owner

Follow Compare Add to Portfolio 7Status Updates

Stats

Details

Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 53580
 
 
 
G11C STATIC STORES 9869
 
 
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 7475
 
 
 
G06F ELECTRIC DIGITAL DATA PROCESSING 36371
 
 
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 2462
 
 
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 1133
 
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 10143
 
 
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 10116
 
 
 
H03K PULSE TECHNIQUE 7119
 
 
 
H01K ELECTRIC INCANDESCENT LAMPS 616

Top Patents (by citation)

Upgrade to the Premium Level to View Top Patents for this Owner. Learn More

Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2016/0233,193 MULTI-DIE WIREBOND PACKAGES WITH ELONGATED WINDOWSApr 18, 16Aug 11, 16[H01L]
2016/0225,739 OFF SUBSTRATE KINKING OF BOND WIREApr 12, 16Aug 04, 16[B23K, H01L]
2016/0218,057 INTERPOSERS AND FABRICATION METHODS THAT USE NANOPARTICLE INKS AND MAGNETIC FIELDSJan 22, 15Jul 28, 16[H01L, H05K]
2016/0218,088 SUPPORT MOUNTED ELECTRICALLY INTERCONNECTED DIE ASSEMBLYMar 31, 16Jul 28, 16[H01L]
2016/0204,091 INVERTED OPTICAL DEVICEMar 21, 16Jul 14, 16[H01L]
2016/0197,026 Thermal vias disposed in a substrate without a liner layerMar 10, 16Jul 07, 16[H01L]
2016/0189,765 Retention optimized memory device using predictive data inversionMar 09, 16Jun 30, 16[G11C]
2016/0190,100 STUB MINIMIZATION USING DUPLICATE SETS OF SIGNAL TERMINALS IN ASSEMBLIES WITHOUT WIREBONDS TO PACKAGE SUBSTRATEMar 03, 16Jun 30, 16[H01L]
2016/0192,496 CONTACT STRUCTURES WITH POROUS NETWORKS FOR SOLDER CONNECTIONS, AND METHODS OF FABRICATING SAMENov 16, 15Jun 30, 16[H05K]
2016/0172,268 Bond Via Array for Thermal ConductivityDec 11, 14Jun 16, 16[H01L]

View all Publication..

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9,412,646 Via in substrate with deposited layerJan 26, 15Aug 09, 16[H01L]
9,412,714 Wire bond support structure and microelectronic package including wire bonds therefromMay 30, 14Aug 09, 16[H01L]
9,412,806 Making multilayer 3D capacitors using arrays of upstanding rods or ridgesJun 13, 14Aug 09, 16[H01L]
9,401,288 Low CTE interposerJul 10, 14Jul 26, 16[H01L, H05K]
9,402,312 Circuit assemblies with multiple interposer substrates, and methods of fabricationMay 12, 14Jul 26, 16[H01L, H05K]
9,397,038 Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substratesFeb 27, 15Jul 19, 16[H01L]
9,397,051 Warpage reduction in structures with electrical circuitryDec 03, 13Jul 19, 16[H01L]
9,398,700 Method of forming a reliable microelectronic assemblyJun 21, 13Jul 19, 16[H01L, H05K]
9,390,998 Heat spreading substrateFeb 17, 12Jul 12, 16[H01L]
9,391,008 Reconstituted wafer-level package DRAMJul 31, 12Jul 12, 16[H01L]

View all patents..

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
9,117,827 Making electrical components in handle wafers of integrated circuit packagesWithdrawnMay 02, 14Aug 25, 15[H01L]
2014/0008,676 OPTICAL ENHANCEMENT OF LIGHT EMITTING DEVICESABANJul 03, 12Jan 09, 14[H01L]
2013/0247,372 MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICEABANMay 17, 13Sep 26, 13[H05K]
2013/0186,944 MICROELECTRONIC SUBSTRATE OR ELEMENT HAVING CONDUCTIVE PADS AND METAL POSTS JOINED THERETO USING BOND LAYERABANMar 12, 13Jul 25, 13[H01L]
2013/0119,012 INTERCONNECTION ELEMENT FOR ELECTRIC CIRCUITSABANOct 26, 12May 16, 13[H01R]
2013/0119,117 BONDING WEDGEABANNov 02, 12May 16, 13[H01L]
2013/0070,437 HYBRID INTERPOSERABANSep 20, 11Mar 21, 13[H01R, H05K]
2013/0068,516 HIGH IO SUBSTRATES AND INTERPOSERS WITHOUT VIASABANSep 19, 11Mar 21, 13[H05K]
2013/0037,312 HIGH DENSITY TRACE FORMATION METHOD BY LASER ABLATIONABANAug 10, 11Feb 14, 13[B05D, B32B, H05K]
8,119,516 Bump structure formed from using removable mandrelExpiredNov 04, 08Feb 21, 12[H01L]
8,112,881 Method for manufacturing multilayer wiring boardExpiredSep 29, 05Feb 14, 12[H05K]
2011/0197,655 MULTI-LAYERED CERAMIC MICRO-GAS CHROMATOGRAPH AND METHOD FOR MAKING THE SAMEABANDec 07, 10Aug 18, 11[G01N]
7,856,444 Performing a search using a search parameterExpiredDec 27, 04Dec 21, 10[G06F]
7,843,046 Flat leadless packages and stacked leadless package assembliesExpiredAug 27, 08Nov 30, 10[H01L]
2010/0242,270 Wiring circuit board, manufacturing method for the wiring circuit board, and circuit moduleABANFeb 16, 10Sep 30, 10[H01K]
2010/0071,944 CHIP CAPACITOR EMBEDDED PWBABANDec 17, 07Mar 25, 10[H05K]
2010/0044,860 Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layerABANJul 30, 09Feb 25, 10[H01L]
2009/0106,488 STATIC RANDOM ACCESS MEMORY (SRAM) COMPATIBLE, HIGH AVAILABILITY MEMORY ARRAY AND METHOD EMPLOYING SYNCHRONOUS DYNAMIC RANDOM ACCESS MEMORY (DRAM) IN CONJUNCTION WITH A DATA CACHE AND SEPARATE READ AND WRITE REGISTERS AND TAG BLOCKSABANOct 20, 08Apr 23, 09[G06F]
2009/0071,707 Multilayer substrate with interconnection vias and method of manufacturing the sameABANAug 13, 08Mar 19, 09[H05K, C25D]
2008/0296,254 Multilayer wiring board for an electronic deviceABANJan 11, 08Dec 04, 08[C23F]

View all patents..

Top Inventors for This Owner

Upgrade to the Premium Level to View Top Inventors for this Owner. Learn More

We are sorry but your current selection exceeds the maximum number of comparisons () for this membership level. Upgrade to our Level for up to -1 comparisons!

We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.