INVENSAS CORPORATION

Patent Owner

Compare Create Portfolio
6Status Updates

Stats

Details

Technologies

Intl Class Technology # of Patents/ App Rank in Class
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 38391
 
 
 
G11C STATIC STORES 8272
 
 
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 5875
 
 
 
G06F ELECTRIC DIGITAL DATA PROCESSING 34349
 
 
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 2357
 
 
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 13107
 
 
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 1131
 
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 8133
 
 
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 688
 
 
 
H01K ELECTRIC INCANDESCENT LAMPS 618

Top Patents (by citation)

Upgrade to the Premium Level to View Top Patents for this Owner. Learn More

Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2014/0217,587 Wafer Leveled Chip Packaging Structure and Method ThereofNov 18, 13Aug 07, 14[H01L]
2014/0217,619 MICROELECTRONIC PACKAGE HAVING WIRE BOND VIAS AND STIFFENING LAYERFeb 01, 13Aug 07, 14[H01L]
2014/0212,996 MICROELECTRONIC PACKAGE WITH STACKED MICROELECTRONIC UNITS AND METHOD FOR MANUFACTURE THEREOFApr 03, 14Jul 31, 14[H01L]
2014/0213,020 SEMICONDUCTOR DIE MOUNT BY CONFORMAL DIE COATINGApr 01, 14Jul 31, 14[H01L]
2014/0203,440 MICROELECTRONIC PACKAGE AND METHOD OF MANUFACTURE THEREOFJan 22, 13Jul 24, 14[H01L]
2014/0199,811 STACKABLE MICROELECTRONIC PACKAGE STRUCTURESMar 18, 14Jul 17, 14[B81C]
2014/0185,354 STUB MINIMIZATION USING DUPLICATE SETS OF SIGNAL TERMINALSMar 06, 14Jul 03, 14[G11C]
2014/0175,440 NON-CRYSTALLINE INORGANIC LIGHT EMITTING DIODEDec 21, 12Jun 26, 14[H01L]
2014/0175,654 SURFACE MODIFIED TSV STRUCTURE AND METHODS THEREOFDec 20, 12Jun 26, 14[H01L]
2014/0175,671 STRUCTURE FOR MICROELECTRONIC PACKAGING WITH BOND ELEMENTS TO ENCAPSULATION SURFACEDec 20, 12Jun 26, 14[H01L, H05K]

View all Publication..

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8,790,996 Method of processing a device substrateJul 16, 12Jul 29, 14[H01L]
8,785,790 High strength through-substrate viasNov 10, 11Jul 22, 14[H01K, H05K]
8,785,961 Heat spreading substrateFeb 17, 12Jul 22, 14[H01L]
8,786,069 Reconfigurable popMay 21, 13Jul 22, 14[H01L]
8,787,034 Co-support system and microelectronic assemblyMar 15, 13Jul 22, 14[H05K]
8,780,576 Low CTE interposerSep 14, 11Jul 15, 14[H05K]
8,772,152 Method for package-on-package assembly with wire bonds to encapsulation surfaceJan 29, 13Jul 08, 14[B23K, H01L]
8,772,946 Reduced stress TSV and interposer structuresJun 08, 12Jul 08, 14[H01L]
8,757,897 Optical interposerJan 31, 12Jun 24, 14[G02B]
8,742,602 Vertical electrical interconnect formed on support prior to die mountMar 12, 08Jun 03, 14[H01L]

View all patents..

Expired/Abandoned/Withdrawn Patents

Patent # Title Filing Date Issue/Pub Date Intl Class
2013/0119,117 BONDING WEDGENov 02, 12May 16, 13[H01L]
2011/0197,655 MULTI-LAYERED CERAMIC MICRO-GAS CHROMATOGRAPH AND METHOD FOR MAKING THE SAMEDec 07, 10Aug 18, 11[G01N]
2010/0242,270 Wiring circuit board, manufacturing method for the wiring circuit board, and circuit moduleFeb 16, 10Sep 30, 10[H01K]
2010/0071,944 CHIP CAPACITOR EMBEDDED PWBDec 17, 07Mar 25, 10[H05K]
2009/0106,488 STATIC RANDOM ACCESS MEMORY (SRAM) COMPATIBLE, HIGH AVAILABILITY MEMORY ARRAY AND METHOD EMPLOYING SYNCHRONOUS DYNAMIC RANDOM ACCESS MEMORY (DRAM) IN CONJUNCTION WITH A DATA CACHE AND SEPARATE READ AND WRITE REGISTERS AND TAG BLOCKSOct 20, 08Apr 23, 09[G06F]
2009/0071,707 Multilayer substrate with interconnection vias and method of manufacturing the sameAug 13, 08Mar 19, 09[H05K, C25D]
2008/0296,254 Multilayer wiring board for an electronic deviceJan 11, 08Dec 04, 08[C23F]
2008/0264,678 Member for Interconnecting Wiring Films and Method for Producing the SameSep 06, 05Oct 30, 08[H05K]
2008/0169,568 Structure and method of making interconnect element having metal traces embedded in surface of dielectricAug 29, 07Jul 17, 08[H01L]
2008/0136,041 Structure and method of making interconnect element having metal traces embedded in surface of dielectricMay 23, 07Jun 12, 08[H01L]
2008/0128,288 Method of manufacturing a multi-layer wiring board using a metal member having a rough surfaceJun 08, 07Jun 05, 08[C25D]
2007/0221,329 Apparatus and method for distributing a liquid onto a surface of an itemOct 23, 06Sep 27, 07[B44C, H01L]
2007/0069,377 CLOCK DISTRIBUTION NETWORKS AND CONDUCTIVE LINES IN SEMICONDUCTOR INTEGRATED CIRCUITSNov 14, 06Mar 29, 07[H01L]
7,144,056 Detection and handling of semiconductor wafers and wafers-like objectsMar 25, 03Dec 05, 06[B25J]
2006/0076,661 Attachment of integrated circuit structures and other substrates to substrates with viasOct 19, 05Apr 13, 06[H01L]
7,027,894 Article holders with sensors detecting a type of article held by the holderSep 09, 03Apr 11, 06[G05B]
2005/0224,256 Interlayer member used for producing multilayer wiring board and method of producing the sameMar 22, 05Oct 13, 05[H01L, H05K]
2005/0212,127 Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavitiesMay 24, 05Sep 29, 05[H01L]
2005/0170,647 Electroplating and electroless plating of conductive materials into openings, and structures obtained therebyFeb 10, 05Aug 04, 05[H01L]
2005/0097,727 Multi-layer wiring board, method for producing multi-layer wiring board, polishing machine for multi-layer wiring board, and metal sheet for producing wiring boardJun 26, 03May 12, 05[H01R, B23P]

View all patents..

Top Inventors for This Owner

Upgrade to the Premium Level to View Top Inventors for this Owner. Learn More

We are sorry but your current selection exceeds the maximum number of comparisons () for this membership level. Upgrade to our Level for up to -1 comparisons!

We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.