INVENSAS CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 43287
 
 
 
G11C STATIC STORES 8470
 
 
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 6675
 
 
 
G06F ELECTRIC DIGITAL DATA PROCESSING 34359
 
 
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 1959
 
 
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 12106
 
 
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 1132
 
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 9135
 
 
 
H01K ELECTRIC INCANDESCENT LAMPS 717
 
 
 
H03K PULSE TECHNIQUE 6112

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2015/0129,646 OFF SUBSTRATE KINKING OF BOND WIRENov 12, 13May 14, 15[H01L]
2015/0129,647 SEVERING BOND WIRE BY KINKING AND TWISTINGJun 06, 14May 14, 15[H01L]
2015/0129,876 NON-CRYSTALLINE INORGANIC LIGHT EMITTING DIODEJan 26, 15May 14, 15[H01L]
2015/0132,894 Heat spreading substrate with embedded interconnectsJan 20, 15May 14, 15[H01L]
2015/0123,293 MICROELECTRONIC PACKAGE AND METHOD OF MANUFACTURE THEREOFJan 15, 15May 07, 15[H01L]
2015/0115,434 EMBEDDED HEAT SPREADER FOR PACKAGE WITH MULTIPLE MICROELECTRONIC ELEMENTS AND FACE-DOWN CONNECTIONDec 30, 14Apr 30, 15[H01L]
2015/0115,472 CO-SUPPORT FOR XFD PACKAGINGOct 25, 13Apr 30, 15[H01L]
2015/0101,858 CAVITIES CONTAINING MULTI-WIRING STRUCTURES AND DEVICESDec 17, 14Apr 16, 15[H01R, H05K]
2015/0096,790 METHOD FOR PREPARING LOW COST SUBSTRATESOct 04, 13Apr 09, 15[C25F, H05K]
2015/0096,798 Interconnections for a substrate associated with a backside revealOct 09, 13Apr 09, 15[H05K]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9,030,017 Z-connection using electroless platingNov 13, 12May 12, 15[H01L]
9,023,691 Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulationJul 15, 13May 05, 15[H01L]
9,024,205 Advanced device assembly structures and methodsDec 03, 12May 05, 15[H01L, H05K]
9,018,094 Substrates with through vias with conductive features for connection to integrated circuit elements, and methods for forming through vias in substratesMar 07, 11Apr 28, 15[H01L, H05K]
9,007,866 Retention optimized memory device using predictive data inversionApr 23, 13Apr 14, 15[G11C]
9,000,600 Reduced stress TSV and interposer structuresMar 11, 14Apr 07, 15[H01L]
8,994,170 Microelectronic unit and package with positional reversalFeb 27, 13Mar 31, 15[H01L]
8,978,247 TSV fabrication using a removable handling structureMay 22, 12Mar 17, 15[H01K, H01L]
8,980,693 Stackable microelectronic package structuresMar 18, 14Mar 17, 15[B81C, H01L]
8,981,547 Stub minimization for multi-die wirebond assemblies with parallel windowsApr 03, 14Mar 17, 15[G06F, H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2013/0247,372 MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICEABANMay 17, 13Sep 26, 13[H05K]
2013/0186,944 MICROELECTRONIC SUBSTRATE OR ELEMENT HAVING CONDUCTIVE PADS AND METAL POSTS JOINED THERETO USING BOND LAYERABANMar 12, 13Jul 25, 13[H01L]
2013/0119,117 BONDING WEDGEABANNov 02, 12May 16, 13[H01L]
2013/0070,437 HYBRID INTERPOSERABANSep 20, 11Mar 21, 13[H01R, H05K]
2013/0068,516 HIGH IO SUBSTRATES AND INTERPOSERS WITHOUT VIASABANSep 19, 11Mar 21, 13[H05K]
2013/0037,312 HIGH DENSITY TRACE FORMATION METHOD BY LASER ABLATIONABANAug 10, 11Feb 14, 13[B05D, B32B, H05K]
2011/0197,655 MULTI-LAYERED CERAMIC MICRO-GAS CHROMATOGRAPH AND METHOD FOR MAKING THE SAMEABANDec 07, 10Aug 18, 11[G01N]
7,856,444 Performing a search using a search parameterExpiredDec 27, 04Dec 21, 10[G06F]
7,843,046 Flat leadless packages and stacked leadless package assembliesExpiredAug 27, 08Nov 30, 10[H01L]
2010/0242,270 Wiring circuit board, manufacturing method for the wiring circuit board, and circuit moduleABANFeb 16, 10Sep 30, 10[H01K]
2010/0071,944 CHIP CAPACITOR EMBEDDED PWBABANDec 17, 07Mar 25, 10[H05K]
2010/0044,860 Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layerABANJul 30, 09Feb 25, 10[H01L]
2009/0106,488 STATIC RANDOM ACCESS MEMORY (SRAM) COMPATIBLE, HIGH AVAILABILITY MEMORY ARRAY AND METHOD EMPLOYING SYNCHRONOUS DYNAMIC RANDOM ACCESS MEMORY (DRAM) IN CONJUNCTION WITH A DATA CACHE AND SEPARATE READ AND WRITE REGISTERS AND TAG BLOCKSABANOct 20, 08Apr 23, 09[G06F]
2009/0071,707 Multilayer substrate with interconnection vias and method of manufacturing the sameABANAug 13, 08Mar 19, 09[H05K, C25D]
2008/0296,254 Multilayer wiring board for an electronic deviceABANJan 11, 08Dec 04, 08[C23F]
2008/0264,678 Member for Interconnecting Wiring Films and Method for Producing the SameABANSep 06, 05Oct 30, 08[H05K]
2008/0169,568 Structure and method of making interconnect element having metal traces embedded in surface of dielectricABANAug 29, 07Jul 17, 08[H01L]
2008/0136,041 Structure and method of making interconnect element having metal traces embedded in surface of dielectricABANMay 23, 07Jun 12, 08[H01L]
2008/0128,288 Method of manufacturing a multi-layer wiring board using a metal member having a rough surfaceABANJun 08, 07Jun 05, 08[C25D]
2007/0221,329 Apparatus and method for distributing a liquid onto a surface of an itemABANOct 23, 06Sep 27, 07[B44C, H01L]

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