INVENSAS CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 63973
 
 
 
G11C STATIC STORES 11465
 
 
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 8676
 
 
 
G06F ELECTRIC DIGITAL DATA PROCESSING 40397
 
 
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 2367
 
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 12148
 
 
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 11124
 
 
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 1040
 
 
 
B81C PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS 724
 
 
 
H03K PULSE TECHNIQUE 7118

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0301,577 METHODS OF FORMING 3-D CIRCUITS WITH INTEGRATED PASSIVE DEVICESMay 30, 17Oct 19, 17[H01L]
2017/0294,321 Carrier-Less Silicon Interposer Using Photo Patterned Polymer as SubstrateJun 19, 17Oct 12, 17[H01L]
2017/0294,410 MICROELECTRONIC PACKAGES HAVING STACKED DIE AND WIRE BOND INTERCONNECTSApr 11, 16Oct 12, 17[H01L]
2017/0278,787 MICROELECTRONIC COMPONENTS WITH FEATURES WRAPPING AROUND PROTRUSIONS OF CONDUCTIVE VIAS PROTRUDING FROM THROUGH-HOLES PASSING THROUGH SUBSTRATESJun 09, 17Sep 28, 17[H01L]
2017/0256,492 ULTRA HIGH PERFORMANCE INTERPOSERMay 22, 17Sep 07, 17[H01L]
2017/0256,519 STUB MINIMIZATION FOR WIREBOND ASSEMBLIES WITHOUT WINDOWSMay 19, 17Sep 07, 17[H01L]
2017/0250,140 High Performance Compliant SubstrateMay 11, 17Aug 31, 17[H01L, H05K]
2017/0250,161 Correction Die for Wafer/Die StackFeb 29, 16Aug 31, 17[H01L]
2017/0243,761 LOW CTE COMPONENT WITH WIRE BOND INTERCONNECTSMay 05, 17Aug 24, 17[H01L]
2017/0236,794 Multichip modules and methods of fabricationMay 02, 17Aug 17, 17[H01L]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9793198 Conductive connections, structures with such connections, and methods of manufactureMay 12, 14Oct 17, 17[B23K, B32B, H01L]
9778984 Enhanced memory reliability in stacked memory devicesNov 01, 16Oct 03, 17[G11C, G06F, H03M]
9780042 Tunable composite interposerJun 02, 16Oct 03, 17[H01L]
9773723 SSI PoPDec 03, 15Sep 26, 17[H01L]
9769923 InterposersDec 15, 16Sep 19, 17[H01L, H05K]
9754866 Reversed build-up substrate for 2.5DAug 26, 16Sep 05, 17[H01L]
9741620 Structures and methods for reliable packagesJun 24, 15Aug 22, 17[H01L]
9741649 Integrated interposer solutions for 2D and 3D IC packagingDec 30, 14Aug 22, 17[H01L]
9741696 Thermal vias disposed in a substrate proximate to a well thereofJun 06, 16Aug 22, 17[H01L]
9735084 Bond via array for thermal conductivityDec 11, 14Aug 15, 17[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
9496242 Stackable microelectronic package structuresWithdrawnMar 16, 15Nov 15, 16[B81C, H01L]
2016/0260,671 MICROELECTRONIC PACKAGE WITH CONSOLIDATED CHIP STRUCTURESABANMay 17, 16Sep 08, 16[H01L]
9418879 Low cost interposer and method of fabricationWithdrawnMar 14, 13Aug 16, 16[H01L]
2015/0371,938 BACK-END-OF-LINE STACK FOR A STACKED DEVICEABANJun 19, 14Dec 24, 15[H01L]
2015/0295,151 HIGH PERFORMANCE LIGHT EMITTING DIODE WITH VIASABANAug 23, 14Oct 15, 15[H01L]
2015/0262,902 INTEGRATED CIRCUITS PROTECTED BY SUBSTRATES WITH CAVITIES, AND METHODS OF MANUFACTUREABANMar 14, 14Sep 17, 15[H01L]
2015/0263,252 OPTICAL ENHANCEMENT OF LIGHT EMITTING DEVICESABANJun 01, 15Sep 17, 15[H01L]
9117827 Making electrical components in handle wafers of integrated circuit packagesWithdrawnMay 02, 14Aug 25, 15[H01L]
2015/0171,027 HIGH YIELD SUBSTRATE ASSEMBLYABANAug 23, 14Jun 18, 15[H01L]
2015/0076,714 MICROELECTRONIC ELEMENT WITH BOND ELEMENTS TO ENCAPSULATION SURFACEABANSep 16, 13Mar 19, 15[H01L]
2015/0056,753 Semiconductor Die Having Fine Pitch Electrical InterconnectsABANSep 08, 14Feb 26, 15[H01L]
2014/0008,676 OPTICAL ENHANCEMENT OF LIGHT EMITTING DEVICESABANJul 03, 12Jan 09, 14[H01L]
2013/0247,372 MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICEABANMay 17, 13Sep 26, 13[H05K]
2013/0186,944 MICROELECTRONIC SUBSTRATE OR ELEMENT HAVING CONDUCTIVE PADS AND METAL POSTS JOINED THERETO USING BOND LAYERABANMar 12, 13Jul 25, 13[H01L]
2013/0119,012 INTERCONNECTION ELEMENT FOR ELECTRIC CIRCUITSABANOct 26, 12May 16, 13[H01R]
2013/0119,117 BONDING WEDGEABANNov 02, 12May 16, 13[H01L]
8405196 Chips having rear contacts connected by through vias to front contactsExpiredFeb 26, 08Mar 26, 13[H01L]
2013/0070,437 HYBRID INTERPOSERABANSep 20, 11Mar 21, 13[H01R, H05K]
2013/0068,516 HIGH IO SUBSTRATES AND INTERPOSERS WITHOUT VIASABANSep 19, 11Mar 21, 13[H05K]
2013/0037,312 HIGH DENSITY TRACE FORMATION METHOD BY LASER ABLATIONABANAug 10, 11Feb 14, 13[B05D, B32B, H05K]

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