INVENSAS CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 65070
 
 
 
G11C STATIC STORES 11666
 
 
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 9171
 
 
 
G06F ELECTRIC DIGITAL DATA PROCESSING 40401
 
 
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 2368
 
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 12151
 
 
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 1136
 
 
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 11123
 
 
 
H03K PULSE TECHNIQUE 8124
 
 
 
B81C PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS 725

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0372,994 POROUS ALUMINA TEMPLATES FOR ELECTRONIC PACKAGESSep 11, 17Dec 28, 17[H01L]
2017/0373,033 DEFORMABLE CONDUCTIVE CONTACTSJun 28, 16Dec 28, 17[H01L]
2017/0374,734 STACKED TRANSMISSION LINEJun 24, 16Dec 28, 17[H03H, H01L, H05K, H01P]
2017/0374,738 Interposers And Fabrication Methods That Use Nanoparticle Inks And Magnetic FieldsAug 21, 17Dec 28, 17[H01L, H05K]
2017/0365,546 METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERSJun 19, 17Dec 21, 17[H01L]
2017/0323,667 TFD I/O Partition for High-Speed, High-Density ApplicationsMay 15, 17Nov 09, 17[G11C, H01L]
2017/0323,867 Nanoscale Interconnect Array for Stacked DiesMay 05, 16Nov 09, 17[H01L]
2017/0317,019 INTEGRATED INTERPOSER SOLUTIONS FOR 2D AND 3D IC PACKAGINGJul 17, 17Nov 02, 17[H01L]
2017/0309,518 Structures and Methods for Reliable PackagesJul 13, 17Oct 26, 17[H01L]
2017/0310,322 On-Chip Impedance Network with Digital Coarse and Analog Fine TuningJul 10, 17Oct 26, 17[H01C, H03F, G11C, H03K]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9865548 Polymer member based interconnectMay 19, 16Jan 09, 18[H01L]
9865675 Making multilayer 3D capacitors using arrays of upstanding rods or ridgesJul 12, 16Jan 09, 18[H01L]
9856135 Microelectronic interconnect element with decreased conductor spacingDec 15, 16Jan 02, 18[B81C, B81B, H01L, C25D]
9859234 Methods and structures to repair device warpageAug 06, 15Jan 02, 18[H01L]
9859257 Flipped die stacks with multiple rows of leadframe interconnectsNov 22, 16Jan 02, 18[H01L]
9852969 Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnectsJun 23, 16Dec 26, 17[H01L]
9852994 Embedded vialess bridgesNov 17, 16Dec 26, 17[H01L, H05K]
9853000 Warpage reduction in structures with electrical circuitryJun 14, 16Dec 26, 17[H01L]
9853004 Interconnections for a substrate associated with a backside revealOct 18, 16Dec 26, 17[H01L]
9847238 Fan-out wafer-level packaging using metal foil laminationFeb 27, 17Dec 19, 17[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
9496242 Stackable microelectronic package structuresWithdrawnMar 16, 15Nov 15, 16[B81C, H01L]
2016/0260,671 MICROELECTRONIC PACKAGE WITH CONSOLIDATED CHIP STRUCTURESABANMay 17, 16Sep 08, 16[H01L]
9418879 Low cost interposer and method of fabricationWithdrawnMar 14, 13Aug 16, 16[H01L]
2016/0218,088 SUPPORT MOUNTED ELECTRICALLY INTERCONNECTED DIE ASSEMBLYABANMar 31, 16Jul 28, 16[H01L]
2015/0371,938 BACK-END-OF-LINE STACK FOR A STACKED DEVICEABANJun 19, 14Dec 24, 15[H01L]
2015/0295,151 HIGH PERFORMANCE LIGHT EMITTING DIODE WITH VIASABANAug 23, 14Oct 15, 15[H01L]
2015/0262,902 INTEGRATED CIRCUITS PROTECTED BY SUBSTRATES WITH CAVITIES, AND METHODS OF MANUFACTUREABANMar 14, 14Sep 17, 15[H01L]
2015/0263,252 OPTICAL ENHANCEMENT OF LIGHT EMITTING DEVICESABANJun 01, 15Sep 17, 15[H01L]
9117827 Making electrical components in handle wafers of integrated circuit packagesWithdrawnMay 02, 14Aug 25, 15[H01L]
2015/0171,027 HIGH YIELD SUBSTRATE ASSEMBLYABANAug 23, 14Jun 18, 15[H01L]
2015/0076,714 MICROELECTRONIC ELEMENT WITH BOND ELEMENTS TO ENCAPSULATION SURFACEABANSep 16, 13Mar 19, 15[H01L]
2015/0056,753 Semiconductor Die Having Fine Pitch Electrical InterconnectsABANSep 08, 14Feb 26, 15[H01L]
2014/0008,676 OPTICAL ENHANCEMENT OF LIGHT EMITTING DEVICESABANJul 03, 12Jan 09, 14[H01L]
2013/0247,372 MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICEABANMay 17, 13Sep 26, 13[H05K]
2013/0186,944 MICROELECTRONIC SUBSTRATE OR ELEMENT HAVING CONDUCTIVE PADS AND METAL POSTS JOINED THERETO USING BOND LAYERABANMar 12, 13Jul 25, 13[H01L]
2013/0119,012 INTERCONNECTION ELEMENT FOR ELECTRIC CIRCUITSABANOct 26, 12May 16, 13[H01R]
2013/0119,117 BONDING WEDGEABANNov 02, 12May 16, 13[H01L]
8405196 Chips having rear contacts connected by through vias to front contactsExpiredFeb 26, 08Mar 26, 13[H01L]
2013/0070,437 HYBRID INTERPOSERABANSep 20, 11Mar 21, 13[H01R, H05K]
2013/0068,516 HIGH IO SUBSTRATES AND INTERPOSERS WITHOUT VIASABANSep 19, 11Mar 21, 13[H05K]

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