IXYS SEMICONDUCTOR GMBH

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 5357
 
  
 
C04B LIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS 365
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 3153
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 192

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0002,239 Method of Joining Metal-Ceramic Substrates to Metal BodiesSep 16, 17Jan 04, 18[H01L, C04B]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9790130 Method of joining metal-ceramic substrates to metal bodiesMay 29, 12Oct 17, 17[H01L, C04B, B23K]
9210818 Power semiconductor module with asymmetrical lead spacingMar 24, 15Dec 08, 15[H01L, H05K]
9042103 Power semiconductor module with asymmetrical lead spacingMay 16, 12May 26, 15[H01L, H05K]
8876996 Method for the manufacture of double-sided metalized ceramic substratesJun 10, 11Nov 04, 14[C04B, H05K]
7030426 Power semiconductor component in the planar techniqueMar 14, 05Apr 18, 06[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2006/0267,185 Encapsulated power semiconductor assemblyAbandonedApr 08, 04Nov 30, 06[H01L]
6507108 Power semiconductor moduleExpiredSep 07, 00Jan 14, 03[H01L]

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