Icemos Technology Ltd.

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H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 46316

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9576842 Grass removal in patterned cavity etchingDec 10, 13Feb 21, 17[H01L]
9543380 Multi-directional trenching of a die in manufacturing superjunction devicesJun 27, 11Jan 10, 17[H01L]
9536941 Gate pad and gate feed breakdown voltage enhancementFeb 12, 16Jan 03, 17[H01L]
9461109 Method of forming superjunction high voltage devices using wafer bondingJun 26, 15Oct 04, 16[H01L]
9349725 Stripe orientation for trenches and contact windowsMar 13, 14May 24, 16[H01L]
9318554 Gate pad and gate feed breakdown voltage enhancementMar 13, 14Apr 19, 16[H01L]
9147751 Methods of manufacturing superjunction devicesDec 23, 14Sep 29, 15[H01L]
8963239 800 V superjunction deviceMar 12, 14Feb 24, 15[H01L]
8946814 Superjunction devices having narrow surface layout of terminal structures, buried contact regions and trench gatesApr 05, 13Feb 03, 15[H01L]
8895369 Methods for manufacturing superjunction semiconductor device having a dielectric terminationMar 28, 12Nov 25, 14[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2015/0050,817 METHOD OF PREVENTING VOLTAGE BREAKDOWN AT A SURFACE OF A SEMICONDUCTOR SUBSTRATE OF A SUPERJUNCTION SEMICONDUCTOR DEVICEAbandonedOct 30, 14Feb 19, 15[H01L]
2011/0042,576 DIRECT WAFER-BONDED THROUGH-HOLE PHOTODIODEAbandonedAug 20, 10Feb 24, 11[H01L, G01T]
2009/0253,261 Silicon Wafer Having Through-Wafer Vias With A Predetermined Geometric ShapeAbandonedJun 16, 09Oct 08, 09[H01L]
2009/0085,148 MULTI-DIRECTIONAL TRENCHING OF A PLURALITY OF DIES IN MANUFACTURING SUPERJUNCTION DEVICESAbandonedFeb 15, 08Apr 02, 09[H01L]
7489014 Front side electrical contact for photodetector array and method of making sameExpiredMar 02, 07Feb 10, 09[H01L]
2009/0026,586 Superjunction Device Having Oxide Lined Trenches and Method for Manufacturing a Superjunction Device Having Oxide Lined TrenchesAbandonedApr 21, 06Jan 29, 09[H01L]
2008/0272,429 SUPERJUNCTION DEVICES HAVING NARROW SURFACE LAYOUT OF TERMINAL STRUCTURES AND METHODS OF MANUFACTURING THE DEVICESAbandonedDec 21, 07Nov 06, 08[H01L]
2008/0122,040 Varying Pitch Adapter and a Method of Forming a Varying Pitch AdapterAbandonedJun 29, 07May 29, 08[H01L]
2008/0099,924 Silicon Wafer Having Through-Wafer Vias With A Predetermined Geometric ShapeAbandonedOct 26, 07May 01, 08[H01L]

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