INTERCONNECT SYSTEMS, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 8354
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 8148
 
  
 
B29C SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 1124
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM1156
 
  
 
G06F ELECTRIC DIGITAL DATA PROCESSING 1446
 
  
 
G11C STATIC STORES 1150
 
  
 
H01K ELECTRIC INCANDESCENT LAMPS 121
 
  
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 1132

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2013/0058,148 HIGH DENSITY MEMORY MODULESFeb 24, 12Mar 07, 13[G11C]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9865310 High density memory modulesFeb 24, 12Jan 09, 18[H01L, G11C, H05K]
7049166 Methods and apparatus for making integrated circuit package including opening exposing portion of the ICAug 16, 01May 23, 06[H01L]
6667439 Integrated circuit package including opening exposing portion of an ICAug 16, 01Dec 23, 03[H01L]
6560122 Chip package with molded underfillSep 28, 01May 06, 03[H01L]
6324069 Chip package with molded underfillDec 13, 99Nov 27, 01[H01L]
6316291 Method of fabricating a non-laminate carrier substrate utilizing a moldApr 19, 99Nov 13, 01[H01L]
6225998 Visual design of workflows for transaction processingDec 02, 97May 01, 01[G06F]
6038136 Chip package with molded underfillOct 29, 97Mar 14, 00[H01L]
5929522 Semiconductor non-laminate package and methodApr 17, 98Jul 27, 99[H01L]
5712768 Space-saving assemblies for connecting integrated circuits to circuit boardsOct 26, 95Jan 27, 98[H01R, H05K]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2010/0014,234 Light-Emitting Pixel Array Package And Method of Manufacturing The SameAbandonedJul 16, 08Jan 21, 10[B29D, H05K]
6495083 Method of underfilling an integrated circuit chipExpiredMay 17, 99Dec 17, 02[B29C]
6157086 Chip package with transfer mold underfillExpiredNov 18, 99Dec 05, 00[H01L]
6128195 Transfer molded PCMCIA standard cardsExpiredNov 18, 97Oct 03, 00[H01L, H05K]
5798014 Methods of making multi-tier laminate substrates for electronic device packagingExpiredOct 16, 96Aug 25, 98[H01L]
5776512 Apparatus for encapsulating electronic packagesExpiredOct 16, 96Jul 07, 98[B29C]
5766986 Method of transfer molding electronic packages and packages produced therebyExpiredMar 18, 96Jun 16, 98[H01L]
5728248 Method for making a multi-tier laminate substrate with internal heat spreaderExpiredOct 17, 96Mar 17, 98[H01L]
5689137 Method for transfer molding standard electronic packages and apparatus formed therebyExpiredOct 16, 95Nov 18, 97[H01L]
5652463 Transfer modlded electronic package having a passage meansExpiredMay 26, 95Jul 29, 97[H01L]

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