JX NIPPON MINING & METALS CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 18912
 
 
 
C22C ALLOYS 1509
 
 
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM6991
 
 
 
H01J ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS 6467
 
 
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 6488
 
 
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 5510
 
 
 
C22F CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS 513
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 50304
 
 
 
C22B PRODUCTION OR REFINING OF METALS 433
 
 
 
H01B CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES 4032

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0035,529 STRUCTURE HAVING METAL MATERIAL FOR HEAT RADIATION, PRINTED CIRCUIT BOARD, ELECTRONIC APPARATUS, AND METAL MATERIAL FOR HEAT RADIATIONJul 24, 17Feb 01, 18[F28F, H05K]
2018/0035,546 PRINTED WIRING BOARD, ELECTRONIC DEVICE, CATHETER, AND METALLIC MATERIALJul 20, 17Feb 01, 18[H05K]
2018/0019,389 MAGNETIC MATERIAL SPUTTERING TARGET AND METHOD FOR PRODUCING SAMEFeb 24, 16Jan 18, 18[C23C, H01F, H01L]
2018/0010,241 SPUTTERING TARGET AND/OR COIL, AND PROCESS FOR PRODUCING SAMESep 25, 17Jan 11, 18[C23C, H01J, C22C, C21D, C22F]
2018/0002,781 METHOD OF LEACHING COPPER FROM COPPER SULFIDE ORE AND METHOD OF EVALUATING IODINE LOSS CONTENT OF COLUMN LEACHING TEST OF THE COPPER SULFIDE OREMar 14, 16Jan 04, 18[C22B, C01G]
2018/0005,807 Magnetic Material Sputtering Target and Manufacturing Method ThereofSep 13, 17Jan 04, 18[C04B, G11B, C23C, B22F, H01J, C22C, C22F]
2017/0369,324 ACTIVATED CARBON REGENERATION METHOD AND GOLD RECOVERY METHODMar 03, 16Dec 28, 17[C22B, C01G, C01B]
2017/0372,879 TANTALUM SPUTTERING TARGET, AND PRODUCTION METHOD THEREFORMay 17, 16Dec 28, 17[C23C, H01J, C22F, B22D]
2017/0362,733 COPPER FOIL WITH RELEASE LAYER, LAMINATED MATERIAL, METHOD FOR PRODUCING PRINTED WIRING BOARD, AND METHOD FOR PRODUCING ELECTRONIC APPARATUSJun 21, 17Dec 21, 17[B32B, H05K, C25D]
2017/0356,066 METHOD FOR RECOVERING GOLD FROM ACTIVATED CARBONDec 04, 15Dec 14, 17[C22B, B01J]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9859031 Cu—Ni—Si based copper alloyFeb 15, 13Jan 02, 18[H01B, C22C, C22F]
9859104 Tantalum sputtering target and production method thereforFeb 28, 14Jan 02, 18[C23C, H01J, C22C, C22F]
9845528 Tantalum sputtering targetAug 04, 10Dec 19, 17[C23C, C22C, C22F]
9840757 Rolled copper foil for producing two-dimensional hexagonal lattice compound and method of producing two-dimensional hexagonal lattice compoundJun 12, 15Dec 12, 17[B32B, C22C, C22F, C30B]
9834839 Cylindrical sputtering target, cylindrical compact, manufacturing method of cylindrical sputtering target, and manufacturing method of cylindrical sintered compactMar 28, 16Dec 05, 17[C04B, C23C, H01J]
9839124 Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring boardFeb 04, 16Dec 05, 17[C23C, H05K, C25D]
9823362 Radiation detector UBM electrode structure body, radiation detector, and method of manufacturing sameDec 27, 16Nov 21, 17[G01T, H01L]
9826635 Carrier-attached copper foilDec 01, 14Nov 21, 17[C23C, B32B, H05K, C25D]
9812301 Tungsten sintered compact sputtering target and method for producing sameMar 20, 14Nov 07, 17[C23C, H01J, C22C]
9806351 Material fuel cell separator, fuel cell separator using same, fuel cell stack, and method of producing fuel cell separator materialAug 09, 11Oct 31, 17[H01M]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2015/0232,342 ROLLED COPPER FOIL FOR PRODUCING GRAPHENE AND METHOD OF PRODUCING GRAPHENE USING THE SAMEABANJul 08, 13Aug 20, 15[C23F, C01B, C22C]
2015/0232,980 Cu-Ga Alloy Sputtering Target, and Method for Producing SameABANOct 28, 13Aug 20, 15[C23C, H01J, C22C, B22D]
2015/0170,890 Sputtering TargetABANSep 13, 13Jun 18, 15[C23C, G11B, H01J]
2015/0107,991 Fe-Pt-Based Sputtering Target Having Nonmagnetic Substance Dispersed ThereinABANAug 21, 13Apr 23, 15[C23C, H01J]
2015/0047,469 Method for Recovering Rare Earth from Rare Earth Element-Containing AlloyABANJul 11, 13Feb 19, 15[C22B, C25C]
2015/0014,155 Ferromagnetic Material Sputtering Target Containing Chromium OxideABANJan 15, 13Jan 15, 15[C23C, H01J]
2014/0339,466 Cathode Active Material For Lithium Ion Battery, Cathode For Lithium Ion Battery, And Lithium Ion BatteryABANMay 29, 13Nov 20, 14[H01M]
2014/0318,973 ELECTROLYTIC COPPER FOIL AND PRODUCTION METHOD OF ELECTROLYTIC COPPER FOILABANMar 28, 12Oct 30, 14[H01M]
2014/0311,899 Ferromagnetic Material Sputtering TargetABANJan 21, 13Oct 23, 14[H01J]
2014/0246,399 COPPER FOIL FOR PRODUCING GRAPHENE, PRODUCTION METHOD THEREOF AND METHOD OF PRODUCING GRAPHENEABANOct 26, 12Sep 04, 14[B21B, C25F, B32B, C01B]
2014/0231,250 C PARTICLE DISPERSED FE-PT-BASED SPUTTERING TARGETABANDec 18, 12Aug 21, 14[C23C]
2014/0199,203 HIGH-PURITY LANTHANUM, METHOD FOR PRODUCING SAME, SPUTTERING TARGET COMPRISING HIGH-PURITY LANTHANUM, AND METAL GATE FILM COMPRISING HIGH-PURITY LANTHANUM AS MAIN COMPONENTABANSep 04, 12Jul 17, 14[C22B, C23C, C22C]
2014/0166,481 Fe-Al Based Alloy Sputtering TargetABANApr 26, 12Jun 19, 14[C23C]
2014/0158,546 ELECTROLYTIC COPPER PLATING SOLUTION FOR FILLING FOR FORMING MICROWIRING OF COPPER FOR ULSIABANDec 10, 13Jun 12, 14[C25D]
2014/0110,849 Copper-Titanium Alloy Sputtering Target, Semiconductor Wiring Line Formed Using the Sputtering Target, and Semiconductor Element and Device Each Equipped with the Semiconductor Wiring LineABANFeb 15, 12Apr 24, 14[C23C, H01L]
2014/0113,121 METAL FOIL COMPOSITE, FLEXIBLE PRINTED CIRCUIT, FORMED PRODUCT AND METHOD OF PRODUCING THE SAMEABANMar 08, 12Apr 24, 14[B32B, H05K]
2014/0083,847 Fe-Pt-C Based Sputtering TargetABANJul 20, 12Mar 27, 14[C23C]
2014/0057,123 COPPER FOIL FOR PRINTED CIRCUITABANFeb 10, 12Feb 27, 14[H05K]
2014/0030,591 ELECTROLYTIC COPPER FOIL FOR AN ANODE OF A NEGATIVE ELECTRODE COLLECTOR IN A SECONDARY BATTERY AND METHOD OF PRODUCING THE SAMEABANMar 28, 12Jan 30, 14[H01M]
2014/0023,868 Sputtering Target of Sintered Ti-Nb Based Oxide, Thin Film of Ti-Nb Based Oxide, and Method of Producing The Thin FilmABANSep 24, 13Jan 23, 14[G11B]

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