JX NIPPON MINING & METALS CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 18711
 
 
 
C22C ALLOYS 1468
 
 
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM6583
 
 
 
H01J ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS 6070
 
 
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 5996
 
 
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 5312
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 48307
 
 
 
C22F CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS 464
 
 
 
C22B PRODUCTION OR REFINING OF METALS 403
 
 
 
H01B CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES 4034

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0306,473 Sputtering Target Comprising Al-Te-Cu-Zr-Based Alloy and Method of Manufacturing SameOct 08, 15Oct 26, 17[C23C, B22F, C22C]
2017/0309,460 NIOBIUM OXIDE SINTERED COMPACT, SPUTTERING TARGET FORMED FROM SAID SINTERED COMPACT, AND METHOD OF PRODUCING NIOBIUM OXIDE SINTERED COMPACTSep 14, 15Oct 26, 17[C04B, C23C, H01J]
2017/0303,405 Copper Foil, Copper Foil for High-Frequency Circuit, Carrier-Attached Copper Foil, Carrier-Attached Copper Foil for High-Frequency Circuit, Laminate, Method of Manufacturing Printed Wiring Board, and Method of Manufacturing Electronic DeviceApr 13, 17Oct 19, 17[B32B, H05K]
2017/0294,203 Sputtering Target for Forming Magnetic Recording Film and Method for Producing SameJul 07, 15Oct 12, 17[C23C, G11B, H01F, H01J]
2017/0283,924 COPPER ALLOY SHEET MATERIAL AND METHOD FOR PRODUCING COPPER ALLOY SHEET MATERIALMar 23, 17Oct 05, 17[C22C, C22F]
2017/0283,925 COPPER ALLOY SHEET MATERIAL AND METHOD OF MANUFACTURING THE SAMEMar 28, 17Oct 05, 17[C22C, C22F, B22D]
2017/0285,294 Titanium Copper Foil Having Plated LayerMar 30, 17Oct 05, 17[G02B, B23K, B32B, C25D, C22C]
2017/0285,295 Copper-titanium Alloy Foil Having Plated LayerMar 30, 17Oct 05, 17[G02B, B23K, B32B, C25D, C22C]
2017/0271,134 Lithium Cobalt Sintered Body and Sputtering Target Produced by Using the Sintered Body, Production Method of Lithium Cobalt Oxide Sintered Body, and Thin Film Formed from Lithium Cobalt OxideFeb 22, 17Sep 21, 17[C23C, C01G, H01J, H01M, B28B]
2017/0236,696 Cobalt Sputtering TargetSep 25, 15Aug 17, 17[H01J]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9812301 Tungsten sintered compact sputtering target and method for producing sameMar 20, 14Nov 07, 17[C23C, H01J, C22C]
9806351 Material fuel cell separator, fuel cell separator using same, fuel cell stack, and method of producing fuel cell separator materialAug 09, 11Oct 31, 17[H01M]
9793099 Magnetic material sputtering target and manufacturing method thereofFeb 26, 13Oct 17, 17[C04B, G11B, C23C, B22F, H01J, C22C, C22F]
9788423 Copper foil with carrierApr 27, 16Oct 10, 17[B32B, H05K, C25D, C22C]
9773651 High-purity copper sputtering targetDec 25, 12Sep 26, 17[C23C, H01J, C22C, C22F]
9773653 Ferromagnetic material sputtering target containing chromium oxideJan 28, 13Sep 26, 17[G11B, C23C, H01J]
9765425 Copper alloy sputtering target, process for producing the same and semiconductor element wiringMay 12, 10Sep 19, 17[C23C, H01L, C22C]
9758860 Indium sputtering target and method for manufacturing sameAug 15, 12Sep 12, 17[C23C, H01J]
9761421 Indium cylindrical sputtering target and manufacturing method thereofJan 31, 13Sep 12, 17[B21C, B21B, C23C, H01J, B21J, C22F]
9761422 Magnetic material sputtering target and manufacturing method for sameFeb 15, 13Sep 12, 17[G11B, C23C, H01J]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2015/0232,342 ROLLED COPPER FOIL FOR PRODUCING GRAPHENE AND METHOD OF PRODUCING GRAPHENE USING THE SAMEABANJul 08, 13Aug 20, 15[C23F, C01B, C22C]
2015/0232,980 Cu-Ga Alloy Sputtering Target, and Method for Producing SameABANOct 28, 13Aug 20, 15[C23C, H01J, C22C, B22D]
2015/0170,890 Sputtering TargetABANSep 13, 13Jun 18, 15[C23C, G11B, H01J]
2015/0107,991 Fe-Pt-Based Sputtering Target Having Nonmagnetic Substance Dispersed ThereinABANAug 21, 13Apr 23, 15[C23C, H01J]
2015/0047,469 Method for Recovering Rare Earth from Rare Earth Element-Containing AlloyABANJul 11, 13Feb 19, 15[C22B, C25C]
2015/0014,155 Ferromagnetic Material Sputtering Target Containing Chromium OxideABANJan 15, 13Jan 15, 15[C23C, H01J]
2014/0339,466 Cathode Active Material For Lithium Ion Battery, Cathode For Lithium Ion Battery, And Lithium Ion BatteryABANMay 29, 13Nov 20, 14[H01M]
2014/0318,973 ELECTROLYTIC COPPER FOIL AND PRODUCTION METHOD OF ELECTROLYTIC COPPER FOILABANMar 28, 12Oct 30, 14[H01M]
2014/0311,899 Ferromagnetic Material Sputtering TargetABANJan 21, 13Oct 23, 14[H01J]
2014/0246,399 COPPER FOIL FOR PRODUCING GRAPHENE, PRODUCTION METHOD THEREOF AND METHOD OF PRODUCING GRAPHENEABANOct 26, 12Sep 04, 14[B21B, C25F, B32B, C01B]
2014/0231,250 C PARTICLE DISPERSED FE-PT-BASED SPUTTERING TARGETABANDec 18, 12Aug 21, 14[C23C]
2014/0199,203 HIGH-PURITY LANTHANUM, METHOD FOR PRODUCING SAME, SPUTTERING TARGET COMPRISING HIGH-PURITY LANTHANUM, AND METAL GATE FILM COMPRISING HIGH-PURITY LANTHANUM AS MAIN COMPONENTABANSep 04, 12Jul 17, 14[C22B, C23C, C22C]
2014/0166,481 Fe-Al Based Alloy Sputtering TargetABANApr 26, 12Jun 19, 14[C23C]
2014/0158,546 ELECTROLYTIC COPPER PLATING SOLUTION FOR FILLING FOR FORMING MICROWIRING OF COPPER FOR ULSIABANDec 10, 13Jun 12, 14[C25D]
2014/0110,849 Copper-Titanium Alloy Sputtering Target, Semiconductor Wiring Line Formed Using the Sputtering Target, and Semiconductor Element and Device Each Equipped with the Semiconductor Wiring LineABANFeb 15, 12Apr 24, 14[C23C, H01L]
2014/0113,121 METAL FOIL COMPOSITE, FLEXIBLE PRINTED CIRCUIT, FORMED PRODUCT AND METHOD OF PRODUCING THE SAMEABANMar 08, 12Apr 24, 14[B32B, H05K]
2014/0083,847 Fe-Pt-C Based Sputtering TargetABANJul 20, 12Mar 27, 14[C23C]
2014/0057,123 COPPER FOIL FOR PRINTED CIRCUITABANFeb 10, 12Feb 27, 14[H05K]
2014/0030,591 ELECTROLYTIC COPPER FOIL FOR AN ANODE OF A NEGATIVE ELECTRODE COLLECTOR IN A SECONDARY BATTERY AND METHOD OF PRODUCING THE SAMEABANMar 28, 12Jan 30, 14[H01M]
2014/0023,868 Sputtering Target of Sintered Ti-Nb Based Oxide, Thin Film of Ti-Nb Based Oxide, and Method of Producing The Thin FilmABANSep 24, 13Jan 23, 14[G11B]

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