K.C. TECH CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 12350
 
 
 
C09G POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SKI WAXES118
 
 
 
B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 957
 
 
 
C09K MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR689
 
 
 
B24D TOOLS FOR GRINDING, BUFFING, OR SHARPENING 228
 
 
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 299
 
 
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 234
 
 
 
A46B BRUSHES 129
 
 
 
B05B SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES 163
 
 
 
B05C APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 144

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0183,537 POLISHING SLURRY COMPOSITIONAug 11, 15Jun 29, 17[C09K, C09G, H01L]
2017/0051,180 METHOD FOR PREPARING SLURRY COMPOSITION AND SLURRY COMPOSITION PREPARED THEREBYJan 23, 15Feb 23, 17[C09K, C09G, H01L]
2016/0108,518 THIN FILM MANUFACTURING METHOD AND ATOMIC LAYER DEPOSITION APPARATUSAug 24, 15Apr 21, 16[C23C, H01L]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9704729 Substrate cleaning apparatus and method and brush assembly used thereinJun 11, 14Jul 11, 17[B08B, A46B, H01L]
9581872 Slot die coating apparatus and coating method using the sameFeb 16, 15Feb 28, 17[G02F, B05C, B05D, H01L, B05B]
8968476 Atomic layer deposition apparatusDec 29, 09Mar 03, 15[C23C, H01L]
8939817 Membrane assembly and carrier head having the membrane assemblyMay 29, 12Jan 27, 15[B24B]
8882563 Chemical mechanical polishing systemApr 27, 11Nov 11, 14[B24B]
8662956 Conditioner of chemical mechanical polishing apparatusMay 03, 11Mar 04, 14[B24B]
8491682 Abrasive particles, method of manufacturing the abrasive particles, and method of manufacturing chemical mechanical polishing slurryDec 27, 08Jul 23, 13[C01F, B24D]
8361177 Polishing slurry, method of producing same, and method of polishing substrateDec 11, 08Jan 29, 13[C09K, C09G, B24D, C09C, H01L]
8062547 CMP slurry, preparation method thereof and method of polishing substrate using the sameJun 02, 06Nov 22, 11[C09K]
7892069 Loading device of chemical mechanical polishing equipment for semiconductor wafersJul 21, 06Feb 22, 11[B24B]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
7537512 Multiple fluid supplying apparatus for carrier of semiconductor wafer polishing systemExpiredJun 28, 05May 26, 09[B24B]
2009/0100,765 POLISHING SLURRY, METHOD OF PRODUCING SAME, AND METHOD OF POLISHING SUBSTRATEAbandonedDec 11, 08Apr 23, 09[C09K]
2008/0173,335 Semiconductor Wafer Cleaning SystemAbandonedApr 04, 05Jul 24, 08[B08B]
2007/0272,146 Apparatus and method for measuring widthwise ejection uniformity of slit nozzleAbandonedMay 17, 07Nov 29, 07[B05C]
2007/0275,157 Apparatus and method for measuring widthwise ejection uniformity of slit nozzleAbandonedMay 17, 07Nov 29, 07[C23C, B05C]
2007/0182,327 MANUFACTURING METHOD OF ELECTRODE FOR ATMOSPHERIC PRESSURE PLASMA, ELECTRODE STRUCTURE, AND ATMOSPHERIC PRESSURE PLASMA APPARATUS USING THE SAMEAbandonedAug 22, 06Aug 09, 07[H01J]
2006/0207,188 Ceria abrasive for cmpAbandonedMay 14, 04Sep 21, 06[C09K]
2006/0156,635 Abrasive particles, polishing slurry, and producing method thereofAbandonedDec 16, 05Jul 20, 06[C09K]
2006/0032,149 Polishing slurry, method of producing same, and method of polishing substrateAbandonedJul 28, 05Feb 16, 06[C09K, B24D, C09C]

Top Inventors for This Owner

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