K.C. TECH CO., LTD.
Patent Owner
Stats
- 21 US PATENTS IN FORCE
- 3 US APPLICATIONS PENDING
- Jul 20, 2017 most recent publication
Details
- 21 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 615 Total Citation Count
- Mar 24, 2000 Earliest Filing
- 9 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
Rank in Class
Top Patents (by citation)
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Recent Publications
Publication #
Title
Filing Date
Pub Date
Intl Class
2017/0051,180 METHOD FOR PREPARING SLURRY COMPOSITION AND SLURRY COMPOSITION PREPARED THEREBYJan 23, 15Feb 23, 17[C09K, H01L, C09G]
2016/0108,518 THIN FILM MANUFACTURING METHOD AND ATOMIC LAYER DEPOSITION APPARATUSAug 24, 15Apr 21, 16[C23C, H01L]
Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
9704729 Substrate cleaning apparatus and method and brush assembly used thereinJun 11, 14Jul 11, 17[A46B, H01L, B08B]
9581872 Slot die coating apparatus and coating method using the sameFeb 16, 15Feb 28, 17[B05C, H01L, B05D, B05B, G02F]
8491682 Abrasive particles, method of manufacturing the abrasive particles, and method of manufacturing chemical mechanical polishing slurryDec 27, 08Jul 23, 13[C01F, B24D]
8361177 Polishing slurry, method of producing same, and method of polishing substrateDec 11, 08Jan 29, 13[C09K, H01L, C09G, C09C, B24D]
8062547 CMP slurry, preparation method thereof and method of polishing substrate using the sameJun 02, 06Nov 22, 11[C09K]
7892069 Loading device of chemical mechanical polishing equipment for semiconductor wafersJul 21, 06Feb 22, 11[B24B]
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
7537512 Multiple fluid supplying apparatus for carrier of semiconductor wafer polishing systemExpiredJun 28, 05May 26, 09[B24B]
2009/0100,765 POLISHING SLURRY, METHOD OF PRODUCING SAME, AND METHOD OF POLISHING SUBSTRATEAbandonedDec 11, 08Apr 23, 09[C09K]
2007/0272,146 Apparatus and method for measuring widthwise ejection uniformity of slit nozzleAbandonedMay 17, 07Nov 29, 07[B05C]
2007/0275,157 Apparatus and method for measuring widthwise ejection uniformity of slit nozzleAbandonedMay 17, 07Nov 29, 07[C23C, B05C]
2007/0182,327 MANUFACTURING METHOD OF ELECTRODE FOR ATMOSPHERIC PRESSURE PLASMA, ELECTRODE STRUCTURE, AND ATMOSPHERIC PRESSURE PLASMA APPARATUS USING THE SAMEAbandonedAug 22, 06Aug 09, 07[H01J]
2006/0156,635 Abrasive particles, polishing slurry, and producing method thereofAbandonedDec 16, 05Jul 20, 06[C09K]
2006/0032,149 Polishing slurry, method of producing same, and method of polishing substrateAbandonedJul 28, 05Feb 16, 06[C09K, C09C, B24D]
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