Kabushiki Kaisha Shinkawa

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 3360
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 32330
 
  
 
G01B MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS693
 
  
 
F16C SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OF CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS 565
 
  
 
B65G TRANSPORT OR STORAGE DEVICES, e.g. CONVEYERS FOR LOADING OR TIPPING; SHOP CONVEYER SYSTEMS; PNEUMATIC TUBE CONVEYERS 463
 
  
 
B23Q DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING 238
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM2155
 
  
 
G01N INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES 2204
 
  
 
G05B CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS 299
 
  
 
G06F ELECTRIC DIGITAL DATA PROCESSING 2445

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8678266 Wire bonding methodFeb 24, 06Mar 25, 14[B23K]
8511534 Ultrasonic hornSep 23, 11Aug 20, 13[B23K]
8434656 Ultrasonic hornSep 23, 11May 07, 13[B23K]
8232656 Semiconductor deviceOct 20, 10Jul 31, 12[H01L]
8152043 Ultrasonic hornSep 23, 11Apr 10, 12[B23K]
8143155 Wire bonding method and semiconductor deviceOct 21, 09Mar 27, 12[H01L]
8052026 Ultrasonic hornOct 06, 06Nov 08, 11[B23K]
7929152 Apparatus for detecting press-bonded ball at bonding portion in bonding apparatus and method for detecting press-bonded ball at bonding portionMar 06, 08Apr 19, 11[G01B]
7910472 Method of manufacturing semiconductor deviceJun 03, 10Mar 22, 11[H01L]
7905485 Paper feeding apparatus and paper feeding method thereof with a plurality of force units with fluid-supply devicesJun 24, 08Mar 15, 11[B65H]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
8283593 Wire cleaning guideExpiredFeb 14, 08Oct 09, 12[B23K]
7934634 Wire bonding methodExpiredApr 07, 09May 03, 11[B23K]
7848022 Imaging device and method for a bonding apparatusExpiredJun 06, 08Dec 07, 10[G02B]
RE41506 Offset measuring mechanism and offset measuring method in a bonding apparatusExpiredJul 11, 07Aug 17, 10[G05G]
2010/0155,455 Wire bonding methodAbandonedFeb 22, 10Jun 24, 10[B23K]
2010/0133,322 Wire bonding apparatus, record medium storing bonding control program , and bonding methodAbandonedJan 29, 10Jun 03, 10[B23K]
7699209 Wire bonding apparatus, record medium storing bonding control program, and bonding methodExpiredDec 28, 06Apr 20, 10[B23K]
2010/0077,590 Die pickup methodAbandonedNov 30, 09Apr 01, 10[B23P]
2010/0078,125 Method for securing a curved circuit board in die bonder and recording medium containing program for securing a curved circuit board in die bonderAbandonedOct 01, 08Apr 01, 10[B29C]
2010/0078,464 Wire bonding apparatus and ball forming methodAbandonedOct 01, 08Apr 01, 10[B23K]
2010/0072,262 Wire bonding methodAbandonedSep 23, 08Mar 25, 10[B23K]
2010/0067,123 Imaging device for a bonding apparatusAbandonedSep 17, 08Mar 18, 10[G02B]
7661576 Wire bonding methodExpiredSep 10, 08Feb 16, 10[B23K]
7658313 Ball forming device in a bonding apparatus and ball forming methodExpiredFeb 08, 07Feb 09, 10[B23K]
7658314 Tail wire cutting method and bonding apparatusExpiredApr 23, 07Feb 09, 10[B23K]
7621436 Wire bonding methodExpiredNov 14, 06Nov 24, 09[B23K]
7617966 Semiconductor deviceExpiredOct 16, 06Nov 17, 09[H01L, B23K]
2009/0272,498 Horn-holder pivot type bonding apparatusAbandonedJul 09, 09Nov 05, 09[B29C, B23K]
7578421 Horn-holder pivot type bonding apparatusExpiredMar 06, 07Aug 25, 09[B23K]
7576297 Bonding apparatus and methodExpiredJun 30, 06Aug 18, 09[B23K]

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