KEMET ELECTRONICS CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01G CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE 1408
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 1176
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 9147
 
  
 
H01B CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES 668
 
  
 
A61N ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY 5102
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 546
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 5357
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 489
 
  
 
C04B LIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS 464
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 497

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0367,228 Component Stability StructureJun 20, 16Dec 21, 17[H05K]
2017/0098,512 Conductive Polymer Dispersion with Enhanced CoverageDec 15, 16Apr 06, 17[H01G]
2017/0084,397 Methods to Reduce Case Height for CapacitorsSep 13, 16Mar 23, 17[H01G]
2017/0069,429 Low Energy Milling to Produce Flake PowdersOct 31, 16Mar 09, 17[B22F, H01G, C22C]
2016/0329,156 Capacitor with Volumetrically Efficient Hermetic PackagingApr 04, 16Nov 10, 16[H01G]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9881744 Electronic component termination and assembly by means of transient liquid phase sintering metalurgical bondsFeb 28, 14Jan 30, 18[B23K, H01G]
9847175 Method for stacking electronic componentsJan 10, 14Dec 19, 17[H01C, H01G]
9847179 Solid electrolytic capacitor and method of manufacturing a solid electrolytic capacitorFeb 18, 14Dec 19, 17[C23C, B05D, B29C, H01G]
9818549 Conductive polymer dispersions for solid electrolytic capacitorsSep 10, 14Nov 14, 17[B05D, H01G]
9805872 Multiple MLCC modulesDec 09, 15Oct 31, 17[H01G]
9799449 Multilayered ceramic capacitor with improved lead frame attachmentSep 26, 14Oct 24, 17[H01G]
9793057 Electronic component termination and assembly by means of transient liquid phase sintering metallurgical bondMay 09, 16Oct 17, 17[B23K, H01G]
9793058 Capacitor with charge time reducing additives and work function modifiersMay 20, 15Oct 17, 17[H01G]
9779874 Sintering of high temperature conductive and resistive pastes onto temperature sensitive and atmospheric sensitive materialsJul 05, 12Oct 03, 17[B05D, H01G]
9761347 Process to improve coverage and electrical performance of solid electrolytic capacitorMar 29, 16Sep 12, 17[H01B, H01G]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0379,760 Capacitor PCB SpacerAbandonedJun 21, 16Dec 29, 16[H01G]
2016/0225,532 Conductive Polymer Composition with a Dual Crosslinker System for CapacitorsAbandonedApr 08, 16Aug 04, 16[H01B, H01G]
2015/0155,101 Forming Method of Solid Electrolytic CapacitorAbandonedDec 03, 14Jun 04, 15[H01G]
2014/0301,022 Process for Producing Electrolytic Capacitors and Capacitors Made TherebyAbandonedMay 29, 14Oct 09, 14[H01G]
2014/0139,971 Sintering of High Temperature Conductive and Resistive Pastes onto Temperature Sensitive and Atmospheric Sensitive MaterialsAbandonedJan 28, 14May 22, 14[B05D, H01G]
2013/0241,591 Apparatus and Method for Screening Electrolytic CapacitorsAbandonedMay 06, 13Sep 19, 13[G01R]
2013/0107,419 MULTILAYERED CERAMIC CAPACITOR WITH IMPROVED LEAD FRAME ATTACHMENTAbandonedOct 28, 11May 02, 13[H01G]
2012/0329,328 BUSBAR CONTACT PAD WITH SPECIFIC CURVATURE FOR A BETTER CONNECTION TO METAL SPRAY LAYERSAbandonedJun 22, 12Dec 27, 12[H01R]
8325465 NbO capacitors with improved performance and higher working voltagesExpiredJul 08, 08Dec 04, 12[H01G]
8262745 Capacitor with sacrificial lead wire configuration and improved manufacturing method thereofExpiredJul 21, 10Sep 11, 12[H01G]
2012/0019,979 OFFSET RISER WIREAbandonedSep 30, 11Jan 26, 12[B29C, B22F, H01G]
7969711 Multiple electronic components: combination capacitor and Zener diodeExpiredFeb 06, 08Jun 28, 11[H01G]
7833293 Multiple electronic components: combination capacitor and Zener diodeExpiredMar 10, 10Nov 16, 10[H01G]
2010/0246,096 USE OF CONJUGATED OLIGOMER AS ADDITIVE FOR FORMING CONDUCTIVE POLYMERSAbandonedMay 19, 10Sep 30, 10[H01G]
2010/0177,460 CHANNEL METHOD FOR FORMING A CAPACITORAbandonedMar 18, 10Jul 15, 10[H01G]
7731893 Method for making anodes for electrolytic capacitor with high volumetric efficiencyExpiredNov 13, 07Jun 08, 10[B22F]
7678259 Method of anodizing valve metal derived anode bodies and electrolyte thereforeExpiredJul 29, 05Mar 16, 10[C25D]
2010/0053,849 ANODES WITH CORNER AND EDGE MODIFIED DESIGNSAbandonedNov 09, 09Mar 04, 10[H01G]
7643269 Electrode for an electrical component, component with the electrode, and manufacturing method for the electrode and the componentExpiredJan 25, 06Jan 05, 10[H01G]
2009/0279,233 HIGH VOLUMETRIC EFFICIENCY ANODES FOR ELECTROLYTIC CAPACITORSAbandonedMay 12, 08Nov 12, 09[B22F, H01G]

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