KULICKE AND SOFFA INDUSTRIES, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 5443
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 45317
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 7149
 
  
 
G01N INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES 4202
 
  
 
B23P OTHER WORKING OF METAL; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS 254
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM2155
 
  
 
G06F ELECTRIC DIGITAL DATA PROCESSING 2445
 
  
 
G06T IMAGE DATA PROCESSING OR GENERATION, IN GENERAL 2133
 
  
 
H02K DYNAMO-ELECTRIC MACHINES 2105
 
  
 
B05C APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 144

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0040,280 METHODS OF FORMING WIRE INTERCONNECT STRUCTURESOct 20, 16Feb 09, 17[H01L]
2008/0314,963 Bonding Tool With Improved FinishJun 19, 07Dec 25, 08[B23K]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9905530 Systems and methods for bonding semiconductor elementsMar 03, 17Feb 27, 18[H01L]
9865560 Methods of forming wire interconnect structuresOct 20, 16Jan 09, 18[H01L]
9847313 Thermocompression bonders, methods of operating thermocompression bonders, and horizontal scrub motions in thermocompression bondingApr 18, 16Dec 19, 17[H01L, B23K]
9847314 Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the sameJul 22, 16Dec 19, 17[H01L, B23K]
9810641 Systems and methods for measuring physical characteristics of semiconductor device elements using structured lightAug 27, 14Nov 07, 17[H01L, G06T, G01N]
9779965 Systems and methods for bonding semiconductor elementsMar 13, 17Oct 03, 17[H01L]
9780065 Systems and methods for bonding semiconductor elementsMar 14, 17Oct 03, 17[H01L]
9780066 Thermocompression bonding systems and methods of operating the sameApr 19, 17Oct 03, 17[H01L, H05K, B32B]
9731378 Thermocompression bonders, methods of operating thermocompression bonders, and horizontal correction motions using lateral force measurement in thermocompression bondingMay 17, 16Aug 15, 17[B23K]
9659902 Thermocompression bonding systems and methods of operating the sameFeb 20, 15May 23, 17[H03K, H01L, H05K]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2015/0155,211 SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTSAbandonedNov 25, 14Jun 04, 15[H01L]
2012/0160,902 WIRE FEED SYSTEM AND METHOD OF OPERATING THE SAMEAbandonedMar 07, 12Jun 28, 12[B23K]
2012/0128,229 IMAGING OPERATIONS FOR A WIRE BONDING SYSTEMAbandonedNov 10, 11May 24, 12[G06K]
2012/0074,206 METHODS OF FORMING WIRE BONDS FOR WIRE LOOPS AND CONDUCTIVE BUMPSAbandonedSep 19, 11Mar 29, 12[B23K]
2012/0024,089 METHODS OF TEACHING BONDING LOCATIONS AND INSPECTING WIRE LOOPS ON A WIRE BONDING MACHINE, AND APPARATUSES FOR PERFORMING THE SAMEAbandonedFeb 29, 08Feb 02, 12[B23K, G01N]
2011/0121,053 Z-AXIS MOTION SYSTEM FOR A WIRE BONDING MACHINEAbandonedJan 27, 11May 26, 11[B23K]
2011/0114,703 Z-AXIS MOTION SYSTEM FOR A WIRE BONDING MACHINEAbandonedJan 27, 11May 19, 11[B23K]
2010/0230,476 REDUCED OXIDATION SYSTEM FOR WIRE BONDINGAbandonedMay 27, 10Sep 16, 10[B23K]
2010/0186,991 CONDUCTIVE BUMPS, WIRE LOOPS INCLUDING THE IMPROVED CONDUCTIVE BUMPS, AND METHODS OF FORMING THE SAMEAbandonedOct 18, 06Jul 29, 10[B23K, H01B]
7637411 Wire bonding apparatus and processExpiredAug 26, 08Dec 29, 09[B23K]
2009/0308,904 WIRE FEED SYSTEM AND METHOD OF OPERATING THE SAMEAbandonedNov 09, 06Dec 17, 09[H01L, B23K, B65H]
7624904 Calibration apparatus for bondhead of wire bonding machineExpiredSep 29, 08Dec 01, 09[H01L, B23K]
2009/0250,503 Z-AXIS MOTION SYSTEM FOR A WIRE BONDING MACHINEAbandonedAug 30, 06Oct 08, 09[B23K]
7527186 Method and apparatus for mapping a position of a capillary tool tip using a prismExpiredJun 09, 05May 05, 09[B23K, G02B, G01B]
7523848 Method and apparatus for measuring the size of free air balls on a wire bonderExpiredJun 09, 05Apr 28, 09[B23K, G01B]
2009/0039,141 BONDING WIRE CLEANING UNIT AND METHOD OF WIRE BONDING USING THE SAMEAbandonedOct 13, 08Feb 12, 09[B23K]
7431192 Wire bonding apparatusExpiredDec 13, 05Oct 07, 08[B23K]
7377415 Bond head link assembly for a wire bonding machineExpiredJun 15, 05May 27, 08[B23K]
7320423 High speed linear and rotary split-axis wire bonderExpiredNov 17, 03Jan 22, 08[B23K]
7320424 Linear split axis wire bonderExpiredMar 29, 05Jan 22, 08[B23K]

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