KYOCERA AMERICA, INC.

Patent Owner

Watch Compare Add to Portfolio

Stats

Details

Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 6356
 
  
 
H01P WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE 456
 
  
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 2203
 
  
 
H01J ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS 1127
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1155

Top Patents (by citation)

Upgrade to the Professional Level to View Top Patents for this Owner. Learn More

Recent Publications

  • No Recent Publications to Display

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9331000 Heat management in electronics packagingApr 02, 15May 03, 16[H01L]
8547187 Printed circuit board impedance matching step for microwave (millimeter wave) devicesSep 30, 10Oct 01, 13[H01P, H03H]
7808341 Broadband RF connector interconnect for multilayer electronic packagesFeb 21, 07Oct 05, 10[H01P]
7582964 Semiconductor package having non-ceramic based window frameNov 19, 07Sep 01, 09[H01L]
7298046 Semiconductor package having non-ceramic based window frameJan 10, 03Nov 20, 07[H01L]
7053729 Impedence matching along verticle path of microwave vias in multilayer packagesAug 23, 04May 30, 06[H01P]
6900525 Semiconductor package having filler metal of gold/silver/copper alloyMay 21, 03May 31, 05[H01L]
6796725 Opto-electronic package for integrated sealing of optical fibersOct 05, 01Sep 28, 04[G02B]
6727117 Semiconductor substrate having copper/diamond composite material and method of making sameNov 07, 02Apr 27, 04[H01L]
6703559 Feedthrough assembly having cut-out areas in metal housing adjacent ceramic feedthroughJul 19, 01Mar 09, 04[H01J, H05K]

View all patents..

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0377,823 OPTICAL MODULE AND OPTICAL MODULE PACKAGE INCORPORATING A HIGH-THERMAL-EXPANSION CERAMIC SUBSTRATEAbandonedJun 24, 16Dec 29, 16[G02B]
2006/0109,063 Matching for ring hybridAbandonedNov 23, 04May 25, 06[H01P]
6204448 High frequency microwave packaging having a dielectric gapExpiredDec 04, 98Mar 20, 01[H05K]
6046707 Ceramic multilayer helical antenna for portable radio or microwave communication apparatusExpiredJul 02, 97Apr 04, 00[H01Q]
5482735 Method for making multi-layer ceramic packagesExpiredSep 02, 94Jan 09, 96[B05D]
5345038 Multi-layer ceramic packagesExpiredJul 29, 91Sep 06, 94[H01L]
5314606 Leadless ceramic package with improved solderabiltyExpiredFeb 16, 93May 24, 94[C25D]
5258575 Ceramic glass integrated circuit package with integral ground and power planesExpiredApr 22, 91Nov 02, 93[H05K]
5231036 Method of using a contamination shield during the manufacture of EPROM semiconductor package windowsExpiredAug 03, 92Jul 27, 93[H01L]
5196919 Use of a contamination shield during the manufacture of semiconductor packagesExpiredDec 07, 90Mar 23, 93[H01L]
5160747 Apparatus for manufacturing ceramic chip-resistant chamfered integrated circuit packageExpiredAug 05, 91Nov 03, 92[B29C]
5137767 Partially coated assembly structure and method for making a ceramic lid for hermetic sealing of an eprom circuitExpiredAug 29, 90Aug 11, 92[B32B]
5134246 Ceramic-glass integrated circuit package with integral ground and power planesExpiredJan 16, 91Jul 28, 92[H01L]
5095360 Ceramic chip-resistant chamfered integrated circuit packageExpiredOct 10, 90Mar 10, 92[H01L]
5068210 Low dielectric constant ceramic materialsExpiredMay 17, 88Nov 26, 91[C03C]
5043004 Method for making a ceramic lid for hermetic sealing of an EPROM circuitExpiredAug 29, 90Aug 27, 91[C03Z]
4992628 Ceramic-glass integrated circuit package with ground planeExpiredMay 07, 90Feb 12, 91[H05K]
4982494 Methods of making a low capacitance integrated circuit packageExpiredJan 31, 90Jan 08, 91[H01R]
4931854 Low capacitance integrated circuit packageExpiredFeb 06, 89Jun 05, 90[H01L]
4755490 Low firing temperature ceramic materialsExpiredOct 19, 87Jul 05, 88[C03C, C04B]

Top Inventors for This Owner

Upgrade to the Professional Level to View Top Inventors for this Owner. Learn More

We are sorry but your current selection exceeds the maximum number of comparisons () for this membership level. Upgrade to our Level for up to -1 comparisons!

We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.