KYOCERA AMERICA, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 6349
 
 
 
H01P WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE 461
 
 
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 2195
 
 
 
H01J ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS 1128
 
 
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1153

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2016/0377,823 OPTICAL MODULE AND OPTICAL MODULE PACKAGE INCORPORATING A HIGH-THERMAL-EXPANSION CERAMIC SUBSTRATEJun 24, 16Dec 29, 16[G02B]
2016/0035,686 CHIP ATTACHMENT SYSTEMJul 31, 15Feb 04, 16[H01L]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9331000 Heat management in electronics packagingApr 02, 15May 03, 16[H01L]
8547187 Printed circuit board impedance matching step for microwave (millimeter wave) devicesSep 30, 10Oct 01, 13[H03H, H01P]
7808341 Broadband RF connector interconnect for multilayer electronic packagesFeb 21, 07Oct 05, 10[H01P]
7582964 Semiconductor package having non-ceramic based window frameNov 19, 07Sep 01, 09[H01L]
7298046 Semiconductor package having non-ceramic based window frameJan 10, 03Nov 20, 07[H01L]
7053729 Impedence matching along verticle path of microwave vias in multilayer packagesAug 23, 04May 30, 06[H01P]
6900525 Semiconductor package having filler metal of gold/silver/copper alloyMay 21, 03May 31, 05[H01L]
6796725 Opto-electronic package for integrated sealing of optical fibersOct 05, 01Sep 28, 04[G02B]
6727117 Semiconductor substrate having copper/diamond composite material and method of making sameNov 07, 02Apr 27, 04[H01L]
6703559 Feedthrough assembly having cut-out areas in metal housing adjacent ceramic feedthroughJul 19, 01Mar 09, 04[H01J, H05K]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2006/0109,063 Matching for ring hybridABANNov 23, 04May 25, 06[H01P]
6204448 High frequency microwave packaging having a dielectric gapExpiredDec 04, 98Mar 20, 01[H05K]
6046707 Ceramic multilayer helical antenna for portable radio or microwave communication apparatusExpiredJul 02, 97Apr 04, 00[H01Q]
5482735 Method for making multi-layer ceramic packagesExpiredSep 02, 94Jan 09, 96[B05D]
5345038 Multi-layer ceramic packagesExpiredJul 29, 91Sep 06, 94[H01L]
5314606 Leadless ceramic package with improved solderabiltyExpiredFeb 16, 93May 24, 94[C25D]
5258575 Ceramic glass integrated circuit package with integral ground and power planesExpiredApr 22, 91Nov 02, 93[H05K]
5231036 Method of using a contamination shield during the manufacture of EPROM semiconductor package windowsExpiredAug 03, 92Jul 27, 93[H01L]
5196919 Use of a contamination shield during the manufacture of semiconductor packagesExpiredDec 07, 90Mar 23, 93[H01L]
5160747 Apparatus for manufacturing ceramic chip-resistant chamfered integrated circuit packageExpiredAug 05, 91Nov 03, 92[B29C]
5137767 Partially coated assembly structure and method for making a ceramic lid for hermetic sealing of an eprom circuitExpiredAug 29, 90Aug 11, 92[B32B]
5134246 Ceramic-glass integrated circuit package with integral ground and power planesExpiredJan 16, 91Jul 28, 92[H01L]
5095360 Ceramic chip-resistant chamfered integrated circuit packageExpiredOct 10, 90Mar 10, 92[H01L]
5068210 Low dielectric constant ceramic materialsExpiredMay 17, 88Nov 26, 91[C03C]
5043004 Method for making a ceramic lid for hermetic sealing of an EPROM circuitExpiredAug 29, 90Aug 27, 91[C03Z]
4992628 Ceramic-glass integrated circuit package with ground planeExpiredMay 07, 90Feb 12, 91[H05K]
4982494 Methods of making a low capacitance integrated circuit packageExpiredJan 31, 90Jan 08, 91[H01R]
4931854 Low capacitance integrated circuit packageExpiredFeb 06, 89Jun 05, 90[H01L]
4755490 Low firing temperature ceramic materialsExpiredOct 19, 87Jul 05, 88[C04B, C03C]

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