Kyushu Fujitsu Electronics Limited

Patent Owner

Watch Compare Add to Portfolio

Stats

Details

Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2360

Top Patents (by citation)

Upgrade to the Professional Level to View Top Patents for this Owner. Learn More

Recent Publications

  • No Recent Publications to Display

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
5367191 Leadframe and resin-sealed semiconductor deviceSep 16, 92Nov 22, 94[H01L]
5293064 Lead frame and method of manufacturing a semiconductor deviceFeb 03, 92Mar 08, 94[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
6379997 Semiconductor device and method of producing the same and semiconductor device unit and method of producing the sameExpiredJun 13, 00Apr 30, 02[H01L]
6111306 Semiconductor device and method of producing the same and semiconductor device unit and method of producing the sameExpiredOct 06, 97Aug 29, 00[H01L]
6034428 Semiconductor integrated circuit device having stacked wiring and insulating layersExpiredNov 08, 96Mar 07, 00[H01L]
5821613 Semiconductor device in which semiconductor chip has bottom surface with reduced level of organic compounds relatively to other sufaces thereofExpiredAug 28, 97Oct 13, 98[H01L]
5804467 Semiconductor device and method of producing the sameExpiredMay 13, 97Sep 08, 98[H01L]
5804468 Process for manufacturing a packaged semiconductor having a divided leadframe stageExpiredNov 21, 95Sep 08, 98[H01L]
5750421 Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor deviceExpiredJan 27, 97May 12, 98[H01L]
5736428 Process for manufacturing a semiconductor device having a stepped encapsulated packageExpiredJan 27, 97Apr 07, 98[H01L]
5731720 Semiconductor integrated circuit device capable of reducing power consumptionExpiredJan 21, 97Mar 24, 98[H03K]
5724233 Semiconductor device having first and second semiconductor chips with a gap therebetween, a die stage in the gap and associated lead frames disposed in a package, the lead frames providing electrical connections from the chips to an exterior of the packagExpiredMay 15, 96Mar 03, 98[H01L, H05K]
5679978 Semiconductor device having resin gate hole through substrate for resin encapsulationExpiredOct 24, 94Oct 21, 97[H01L]
5666064 Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor deviceExpiredMay 15, 95Sep 09, 97[G01R]
5637915 Semiconductor device affixed to an upper and a lower leadframeExpiredAug 13, 96Jun 10, 97[H01L]
5637923 Semiconductor device, carrier for carrying semiconductor deviceExpiredMay 31, 95Jun 10, 97[H01L]
5579208 Semiconductor device having a plurality of semiconductor chipsExpiredJun 02, 95Nov 26, 96[H01L, H05K]
5497032 Semiconductor device and lead frame thereforeExpiredMar 16, 94Mar 05, 96[H01L]
5479051 Semiconductor device having a plurality of semiconductor chipsExpiredSep 24, 93Dec 26, 95[H01L]
5475259 Semiconductor device and carrier for carrying semiconductor deviceExpiredOct 16, 92Dec 12, 95[H01L]
5471369 Semiconductor device having a plurality of semiconductor chipsExpiredMar 17, 94Nov 28, 95[H01L, H05K]
5447888 Process of ejecting an encapsulated semiconductor device from a mold by directly contacting exterior leads with ejector pinsExpiredFeb 08, 94Sep 05, 95[H01L, B29C]

View all patents..

Top Inventors for This Owner

Upgrade to the Professional Level to View Top Inventors for this Owner. Learn More

We are sorry but your current selection exceeds the maximum number of comparisons () for this membership level. Upgrade to our Level for up to -1 comparisons!

We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.