Kyushu Fujitsu Electronics Limited
Patent Owner
Stats
- 2 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- Apr 30, 2002 most recent publication
Details
- 2 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 852 Total Citation Count
- Nov 08, 1988 Earliest Filing
- 30 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
Rank in Class
Top Patents (by citation)
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Recent Publications
- No Recent Publications to Display
Recent Patents
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
6379997 Semiconductor device and method of producing the same and semiconductor device unit and method of producing the sameExpiredJun 13, 00Apr 30, 02[H01L]
6111306 Semiconductor device and method of producing the same and semiconductor device unit and method of producing the sameExpiredOct 06, 97Aug 29, 00[H01L]
6034428 Semiconductor integrated circuit device having stacked wiring and insulating layersExpiredNov 08, 96Mar 07, 00[H01L]
5821613 Semiconductor device in which semiconductor chip has bottom surface with reduced level of organic compounds relatively to other sufaces thereofExpiredAug 28, 97Oct 13, 98[H01L]
5804468 Process for manufacturing a packaged semiconductor having a divided leadframe stageExpiredNov 21, 95Sep 08, 98[H01L]
5750421 Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor deviceExpiredJan 27, 97May 12, 98[H01L]
5736428 Process for manufacturing a semiconductor device having a stepped encapsulated packageExpiredJan 27, 97Apr 07, 98[H01L]
5731720 Semiconductor integrated circuit device capable of reducing power consumptionExpiredJan 21, 97Mar 24, 98[H03K]
5724233 Semiconductor device having first and second semiconductor chips with a gap therebetween, a die stage in the gap and associated lead frames disposed in a package, the lead frames providing electrical connections from the chips to an exterior of the packagExpiredMay 15, 96Mar 03, 98[H01L, H05K]
5679978 Semiconductor device having resin gate hole through substrate for resin encapsulationExpiredOct 24, 94Oct 21, 97[H01L]
5666064 Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor deviceExpiredMay 15, 95Sep 09, 97[G01R]
5637915 Semiconductor device affixed to an upper and a lower leadframeExpiredAug 13, 96Jun 10, 97[H01L]
5637923 Semiconductor device, carrier for carrying semiconductor deviceExpiredMay 31, 95Jun 10, 97[H01L]
5579208 Semiconductor device having a plurality of semiconductor chipsExpiredJun 02, 95Nov 26, 96[H01L, H05K]
5479051 Semiconductor device having a plurality of semiconductor chipsExpiredSep 24, 93Dec 26, 95[H01L]
5475259 Semiconductor device and carrier for carrying semiconductor deviceExpiredOct 16, 92Dec 12, 95[H01L]
5471369 Semiconductor device having a plurality of semiconductor chipsExpiredMar 17, 94Nov 28, 95[H01L, H05K]
5447888 Process of ejecting an encapsulated semiconductor device from a mold by directly contacting exterior leads with ejector pinsExpiredFeb 08, 94Sep 05, 95[H01L, B29C]
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