LAM RESEARCH CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology MATTERS Rank in Class
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 989 40
 
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 405 3
 
 
B08B CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL 251 2
 
 
H01J ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS 212 21
 
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 206 3
 
 
H05H PLASMA TECHNIQUE 102 3
 
 
B44C PRODUCING DECORATIVE EFFECTS 72 4
 
 
G06F ELECTRIC DIGITAL DATA PROCESSING 67 346
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 55 100
 
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 48 43
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Top Patents (by citation)

Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2016/0247,688 METHOD FOR ACHIEVING ULTRA-HIGH SELECTIVITY WHILE ETCHING SILICON NITRIDE Apr 01, 15 Aug 25, 16 [H01L]
2016/0240,356 SYSTEMS AND METHODS FOR USING MULTIPLE INDUCTIVE AND CAPACITIVE FIXTURES FOR APPLYING A VARIETY OF PLASMA CONDITIONS TO DETERMINE A MATCH NETWORK MODEL Mar 03, 16 Aug 18, 16 [G01R, H01J]
2016/0233,102 FABRICATION OF A SILICON STRUCTURE AND DEEP SILICON ETCH WITH PROFILE CONTROL Apr 20, 16 Aug 11, 16 [H01J, H01L]
2016/0233,114 CHAMBERS FOR PARTICLE REDUCTION IN SUBSTRATE PROCESSING SYSTEMS Feb 05, 15 Aug 11, 16 [C23C, H01L]
2016/0233,220 TUNGSTEN FOR WORDLINE APPLICATIONS Feb 10, 16 Aug 11, 16 [H01L]
2016/0222,508 MODULAR VAPORIZER Jan 30, 15 Aug 04, 16 [C23C, H05B, F22B]
2016/0222,535 GEOMETRY AND PROCESS OPTIMIZATION FOR ULTRA-HIGH RPM PLATING Feb 03, 15 Aug 04, 16 [C25D]
2016/0225,584 PLASMA PROCESSING SYSTEMS INCLUDING SIDE COILS AND METHODS RELATED TO THE PLASMA PROCESSING SYSTEMS Apr 06, 16 Aug 04, 16 [H01J]
2016/0225,588 SYSTEMS AND METHODS FOR DECREASING CARBON-HYDROGEN CONTENT OF AMORPHOUS CARBON HARDMASK FILMS Feb 03, 15 Aug 04, 16 [C23C, H01J]
2016/0225,632 METAL DOPING OF AMORPHOUS CARBON AND SILICON FILMS USED AS HARDMASKS IN SUBSTRATE PROCESSING SYSTEMS Feb 03, 15 Aug 04, 16 [C23C, H01J, H01L]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9,425,025 Mixed mode pulsing etching in plasma processing systems Oct 09, 14 Aug 23, 16 [H01J]
9,425,041 Isotropic atomic layer etch for silicon oxides using no activation Jan 06, 15 Aug 23, 16 [H01L]
9,425,078 Inhibitor plasma mediated atomic layer deposition for seamless feature fill Feb 25, 15 Aug 23, 16 [C23C, H01L]
9,418,859 Plasma-enhanced etching in an augmented plasma processing system Apr 01, 15 Aug 16, 16 [H01J, H01L]
9,418,869 Method to etch a tungsten containing layer Jul 29, 14 Aug 16, 16 [H01L]
9,418,889 Selective formation of dielectric barriers for metal interconnects in semiconductor devices Jun 17, 15 Aug 16, 16 [H01L]
9,412,555 Lower electrode assembly of plasma processing chamber Oct 30, 09 Aug 09, 16 [H01J]
9,412,609 Highly selective oxygen free silicon nitride etch May 29, 15 Aug 09, 16 [H01L]
9,412,670 System, method and apparatus for RF power compensation in plasma etch chamber May 23, 13 Aug 09, 16 [H01J, H01L, G01L]
9,406,534 Wet clean process for cleaning plasma processing chamber components Oct 27, 14 Aug 02, 16 [B08B, H01L]
9,406,535 Ion injector and lens system for ion beam milling Aug 29, 14 Aug 02, 16 [B44C, H01J, H01L]
9,406,544 Systems and methods for eliminating seams in atomic layer deposition of silicon dioxide film in gap fill applications Jun 12, 15 Aug 02, 16 [H01L]
9,406,556 Method of making an interconnect device Oct 04, 13 Aug 02, 16 [B08B, C11D, H01L]
9,408,288 Edge ramping Oct 24, 12 Aug 02, 16 [H05B, H01J, H05H]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0079,100 VACUUM CARRIER INTERFACE HAVING A SWITCHABLE REDUCED CAPACITY AIRLOCK CHAMBER ABAN Sep 17, 14 Mar 17, 16 [C23C, H01L, B25J]
2015/0376,792 ATMOSPHERIC PLASMA APPARATUS FOR SEMICONDUCTOR PROCESSING ABAN Jun 30, 14 Dec 31, 15 [C23C, H01L, C25D]
2015/0155,176 SIDEWALL HEIGHT NONUNIFORMITY REDUCTION FOR SIDEWALL IMAGE TRANSFER PROCESSES ABAN Dec 03, 13 Jun 04, 15 [H01L]
2015/0079,786 METHOD AND SOLUTION FOR CLEANING METAL RESIDUE ABAN Sep 17, 13 Mar 19, 15 [C09K, H01L]
2015/0040,947 Method and Systems for Cleaning A Substrate ABAN Aug 07, 13 Feb 12, 15 [H01L]
2015/0037,979 CONFORMAL SIDEWALL PASSIVATION ABAN Aug 02, 13 Feb 05, 15 [H01L]
2014/0332,037 Controls of Ambient Environment During Wafer Drying Using Proximity Head ABAN May 28, 14 Nov 13, 14 [H01L]
2014/0261,535 Standing Wave Generation in Holes to Enhance Cleaning in the Holes in Liquid Sonification Cleaning Systems ABAN Mar 13, 13 Sep 18, 14 [B08B]
2014/0263,179 TUNING SYSTEM AND METHOD FOR PLASMA-BASED SUBSTRATE PROCESSING SYSTEMS ABAN Mar 15, 13 Sep 18, 14 [H01J, H01P]
2014/0179,097 DEPOSITION APPARATUS AND METHOD ABAN Dec 21, 12 Jun 26, 14 [H01L]
2014/0170,780 Method of Low-K Dielectric Film Repair ABAN Feb 24, 14 Jun 19, 14 [H01L]
2014/0127,911 PALLADIUM PLATED ALUMINUM COMPONENT OF A PLASMA PROCESSING CHAMBER AND METHOD OF MANUFACTURE THEREOF ABAN Nov 07, 12 May 08, 14 [H01L, C25D]
2014/0113,453 TUNGSTEN CARBIDE COATED METAL COMPONENT OF A PLASMA REACTOR CHAMBER AND METHOD OF COATING ABAN Oct 24, 12 Apr 24, 14 [C23C, B32B, H01L]
2014/0083,463 SYSTEM AND METHOD FOR MONITORING WAFER STRESS ABAN Sep 21, 12 Mar 27, 14 [B08B]
2014/0059,789 Apparatus for Cleaning a Semiconductor Substrate ABAN Oct 16, 13 Mar 06, 14 [H01L]
2014/0053,984 SYMMETRIC RETURN LINER FOR MODULATING AZIMUTHAL NON-UNIFORMITY IN A PLASMA PROCESSING SYSTEM ABAN Nov 29, 12 Feb 27, 14 [B05C, H05H]
2014/0051,255 COPPER DISCOLORATION PREVENTION FOLLOWING BEVEL ETCH PROCESS ABAN Oct 28, 13 Feb 20, 14 [H01L]
2014/0041,581 Single Substrate Processing Head For Particle Removal Using Low Viscosity Fluid ABAN Oct 11, 13 Feb 13, 14 [H01L]
2014/0034,096 Acoustic Assisted Single Wafer Wet Clean For Semiconductor Wafer Process ABAN Oct 09, 13 Feb 06, 14 [H01L]
2014/0030,893 METHOD FOR SHRINK AND TUNE TRENCH/VIA CD ABAN Jul 24, 12 Jan 30, 14 [H01L]

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