LAM RESEARCH CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology MATTERS Rank in Class
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 841 44
 
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 308 3
 
 
B08B CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL 254 2
 
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 209 3
 
 
H01J ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS 110 41
 
 
H05H PLASMA TECHNIQUE 108 3
 
 
B44C PRODUCING DECORATIVE EFFECTS 76 3
 
 
G06F ELECTRIC DIGITAL DATA PROCESSING 66 332
 
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 47 35
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 47 97
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Top Patents (by citation)

Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2015/0202,774 TOUCH AUTO-CALIBRATION OF PROCESS MODULES Jan 23, 14 Jul 23, 15 [H01L, B25J]
2015/0203,967 METHOD AND APPARATUS FOR THE REDUCTION OF DEFECTIVITY IN VAPOR DEPOSITED FILMS Jan 17, 14 Jul 23, 15 [C23C]
2015/0206,770 Methods and Apparatuses for Electroplating and Seed Layer Detection Jan 21, 14 Jul 23, 15 [H01L, C25D]
2015/0206,774 APPARATUS FOR ATOMIC LAYERING ETCHING Dec 11, 13 Jul 23, 15 [H01J, H01L]
2015/0198,639 Cable Power Loss Determination For Virtual Metrology Jan 10, 14 Jul 16, 15 [G01R]
2015/0194,291 SHOWERHEAD ELECTRODE ASSEMBLY IN A CAPACITIVELY COUPLED PLASMA PROCESSING APPARATUS Mar 19, 15 Jul 09, 15 [H01J, H01L]
2015/0184,292 SYSTEMS AND METHODS FOR PREVENTING MIXING OF TWO GAS STREAMS IN A PROCESSING CHAMBER Dec 15, 14 Jul 02, 15 [C23C]
2015/0184,296 COATING SYSTEM AND METHOD FOR COATING INTERIOR FLUID WETTED SURFACES OF A COMPONENT OF A SEMICONDUCTOR SUBSTRATE PROCESSING APPARATUS Dec 16, 14 Jul 02, 15 [C23C, H01L]
2015/0187,614 EDGE SEAL FOR LOWER ELECTRODE ASSEMBLY Dec 26, 13 Jul 02, 15 [H01J, H01L]
2015/0187,615 COMPONENT OF A PLASMA PROCESSING APPARATUS INCLUDING AN ELECTRICALLY CONDUCTIVE AND NONMAGNETIC COLD SPRAYED COATING Dec 22, 14 Jul 02, 15 [C23C, H01L, C25D]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9,079,228 Methodology for cleaning of surface metal contamination from an upper electrode used in a plasma chamber Dec 07, 10 Jul 14, 15 [B08B]
9,082,594 Etch rate modeling and use thereof for in-chamber and chamber-to-chamber matching Jun 27, 14 Jul 14, 15 [G05B, H01J]
9,082,805 System and method for testing an electrostatic chuck Feb 13, 12 Jul 14, 15 [H01L]
9,082,826 Methods and apparatuses for void-free tungsten fill in three-dimensional semiconductor features May 22, 14 Jul 14, 15 [H01L]
9,083,182 Bypass capacitors for high voltage bias power in the mid frequency RF range Nov 21, 12 Jul 14, 15 [H01T, H02H, H01J, H01L, H05F]
9,074,285 Systems for detecting unconfined-plasma events Apr 11, 08 Jul 07, 15 [C23F, C23C, H05H, H01J]
9,076,634 Replaceable upper chamber parts of plasma processing apparatus Sep 10, 10 Jul 07, 15 [H01J]
9,076,646 Plasma enhanced atomic layer deposition with pulsed plasma exposure Dec 30, 13 Jul 07, 15 [C23C, H01L]
9,076,826 Plasma confinement ring assembly for plasma processing chambers Feb 04, 11 Jul 07, 15 [C23F, H01L]
9,076,831 Substrate clamping system and method for operating the same Mar 01, 12 Jul 07, 15 [H01L]
9,076,844 Process integration scheme to lower overall dielectric constant in BEoL interconnect structures Feb 05, 09 Jul 07, 15 [H01L]
9,070,745 Methods and systems for forming semiconductor laminate structures Dec 13, 13 Jun 30, 15 [H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2014/0113,453 TUNGSTEN CARBIDE COATED METAL COMPONENT OF A PLASMA REACTOR CHAMBER AND METHOD OF COATING ABAN Oct 24, 12 Apr 24, 14 [C23C, B32B, H01L]
2014/0076,713 Edge Ramping ABAN Oct 24, 12 Mar 20, 14 [H05H]
2014/0059,789 Apparatus for Cleaning a Semiconductor Substrate ABAN Oct 16, 13 Mar 06, 14 [H01L]
2014/0051,255 COPPER DISCOLORATION PREVENTION FOLLOWING BEVEL ETCH PROCESS ABAN Oct 28, 13 Feb 20, 14 [H01L]
2014/0034,096 Acoustic Assisted Single Wafer Wet Clean For Semiconductor Wafer Process ABAN Oct 09, 13 Feb 06, 14 [H01L]
2013/0267,097 METHOD AND APPARATUS FOR FORMING FEATURES WITH PLASMA PRE-ETCH TREATMENT ON PHOTORESIST ABAN Apr 05, 12 Oct 10, 13 [C23F, H01L]
2013/0171,820 METHODS FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT THROUGH HOLE VIA GAPFILL AND OVERBURDEN REMOVAL ABAN Nov 30, 12 Jul 04, 13 [H01L]
2013/0062,735 METHOD FOR FORMING STAIR-STEP STRUCTURES ABAN Nov 05, 12 Mar 14, 13 [H01L]
2013/0056,087 UNIVERSAL FLUID FLOW ADAPTOR ABAN Oct 29, 12 Mar 07, 13 [F16L]
2012/0318,455 PASSIVE COMPENSATION FOR TEMPERATURE-DEPENDENT WAFER GAP CHANGES IN PLASMA PROCESSING SYSTEMS ABAN Jun 14, 11 Dec 20, 12 [C23F]
2012/0260,517 Apparatus and Method for Reducing Substrate Pattern Collapse During Drying Operations ABAN Apr 18, 11 Oct 18, 12 [F26B]
2012/0263,869 Methods for Forming a Barrier Layer with Periodic Concentrations of Elements and Structures Resulting Therefrom ABAN Jun 26, 12 Oct 18, 12 [B05D]
2012/0175,060 DETECTION OF ARCING EVENTS IN WAFER PLASMA PROCESSING THROUGH MONITORING OF TRACE GAS CONCENTRATIONS ABAN Mar 16, 12 Jul 12, 12 [C23C, H01L]
2012/0145,202 Cleaning Compound and Method and System for Using the Cleaning Compound ABAN Feb 14, 12 Jun 14, 12 [B08B]
2012/0118,320 Methods for Isolated Bevel Edge Clean ABAN Jan 24, 12 May 17, 12 [B08B]
2012/0115,332 Method of Post Etch Polymer Residue Removal ABAN Jan 19, 12 May 10, 12 [H01L]
2012/0101,917 BUSINESS MOBILE COMMUNICATION SYSTEM ABAN Oct 03, 11 Apr 26, 12 [G06Q]
2012/0088,370 Substrate Processing System with Multiple Processing Devices Deployed in Shared Ambient Environment and Associated Methods ABAN Oct 06, 10 Apr 12, 12 [C23C, H01L, B05B]
2012/0056,325 METHODS OF FABRICATING ELECTRONIC DEVICES USING DIRECT COPPER PLATING ABAN Nov 10, 11 Mar 08, 12 [H01L]
2012/0024,314 PLASMA MEDIATED ASHING PROCESSES ABAN Jul 27, 10 Feb 02, 12 [B08B]

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