LAM RESEARCH CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology MATTERS Rank in Class
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 1174 38
 
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 528 3
 
 
H01J ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS 349 12
 
 
B08B CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL 229 2
 
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 211 3
 
 
H05H PLASMA TECHNIQUE 103 3
 
 
B44C PRODUCING DECORATIVE EFFECTS 74 3
 
 
G06F ELECTRIC DIGITAL DATA PROCESSING 70 377
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 59 101
 
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 53 44
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Top Patents (by citation)

Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0073,137 SYSTEMS AND METHODS FOR REDUCING EFFLUENT BUILD-UP IN A PUMPING EXHAUST SYSTEM Sep 13, 16 Mar 15, 18 [C23C, H01L]
2018/0076,028 Systems and Methods for UV-Based Suppression of Plasma Instability Sep 09, 16 Mar 15, 18 [C23C, H01L]
2018/0065,274 METHOD AND APPARATUS FOR FORMING CERAMIC PARTS IN HOT ISOSTATIC PRESS USING ULTRASONICS Sep 02, 16 Mar 08, 18 [C04B, B28B]
2018/0057,940 ROTARY FRICTION WELDED BLANK FOR PECVD HEATED SHOWERHEAD Aug 23, 16 Mar 01, 18 [C23C, B23K]
2018/0061,628 SELECTIVE ATOMIC LAYER DEPOSITION FOR GAPFILL USING SACRIFICIAL UNDERLAYER Aug 31, 16 Mar 01, 18 [H01L]
2018/0061,650 HIGH DRY ETCH RATE MATERIALS FOR SEMICONDUCTOR PATTERNING APPLICATIONS Aug 31, 16 Mar 01, 18 [H01L]
2018/0061,659 SILICON-BASED DEPOSITION FOR SEMICONDUCTOR PROCESSING Aug 23, 16 Mar 01, 18 [H01L]
2018/0061,663 CONTINUOUS AND PULSED RF PLASMA FOR ETCHING METALS Aug 28, 17 Mar 01, 18 [C23C, H01J, H01L]
2018/0053,629 CONTROL OF ON-WAFER CD UNIFORMITY WITH MOVABLE EDGE RING AND GAS INJECTION ADJUSTMENT Aug 19, 16 Feb 22, 18 [C23C, H01J]
2018/0053,660 METHOD FOR PREVENTING LINE BENDING DURING METAL FILL PROCESS Aug 09, 17 Feb 22, 18 [H01L]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9920844 Valve manifold deadleg elimination via reentrant flow path Jul 22, 15 Mar 20, 18 [F16K, B08B]
9922804 Compression member for use in showerhead electrode assembly May 12, 15 Mar 20, 18 [C23C, H01J, H01L]
9922839 Low roughness EUV lithography Jun 22, 16 Mar 20, 18 [H01L]
9922855 Method for reducing temperature transition in an electrostatic chuck Aug 31, 17 Mar 20, 18 [H01L, G05D]
9922857 Electrostatically clamped edge ring Nov 03, 16 Mar 20, 18 [H01J, H01L]
9916977 Low k dielectric deposition via UV driven photopolymerization Nov 16, 15 Mar 13, 18 [C23C, H01L]
9916993 Ion injector and lens system for ion beam milling Jun 23, 16 Mar 13, 18 [H01J, H01L, C03C]
9916995 Compact substrate processing tool with multi-station processing and pre-processing and/or post-processing stations Feb 23, 15 Mar 13, 18 [C23C, H01L]
9918376 Hybrid impedance matching for inductively coupled plasma system Jun 11, 15 Mar 13, 18 [H03H, H05H, H01J]
9909228 Method and apparatus for dynamic current distribution control during electroplating Oct 30, 13 Mar 06, 18 [C25D]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2017/0323,785 METHOD TO DEPOSIT CONFORMAL AND LOW WET ETCH RATE ENCAPSULATION LAYER USING PECVD ABAN Sep 28, 16 Nov 09, 17 [C23C, H01J, H01L]
2017/0040,146 PLASMA ETCHING DEVICE WITH PLASMA ETCH RESISTANT COATING ABAN Aug 03, 15 Feb 09, 17 [C23C, H01J]
2016/0375,515 USE OF ATOMIC LAYER DEPOSITION COATINGS TO PROTECT BRAZING LINE AGAINST CORROSION, EROSION, AND ARCING ABAN Jun 29, 15 Dec 29, 16 [C23C, B23K, H01J, B32B, C25D]
2016/0379,806 USE OF PLASMA-RESISTANT ATOMIC LAYER DEPOSITION COATINGS TO EXTEND THE LIFETIME OF POLYMER COMPONENTS IN ETCH CHAMBERS ABAN Jun 25, 15 Dec 29, 16 [C23C, B32B, H01J, H02N, H01L]
2016/0355,939 POLARIZATION STABILIZER ADDITIVE FOR ELECTROPLATING ABAN Jun 05, 15 Dec 08, 16 [C25D]
2016/0329,206 METHODS OF MODULATING RESIDUAL STRESS IN THIN FILMS ABAN May 08, 15 Nov 10, 16 [H01L]
2016/0270,237 Copper Interconnect Device Including Surface Functionalized Graphene Capping Layer and Fabrication Method Thereof ABAN Mar 07, 16 Sep 15, 16 [H05K]
2016/0254,125 METHOD FOR COATING SURFACES ABAN Feb 27, 15 Sep 01, 16 [C23C, H01J]
2016/0233,114 CHAMBERS FOR PARTICLE REDUCTION IN SUBSTRATE PROCESSING SYSTEMS ABAN Feb 05, 15 Aug 11, 16 [C23C, H01L]
2016/0181,116 SELECTIVE NITRIDE ETCH ABAN Dec 18, 14 Jun 23, 16 [C09K, H01L]
2016/0148,813 GAS INJECTION METHOD FOR UNIFORMLY PROCESSING A SEMICONDUCTOR SUBSTRATE IN A SEMICONDUCTOR SUBSTRATE PROCESSING APPARATUS ABAN Nov 25, 14 May 26, 16 [H01L]
2016/0138,160 REACTIVE ULTRAVIOLET THERMAL PROCESSING OF LOW DIELECTRIC CONSTANT MATERIALS ABAN Nov 18, 14 May 19, 16 [C23C]
2016/0111,257 SUBSTRATE FOR MOUNTING GAS SUPPLY COMPONENTS AND METHODS THEREOF ABAN Oct 17, 14 Apr 21, 16 [B32B, H01J, H01L, F17D]
2016/0111,342 METHOD AND APPARATUS FOR CHARACTERIZING METAL OXIDE REDUCTION ABAN Oct 15, 15 Apr 21, 16 [C23C, H01J, H01L, G01N]
2016/0079,100 VACUUM CARRIER INTERFACE HAVING A SWITCHABLE REDUCED CAPACITY AIRLOCK CHAMBER ABAN Sep 17, 14 Mar 17, 16 [C23C, H01L, B25J]
2016/0042,943 LOW-K DIELECTRIC FILM FORMATION ABAN Sep 05, 14 Feb 11, 16 [H01J, H01L]
2016/0042,945 COVERAGE OF HIGH ASPECT RATIO FEATURES USING SPIN-ON DIELECTRIC THROUGH A WETTED SURFACE WITHOUT A PRIOR DRYING STEP ABAN Aug 11, 14 Feb 11, 16 [H01L]
2015/0376,792 ATMOSPHERIC PLASMA APPARATUS FOR SEMICONDUCTOR PROCESSING ABAN Jun 30, 14 Dec 31, 15 [C23C, H01L, C25D]
2015/0380,278 HARDWARE FOR THE SEPARATION AND DEGASSING OF DISSOLVED GASES IN SEMICONDUCTOR PRECURSOR CHEMICALS ABAN Jun 30, 14 Dec 31, 15 [H01L, B01D]
2015/0380,296 CLEANING OF CARBON-BASED CONTAMINANTS IN METAL INTERCONNECTS FOR INTERCONNECT CAPPING APPLICATIONS ABAN Jun 25, 14 Dec 31, 15 [C23C, H01L]

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