LAM RESEARCH CORPORATION

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Technologies

Intl Class Technology MATTERS Rank in Class
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 1141 39
 
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 500 3
 
 
H01J ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS 326 12
 
 
B08B CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL 228 2
 
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 208 3
 
 
H05H PLASMA TECHNIQUE 102 3
 
 
B44C PRODUCING DECORATIVE EFFECTS 74 3
 
 
G06F ELECTRIC DIGITAL DATA PROCESSING 69 368
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 59 107
 
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 52 45
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Top Patents (by citation)

Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0350,008 ATOMIC LAYER DEPOSITION OF TUNGSTEN FOR ENHANCED FILL AND REDUCED SUBSTRATE ATTACK Jun 02, 16 Dec 07, 17 [C23C]
2017/0352,461 Valve Operation Booster Jun 03, 16 Dec 07, 17 [F16K, H01F]
2017/0342,562 VAPOR MANIFOLD WITH INTEGRATED VAPOR CONCENTRATION SENSOR May 31, 16 Nov 30, 17 [C23C, H01L]
2017/0342,583 DYNAMIC MODULATION OF CROSS FLOW MANIFOLD DURING ELECROPLATING Aug 01, 16 Nov 30, 17 [C25D]
2017/0342,590 MODULATION OF APPLIED CURRENT DURING SEALED ROTATIONAL ELECTROPLATING Jan 23, 17 Nov 30, 17 [C25D]
2017/0335,450 VAPOR DELIVERY METHOD AND APPARATUS FOR SOLID AND LIQUID PRECURSORS May 15, 17 Nov 23, 17 [C23C]
2017/0338,140 PERMANENT SECONDARY EROSION CONTAINMENT FOR ELECTROSTATIC CHUCK BONDS May 18, 16 Nov 23, 17 [C23C, H01J, H01L]
2017/0327,952 APPARATUS FOR ELECTROLESS METAL DEPOSITION HAVING FILTER SYSTEM AND ASSOCIATED OXYGEN SOURCE Jul 28, 17 Nov 16, 17 [C23C]
2017/0330,728 ADJUSTABLE SIDE GAS PLENUM FOR EDGE RATE CONTROL IN A DOWNSTREAM REACTOR May 11, 16 Nov 16, 17 [C23C, H01J]
2017/0330,764 METHODS AND APPARATUSES FOR CONTROLLING TRANSITIONS BETWEEN CONTINUOUS WAVE AND PULSING PLASMAS May 05, 17 Nov 16, 17 [H01J, H01L]
2017/0330,797 MANGANESE BARRIER AND ADHESION LAYERS FOR COBALT May 10, 17 Nov 16, 17 [H01L]
2017/0332,480 LAMINATED HEATER WITH DIFFERENT HEATER TRACE MATERIALS May 03, 17 Nov 16, 17 [H05B, H05K]
2017/0332,481 CONNECTIONS BETWEEN LAMINATED HEATER AND HEATER VOLTAGE INPUTS May 03, 17 Nov 16, 17 [H05B, H05K]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9837252 Systems and methods for using one or more fixtures and efficiency to determine parameters of a match network model May 03, 16 Dec 05, 17 [G01R, H01J]
9837254 Differentially pumped reactive gas injector Aug 12, 14 Dec 05, 17 [C23F, H01J]
9837270 Densification of silicon carbide film using remote plasma treatment Dec 16, 16 Dec 05, 17 [H01L]
9837286 Systems and methods for selectively etching tungsten in a downstream reactor Feb 03, 16 Dec 05, 17 [H01J, H01L]
9837312 Atomic layer etching for enhanced bottom-up feature fill Oct 05, 16 Dec 05, 17 [C23C, H01J, H01L]
9828672 Minimizing radical recombination using ALD silicon oxide surface coating with intermittent restoration plasma May 14, 15 Nov 28, 17 [C23C, H01J, B05D]
9831065 Computation of statistics for statistical data decimation Feb 17, 16 Nov 28, 17 [H03H, H05H, H01J]
9831071 Systems and methods for using multiple inductive and capacitive fixtures for applying a variety of plasma conditions to determine a match network model Mar 03, 16 Nov 28, 17 [G01R, H01J]
9831110 Vision-based wafer notch position measurement Jul 30, 15 Nov 28, 17 [G06T, H01L]
9822460 Methods and apparatuses for electroplating and seed layer detection Jan 21, 14 Nov 21, 17 [H01L, C25D]
9824863 Plasma stabilization method and plasma apparatus Feb 27, 14 Nov 21, 17 [C23C, H01J, H01L]
9824865 Waferless clean in dielectric etch process Mar 05, 14 Nov 21, 17 [H01J]
9824884 Method for depositing metals free ald silicon nitride films using halide-based precursors Oct 06, 16 Nov 21, 17 [C23C, H01J, H01L]
9824893 Tin oxide thin film spacers in semiconductor device manufacturing Jun 28, 16 Nov 21, 17 [H01J, H01L]
9824896 Methods and systems for advanced ion control for etching processes Nov 04, 15 Nov 21, 17 [H01J, H01L]
9824904 Method and apparatus for controlling spatial temperature distribution Jan 12, 15 Nov 21, 17 [C23C, H05B, H01J, H01L]
9824941 Systems and methods for detection of plasma instability by electrical measurement Mar 18, 16 Nov 21, 17 [H01J, H01L]
9816194 Control of electrolyte flow dynamics for uniform electroplating Mar 19, 15 Nov 14, 17 [H01L, C25D]
9818617 Method of electroless plating using a solution with at least two borane containing reducing agents Dec 08, 16 Nov 14, 17 [C23C, H01L]
9818633 Equipment front end module for transferring wafers and method of transferring wafers Oct 17, 14 Nov 14, 17 [H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0355,939 POLARIZATION STABILIZER ADDITIVE FOR ELECTROPLATING ABAN Jun 05, 15 Dec 08, 16 [C25D]
2016/0329,206 METHODS OF MODULATING RESIDUAL STRESS IN THIN FILMS ABAN May 08, 15 Nov 10, 16 [H01L]
2016/0270,237 Copper Interconnect Device Including Surface Functionalized Graphene Capping Layer and Fabrication Method Thereof ABAN Mar 07, 16 Sep 15, 16 [H05K]
2016/0148,813 GAS INJECTION METHOD FOR UNIFORMLY PROCESSING A SEMICONDUCTOR SUBSTRATE IN A SEMICONDUCTOR SUBSTRATE PROCESSING APPARATUS ABAN Nov 25, 14 May 26, 16 [H01L]
2016/0138,160 REACTIVE ULTRAVIOLET THERMAL PROCESSING OF LOW DIELECTRIC CONSTANT MATERIALS ABAN Nov 18, 14 May 19, 16 [C23C]
2016/0079,100 VACUUM CARRIER INTERFACE HAVING A SWITCHABLE REDUCED CAPACITY AIRLOCK CHAMBER ABAN Sep 17, 14 Mar 17, 16 [C23C, H01L, B25J]
2016/0042,943 LOW-K DIELECTRIC FILM FORMATION ABAN Sep 05, 14 Feb 11, 16 [H01J, H01L]
2016/0042,945 COVERAGE OF HIGH ASPECT RATIO FEATURES USING SPIN-ON DIELECTRIC THROUGH A WETTED SURFACE WITHOUT A PRIOR DRYING STEP ABAN Aug 11, 14 Feb 11, 16 [H01L]
2015/0376,792 ATMOSPHERIC PLASMA APPARATUS FOR SEMICONDUCTOR PROCESSING ABAN Jun 30, 14 Dec 31, 15 [C23C, H01L, C25D]
2015/0380,278 HARDWARE FOR THE SEPARATION AND DEGASSING OF DISSOLVED GASES IN SEMICONDUCTOR PRECURSOR CHEMICALS ABAN Jun 30, 14 Dec 31, 15 [H01L, B01D]
2015/0380,296 CLEANING OF CARBON-BASED CONTAMINANTS IN METAL INTERCONNECTS FOR INTERCONNECT CAPPING APPLICATIONS ABAN Jun 25, 14 Dec 31, 15 [C23C, H01L]
2015/0307,994 ELECTROLESS DEPOSITION OF CONTINUOUS NICKEL LAYER USING COMPLEXED Ti3+ METAL IONS AS REDUCING AGENTS ABAN Apr 29, 14 Oct 29, 15 [C23C]
2015/0299,882 NICKEL ELECTROPLATING SYSTEMS HAVING A GRAIN REFINER RELEASING DEVICE ABAN Apr 18, 14 Oct 22, 15 [H01L, C25D]
2015/0299,886 METHOD AND APPARATUS FOR PREPARING A SUBSTRATE WITH A SEMI-NOBLE METAL LAYER ABAN Apr 18, 14 Oct 22, 15 [H01L, C25D]
2015/0247,238 RF CYCLE PURGING TO REDUCE SURFACE ROUGHNESS IN METAL OXIDE AND METAL NITRIDE FILMS ABAN Mar 03, 14 Sep 03, 15 [C23C, H01L]
2015/0235,889 SYSTEM AND METHOD FOR PERFORMING HOT WATER SEAL ON ELECTROSTATIC CHUCK ABAN May 05, 15 Aug 20, 15 [H01L]
2015/0225,679 PROCESSES AND SOLUTIONS FOR SUBSTRATE CLEANING AND ELECTROLESS DEPOSITION ABAN Apr 17, 15 Aug 13, 15 [C23C, C11D, H01L]
2015/0155,176 SIDEWALL HEIGHT NONUNIFORMITY REDUCTION FOR SIDEWALL IMAGE TRANSFER PROCESSES ABAN Dec 03, 13 Jun 04, 15 [H01L]
2015/0136,171 LIQUID OR VAPOR INJECTION PLASMA ASHING SYSTEMS AND METHODS ABAN Nov 18, 13 May 21, 15 [H01J, H01L]
2015/0079,786 METHOD AND SOLUTION FOR CLEANING METAL RESIDUE ABAN Sep 17, 13 Mar 19, 15 [C09K, H01L]

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