LAM RESEARCH CORPORATION

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Intl Class Technology # of Patents/ App Rank in Class
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 765 48
 
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 281 3
 
 
B08B CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL 264 2
 
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 207 3
 
 
H05H PLASMA TECHNIQUE 116 3
 
 
B44C PRODUCING DECORATIVE EFFECTS 75 3
 
 
G06F ELECTRIC DIGITAL DATA PROCESSING 67 313
 
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 52 45
 
 
H01J ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS 52 69
 
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 47 36
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Top Patents (by citation)

Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2014/0251,382 Methods for Confinement of Foam Delivered by a Proximity Head May 22, 14 Sep 11, 14 [H01L]
2014/0256,066 Radiofrequency Adjustment for Instability Management in Semiconductor Processing Mar 11, 13 Sep 11, 14 [H01L]
2014/0256,128 METHOD AND APPARATUS FOR REMOTE PLASMA TREATMENT FOR REDUCING METAL OXIDES ON A METAL SEED LAYER Nov 21, 13 Sep 11, 14 [H01L]
2014/0256,142 METHOD OF ETCHING AN ETCH LAYER Mar 08, 13 Sep 11, 14 [H01L]
2014/0239,462 PECVD FILMS FOR EUV LITHOGRAPHY Feb 20, 14 Aug 28, 14 [G03F, H01L]
2014/0235,056 SYSTEM, METHOD AND APPARATUS FOR ION MILLING IN A PLASMA ETCH CHAMBER Feb 20, 13 Aug 21, 14 [H01L]
2014/0235,061 DUCTILE MODE MACHINING METHODS FOR HARD AND BRITTLE COMPONENTS OF PLASMA PROCESSING APPARATUSES Feb 20, 13 Aug 21, 14 [B23P, B23B, B28D, H01L]
2014/0235,063 HYBRID EDGE RING FOR PLASMA WAFER PROCESSING Feb 07, 14 Aug 21, 14 [H01J, H01L]
2014/0227,866 METHOD OF MAKING A GAS DISTRIBUTION MEMBER FOR A PLASMA PROCESSING CHAMBER Feb 13, 13 Aug 14, 14 [B05D, H01L]
2014/0217,590 THROUGH SILICON VIA METALLIZATION Feb 05, 13 Aug 07, 14 [H01L]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8,828,744 Method for etching with controlled wiggling Sep 24, 12 Sep 09, 14 [H01L]
8,828,863 Electroless copper deposition with suppressor Jun 25, 13 Sep 09, 14 [H01L]
8,821,639 Apparatus for spatial and temporal control of temperature on a substrate Sep 19, 11 Sep 02, 14 [H01R, B23K, H05K]
8,822,344 Method of etching an etch layer Mar 08, 13 Sep 02, 14 [H01L]
8,822,345 Apparatus including gas distribution member supplying process gas and radio frequency (RF) power for plasma processing Nov 07, 12 Sep 02, 14 [H01J, H01L]
8,813,764 Method and apparatus for physical confinement of a liquid meniscus over a semiconductor wafer May 29, 09 Aug 26, 14 [B08B]
8,815,745 Reducing damage to low-K materials during photoresist stripping Jan 27, 09 Aug 26, 14 [H01L]
8,808,561 Inert-dominant pulsing in plasma processing systems Jul 16, 12 Aug 19, 14 [C03C]
8,808,791 Method for strengthening adhesion between dielectric layers formed adjacent to metal layers Oct 17, 13 Aug 19, 14 [C23C, H01L]
8,809,747 Current peak spreading schemes for multiplexed heated array Apr 13, 12 Aug 19, 14 [A21B, B23K, H05B, D02J]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Filing Date Issue/Pub Date Intl Class
2012/0101,917 BUSINESS MOBILE COMMUNICATION SYSTEM Oct 03, 11 Apr 26, 12 [G06Q]
2012/0024,314 PLASMA MEDIATED ASHING PROCESSES Jul 27, 10 Feb 02, 12 [B08B]
2011/0306,203 INTERCONNECT STRUCTURE AND METHOD OF MANUFACTURING A DAMASCENE STRUCTURE Aug 25, 11 Dec 15, 11 [H01L]
2011/0271,905 Methods and System for Processing a Microelectronic Topography Jul 19, 11 Nov 10, 11 [B05C]
2011/0226,280 PLASMA MEDIATED ASHING PROCESSES May 27, 11 Sep 22, 11 [C23F, B08B]
2011/0136,346 Substantially Non-Oxidizing Plasma Treatment Devices and Processes Dec 04, 09 Jun 09, 11 [B08B, G03F, H01L]
2011/0060,442 METHODS AND ARRANGEMENT FOR DETECTING A WAFER-RELEASED EVENT WITHIN A PLASMA PROCESSING CHAMBER Sep 10, 09 Mar 10, 11 [G06F]
2011/0036,500 WIDE AREA RADIO FREQUENCY PLASMA APPARATUS FOR PROCESSING MULTIPLE SUBSTRATES Oct 22, 10 Feb 17, 11 [H01Q, H01L]
2011/0014,489 Method for Strengthening Adhesion Between Dielectric Layers Formed Adjacent to Metal Layers Sep 24, 10 Jan 20, 11 [B05C, B05D, B32B]
2010/0184,301 Methods for Preventing Precipitation of Etch Byproducts During an Etch Process and/or Subsequent Rinse Process Jan 20, 09 Jul 22, 10 [H01L]
2010/0130,017 FRONT END OF LINE PLASMA MEDIATED ASHING PROCESSES AND APPARATUS Nov 21, 08 May 27, 10 [H01L]
2010/0108,491 METHODS FOR REMOVING A METAL OXIDE FROM A SUBSTRATE Jan 07, 10 May 06, 10 [H05F]
2010/0062,164 Methods and Solutions for Preventing the Formation of Metal Particulate Defect Matter Upon a Substrate After a Plating Process Sep 08, 08 Mar 11, 10 [C09K, B05D, C25D]
2010/0015,731 Method of low-k dielectric film repair Feb 20, 07 Jan 21, 10 [C23C, H01L]
2009/0288,688 NON-CORROSIVE CHEMICAL RINSE SYSTEM Mar 11, 06 Nov 26, 09 [C09K, B08B]
2009/0291,562 HELIUM DESCUMMING May 20, 08 Nov 26, 09 [B08B, H01L]
2009/0277,871 PLASMA MEDIATED ASHING PROCESSES THAT INCLUDE FORMATION OF A PROTECTIVE LAYER BEFORE AND/OR DURING THE PLASMA MEDIATED ASHING PROCESS Mar 05, 09 Nov 12, 09 [C23F]
2009/0211,596 Method of post etch polymer residue removal Jul 11, 07 Aug 27, 09 [B08B]
2009/0170,334 Copper Discoloration Prevention Following Bevel Etch Process Dec 22, 08 Jul 02, 09 [H01L]
2009/0120,583 METHODS OF MAKING GAS DISTRIBUTION MEMBERS FOR PLASMA PROCESSING APPARATUSES Jan 07, 09 May 14, 09 [C23F, C23C]

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