LAM RESEARCH CORPORATION

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Intl Class Technology # of Patents Rank
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 543 58
 
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 228 4
 
 
B08B CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL 219 2
 
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 140 3
 
 
H05H PLASMA TECHNIQUE 84 3
 
 
G06F ELECTRIC DIGITAL DATA PROCESSING 54 274
 
 
B44C PRODUCING DECORATIVE EFFECTS 53 5
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 39 89
 
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 37 30
 
 
H01J ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS 36 77
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Top Patents (by citation)

Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2014/0096,834 METHOD FOR SUPPLYING VAPORIZED PRECURSOR Dec 04, 13 Apr 10, 14 [C23C]
2014/0096,908 DISTRIBUTED MULTI-ZONE PLASMA SOURCE SYSTEMS, METHODS AND APPARATUS Oct 10, 12 Apr 10, 14 [H01J]
2014/0096,909 HEATING PLATE WITH PLANAR HEATER ZONES FOR SEMICONDUCTOR PROCESSING Dec 10, 13 Apr 10, 14 [H01L]
2014/0099,789 METHOD OF MAKING AN INTERCONNECT DEVICE Oct 04, 13 Apr 10, 14 [H01L]
2014/0083,461 METHOD OF REMOVING DAMAGED EPOXY FROM ELECTROSTATIC CHUCK Sep 21, 12 Mar 27, 14 [B08B]
2014/0083,463 SYSTEM AND METHOD FOR MONITORING WAFER STRESS Sep 21, 12 Mar 27, 14 [B08B]
2014/0087,486 METHOD FOR ETCHING WITH CONTROLLED WIGGLING Sep 24, 12 Mar 27, 14 [H01L]
2014/0087,488 SHOWERHEAD ELECTRODE ASSEMBLY IN A CAPACITIVELY COUPLED PLASMA PROCESSING APPARATUS Sep 24, 12 Mar 27, 14 [H01L, B05B]
2014/0076,353 PLASMA MEDIATED ASHING PROCESSES Nov 18, 13 Mar 20, 14 [H01L]
2014/0076,713 Edge Ramping Oct 24, 12 Mar 20, 14 [H05H]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8,691,027 Method for removing material from semiconductor wafer and apparatus for performing the same Nov 06, 12 Apr 08, 14 [B08B, H01L]
8,691,048 Plasma stabilization method and plasma apparatus Jun 08, 12 Apr 08, 14 [C23C, H01L]
8,691,698 Controlled gas mixing for smooth sidewall rapid alternating etch process Feb 08, 12 Apr 08, 14 [H01L]
8,691,701 Strip with reduced low-K dielectric damage May 08, 09 Apr 08, 14 [H01L]
8,692,467 Synchronized and shortened master-slave RF pulsing in a plasma processing chamber Jul 06, 11 Apr 08, 14 [H01J]
8,677,586 Installation fixture for elastomer bands and methods of using the same Apr 04, 12 Mar 25, 14 [B23P]
8,677,590 Plasma confinement structures in plasma processing systems and methods thereof Sep 09, 13 Mar 25, 14 [C23F, C23C, B25B, H01L]
8,679,252 Actively heated aluminum baffle component having improved particle performance and methods of use and manufacture thereof Sep 23, 05 Mar 25, 14 [C23C, H01L]
8,679,288 Showerhead electrode assemblies for plasma processing apparatuses Jun 09, 08 Mar 25, 14 [C23F, C23C, H01L]
8,680,441 Heating plate with planar heater zones for semiconductor processing Aug 29, 13 Mar 25, 14 [F27D, H05B, F27B, H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Filing Date Issue/Pub Date Intl Class
2013/0342,951 Techniques for reducing arcing-related damage in a clamping ring of a plasma processing system Aug 10, 05 Dec 26, 13 [H01T]
2011/0014,489 Method for Strengthening Adhesion Between Dielectric Layers Formed Adjacent to Metal Layers Sep 24, 10 Jan 20, 11 [B05C, B05D, B32B]
2010/0108,491 METHODS FOR REMOVING A METAL OXIDE FROM A SUBSTRATE Jan 07, 10 May 06, 10 [H05F]
2010/0062,164 Methods and Solutions for Preventing the Formation of Metal Particulate Defect Matter Upon a Substrate After a Plating Process Sep 08, 08 Mar 11, 10 [C09K, B05D, C25D]
2009/0291,562 HELIUM DESCUMMING May 20, 08 Nov 26, 09 [B08B, H01L]
2009/0211,596 Method of post etch polymer residue removal Jul 11, 07 Aug 27, 09 [B08B]
2009/0120,583 METHODS OF MAKING GAS DISTRIBUTION MEMBERS FOR PLASMA PROCESSING APPARATUSES Jan 07, 09 May 14, 09 [C23F, C23C]
2009/0121,324 ETCH WITH STRIATION CONTROL Jan 06, 09 May 14, 09 [C23F, H01L]
2009/0090,695 Yttria insulator ring for use inside a plasma chamber Aug 28, 08 Apr 09, 09 [B23P, H01L]
2009/0089,024 METHODS AND ARRANGEMENT FOR CREATING MODELS FOR FINE-TUNING RECIPES Sep 22, 08 Apr 02, 09 [G06F]
2009/0068,767 TUNING VIA FACET WITH MINIMAL RIE LAG Sep 12, 07 Mar 12, 09 [H01L]
2009/0032,192 Method for Resist Strip in Presence of Low K Dielectric Material and Apparatus for Performing the Same Oct 06, 08 Feb 05, 09 [H01L]
2009/0037,028 Apparatus for dispensing precise volumes of fluid Sep 22, 05 Feb 05, 09 [G05D]
2008/0182,422 Methods of etching photoresist on substrates Nov 05, 07 Jul 31, 08 [C09K, H01L]
2008/0148,595 Method and apparatus for drying substrates using a surface tensions reducing gas Dec 20, 06 Jun 26, 08 [F26B]
2008/0149,147 PROXIMITY HEAD WITH CONFIGURABLE DELIVERY May 09, 07 Jun 26, 08 [B08B]
2008/0152,823 Self-limiting plating method Dec 20, 06 Jun 26, 08 [B05D]
2008/0119,055 REDUCING TWISTING IN ULTRA-HIGH ASPECT RATIO DIELECTRIC ETCH Nov 21, 06 May 22, 08 [H01L]
2008/0064,214 SEMICONDUCTOR PROCESSING INCLUDING ETCHED LAYER PASSIVATION USING SELF-ASSEMBLED MONOLAYER Sep 13, 06 Mar 13, 08 [H01L]
2008/0057,182 METHOD FOR GAP FILL IN CONTROLLED AMBIENT SYSTEM Dec 15, 06 Mar 06, 08 [B05D]

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