LIN, CHARLES W.C.

Patent Owner

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H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 3254

6,316,830 Bumpless flip chip assembly with strips and via-fillDec 16, 99Nov 13, 01[H01L]14

6,319,751 Bumpless flip chip assembly with solder viaDec 16, 99Nov 20, 01[H01L]12

6,437,452 Bumpless flip chip assembly with strips-in-via and platingDec 16, 99Aug 20, 02[H01L]2

2002/0005,591 BUMPLESS FLIP CHIP ASSEMBLY WITH STRIPS-IN-VIA AND PLATINGDec 16, 99Jan 17, 02[H01L]

6,437,452 Bumpless flip chip assembly with strips-in-via and platingDec 16, 99Aug 20, 02[H01L]

6,319,751 Bumpless flip chip assembly with solder viaDec 16, 99Nov 20, 01[H01L]

6,316,830 Bumpless flip chip assembly with strips and via-fillDec 16, 99Nov 13, 01[H01L]

55 Cairnhill Road, #21-04 Cairnhill Plaza, Singapore, SG

Not Provided