M/A-COM TECHNOLOGY SOLUTIONS HOLDINGS, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 5357
 
  
 
H03H IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS 368
 
  
 
H03F AMPLIFIERS 281
 
  
 
H03L AUTOMATIC CONTROL, STARTING, SYNCHRONISATION, OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES 278
 
  
 
H04L TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION 2283
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 186
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM1156
 
  
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 1158
 
  
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 1204
 
  
 
G02F DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS 1132

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9729157 Variable clock phase generation method and systemFeb 13, 15Aug 08, 17[H03L, H03K]
9450788 Equalizer for high speed serial data links and method of initializationMay 07, 15Sep 20, 16[H04L]
6137125 Two layer hermetic-like coating for on-wafer encapsulatuon of GaAs MMIC's having flip-chip bonding capabilitiesFeb 06, 98Oct 24, 00[H01L]
5914508 Two layer hermetic-like coating process for on-wafer encapsulation of GaAs MMIC'sMay 27, 97Jun 22, 99[H01L]
5844451 Circuit element having at least two physically separated coil-layersFeb 25, 94Dec 01, 98[H03H]
5736887 Five volt tolerant protection circuitJan 25, 96Apr 07, 98[H03L]
5683936 Reactive ion etched assisted gold post processJan 27, 95Nov 04, 97[H01L]
5639325 Process for producing a glass-coated articleFeb 01, 95Jun 17, 97[B05D, B32B]
5631603 Offset cancellation for differential amplifiersSep 29, 95May 20, 97[H03F]
5627499 Digital modulator and upconverter having single-bit delta-sigma data convertersOct 13, 95May 06, 97[H04L, H03C]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2009/0316,372 Printed circuit board assemblyAbandonedJun 24, 08Dec 24, 09[H05K]
2009/0309,155 VERTICAL TRANSISTOR WITH INTEGRATED ISOLATIONAbandonedJun 12, 08Dec 17, 09[H01L]
2009/0309,199 CHIP PACKAGE FOR SEMICONDUCTOR DEVICESAbandonedJun 12, 08Dec 17, 09[H01L]
2009/0273,406 MECHANICALLY TUNABLE PRINTED RESONATORAbandonedMay 01, 08Nov 05, 09[H03B]
2009/0273,413 POWER DIVIDER INTEGRATED CIRCUITAbandonedMay 01, 08Nov 05, 09[H01P, H03H, H05K]
7598824 Splitter/combiner circuitExpiredNov 14, 06Oct 06, 09[H01P]
2009/0242,923 Hermetically Sealed Device with Transparent Window and Method of Manufacturing SameAbandonedMar 28, 08Oct 01, 09[H01L]
2009/0243,088 Multiple Layer Metal Integrated Circuits and Method for Fabricating SameAbandonedMar 28, 08Oct 01, 09[H01L]
7595453 Surface mount packageExpiredMay 24, 05Sep 29, 09[H05K]
7554707 Method and apparatus for optical processingExpiredAug 02, 00Jun 30, 09[G02B, G02F]
7529526 Apparatus and method for detecting radio frequency transmission power levelsExpiredJun 15, 04May 05, 09[H04B]
2009/0108,437 WAFER SCALE INTEGRATED THERMAL HEAT SPREADERAbandonedOct 29, 07Apr 30, 09[H01L]
2009/0079,489 CONSTANT PHASE DIGITAL ATTENUATOR WITH ON-CHIP MATCHING CIRCUITRYAbandonedSep 21, 07Mar 26, 09[H03H]
2009/0073,066 Grid AntennaAbandonedSep 14, 07Mar 19, 09[H01Q]
2009/0073,065 Tunable Dielectric Resonator CircuitAbandonedSep 14, 07Mar 19, 09[H01Q]
2009/0051,463 SPLITTER/COMBINER CIRCUITAbandonedAug 01, 08Feb 26, 09[H01P]
7402842 Light emitting diode packageExpiredAug 09, 04Jul 22, 08[H01L]
7387518 Grounding attachment assemblyExpiredDec 23, 05Jun 17, 08[H01R]
2008/0116,077 System and method for solder bump platingAbandonedNov 21, 06May 22, 08[C25D]
2007/0247,179 Surface mount component RF test fixtureAbandonedApr 25, 06Oct 25, 07[G01R]

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