MACHINE TECHNOLOGY, INC.

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
5114556 Deposition apparatus and method for enhancing step coverage and planarization on semiconductor wafersExpiredDec 27, 89May 19, 92[C23C]
5094884 Method and apparatus for applying a layer of a fluid material on a semiconductor waferExpiredApr 24, 90Mar 10, 92[B05C, B05D]
4885075 Cooling device for a sputter target and sourceExpiredDec 22, 88Dec 05, 89[C23C]

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