MEC COMPANY LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
C09K MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR1085
 
  
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 927
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 5151
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM4153
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 398
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 285
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2360
 
  
 
B29C SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 1124
 
  
 
B44C PRODUCING DECORATIVE EFFECTS 133
 
  
 
C03C CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS159

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0342,566 WASHING SOLUTION FOR SURFACE OF ELECTROLESS TIN PLATING FILM, REPLENISHING SOLUTION FOR SAID WASHING SOLUTION, AND METHOD FOR FORMING TIN PLATING LAYERSep 17, 15Nov 30, 17[C23C, H05K]
2017/0268,112 ETCHING AGENT AND REPLENISHING SOLUTION THEREFOR, METHOD FOR ROUGHENING SURFACE OF MAGNESIUM COMPONENT, AND METHOD FOR MANUFACTURING MAGNESIUM-RESIN COMPOSITESep 17, 15Sep 21, 17[B29C, C23F]
2017/0167,033 ETCHING AGENT AND REPLENISHING LIQUIDJun 05, 15Jun 15, 17[C23F]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9493878 Surface roughening agent for aluminum, and surface roughening method using said surface roughening agentNov 08, 10Nov 15, 16[C09K, H01L, C23F]
9441303 Microetching solution for copper, replenishment solution therefor and method for production of wiring boardMar 04, 13Sep 13, 16[C09K, C09G, C23F, H05K]
9011712 Microetching solution for copper, replenishment solution therefor and method for production of wiring boardJun 25, 13Apr 21, 15[C09K, C23F, H05K]
8828554 Electroconductive layer, laminate using the same, and producing processes thereofJan 12, 09Sep 09, 14[B32B, H05K]
8557035 Coating-forming liquid composition and coating-forming method therewithApr 13, 12Oct 15, 13[C23C, C09J, C23F, H05K]
8147631 Method for forming a laminateFeb 19, 10Apr 03, 12[B32B]
7431861 Etchant, replenishment solution and method for producing copper wiring using the sameJul 22, 04Oct 07, 08[C03C]
7285229 Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the sameNov 02, 04Oct 23, 07[C09K]
7156904 Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained therebyApr 16, 04Jan 02, 07[C23C]
7029761 Bonding layer for bonding resin on copper surfaceApr 16, 04Apr 18, 06[B32B]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
8317000 Wheel stop made of metal pipe and capable of transmitting power to electric car while being parkedExpiredDec 03, 10Nov 27, 12[B61H]
2010/0108,531 ADHESIVE LAYER FORMING LIQUID AND ADHESIVE LAYER FORMING PROCESSAbandonedNov 02, 09May 06, 10[C25D]
2010/0029,969 COPPER COMPOUND AND METHOD FOR PRODUCING COPPER THIN FILM USING THE SAMEAbandonedOct 13, 09Feb 04, 10[C07F]
2010/0000,971 ADHESIVE LAYER FORMING LIQUIDAbandonedJun 30, 09Jan 07, 10[C09J, B05D, B44C]
2008/0308,964 Method for forming film of silane coupling agentAbandonedJun 13, 08Dec 18, 08[B28B]
2008/0261,020 Adhesive layer for resin and a method of producing a laminate including the adhesive layerAbandonedSep 27, 07Oct 23, 08[B32B]
2008/0073,614 Metal removing solution and metal removing method using the sameAbandonedSep 25, 07Mar 27, 08[C09K]
2008/0011,981 Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the sameAbandonedSep 14, 07Jan 17, 08[C09K]
2007/0277,736 Method for manufacturing substrate, and vapor deposition apparatus used for the sameAbandonedMay 30, 07Dec 06, 07[C23C]
7297757 Resin surface treating agent and resin surface treatmentExpiredJun 16, 05Nov 20, 07[C08F]
2006/0154,490 Liquid treating apparatusAbandonedJan 11, 06Jul 13, 06[H01L]
6874675 Method for manufacturing printed circuit boardExpiredJul 09, 03Apr 05, 05[B23K]
2005/0003,086 Copper compound and method for producing copper thin film using the sameAbandonedJun 30, 04Jan 06, 05[C23C, C07F]
6527696 Wave generation apparatusExpiredOct 24, 00Mar 04, 03[A61N]
6388844 Head base shift mechanism in cassette tape recorder of automatic reverse tapeExpiredDec 23, 99May 14, 02[G11B]
6254024 Rotational load applying mechanism for a tape recorderExpiredFeb 24, 99Jul 03, 01[G03B]
6220540 Mechanism for retaining one tape deck in inoperative position in double cassette tape playerExpiredMar 03, 00Apr 24, 01[G03B]
6175464 Autoreverse mechanismExpiredOct 03, 97Jan 16, 01[G11B]
6122146 Autostop mechanism for tape driving apparatusExpiredAug 20, 98Sep 19, 00[G11B]
6105892 Autoreverse mechanismExpiredMar 09, 99Aug 22, 00[G03B]

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