MEGICA CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 4358
 
  
 
H01Q AERIALS 1109

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7382320 Circularly polarized antennaJul 24, 06Jun 03, 08[H01Q]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
7968372 Method of joining chips utilizing copper pillarWithdrawnMay 29, 08Jun 28, 11[H01L, H05K]
2009/0309,225 Top layers of metal for high performance IC'sAbandonedAug 06, 08Dec 17, 09[H01L]
7525174 High performance system-on-chip using post passivation processWithdrawnOct 23, 07Apr 28, 09[H01L]
2009/0056,988 Multiple chips bonded to packaging structure with low noise and multiple selectable functionsAbandonedNov 12, 08Mar 05, 09[H05K]
2008/0251,925 TOP LAYERS OF METAL FOR INTEGRATED CIRCUITSAbandonedJun 20, 08Oct 16, 08[H01L]
2008/0142,980 Top layers of metal for high performance IC'sAbandonedFeb 25, 08Jun 19, 08[H01L]
2008/0146,020 Top layers of metal for high performance IC'sAbandonedFeb 25, 08Jun 19, 08[H01L]
2008/0083,988 Top layers of metal for high performance IC'sAbandonedOct 31, 07Apr 10, 08[H01L]
2008/0079,461 INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METALAbandonedSep 29, 07Apr 03, 08[H03K]
2008/0081,457 INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METALAbandonedSep 30, 07Apr 03, 08[H01L]
2008/0048,329 Top layers of metal for high performance IC'sAbandonedOct 31, 07Feb 28, 08[H01L]
2008/0042,273 High performance system-on-chip using post passivation processAbandonedOct 23, 07Feb 21, 08[H01L]
2008/0035,972 High performance system-on-chip using post passivation processAbandonedOct 19, 07Feb 14, 08[H01L]
2008/0035,974 High performance system-on-chip using post passivation processAbandonedOct 19, 07Feb 14, 08[H01L]
2008/0038,869 High performance system-on-chip using post passivation processAbandonedOct 19, 07Feb 14, 08[H01L]
2007/0290,349 Top layers of metal for high performance IC'sAbandonedAug 27, 07Dec 20, 07[H01L]
2007/0290,350 Top layers of metal for high performance IC'sAbandonedAug 27, 07Dec 20, 07[H01L]
2007/0290,354 Top layers of metal for high performance IC'sAbandonedAug 27, 07Dec 20, 07[H01L]
2007/0290,355 Top layers of metal for high performance IC'sAbandonedAug 27, 07Dec 20, 07[H01L]
2007/0290,356 Top layers of metal for high performance IC'sAbandonedAug 27, 07Dec 20, 07[H01L]

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