MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1155

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
5183972 Copper/epoxy structuresFeb 04, 91Feb 02, 93[H05K]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2002/0078,090 Ontological concept-based, user-centric text summarizationAbandonedJun 29, 01Jun 20, 02[G06F]
2002/0055,849 Workflow primitives modelingAbandonedJun 29, 01May 09, 02[G06F]
5659224 Cold cathode display deviceExpiredJun 07, 95Aug 19, 97[H01J]
5574814 Parallel optical transceiver linkExpiredJan 31, 95Nov 12, 96[G02B]
5544018 Electrical interconnect device with customizeable surface layer and interwoven signal linesExpiredApr 13, 94Aug 06, 96[H05K]
5509071 Electronic proof of receiptExpiredApr 01, 94Apr 16, 96[H04L]
5462217 High force compression flip chip bonding systemExpiredSep 15, 94Oct 31, 95[H01L, B23K]
5445308 Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metalExpiredJun 22, 94Aug 29, 95[B23K]
5440651 Pattern recognition neural networkExpiredApr 20, 93Aug 08, 95[G06K]
5434530 Superconducting semiconducting cross-bar circuitExpiredJun 07, 94Jul 18, 95[H03K]
5424656 Continuous superconductor to semiconductor converter circuitExpiredMay 07, 93Jun 13, 95[H03K]
5393573 Method of inhibiting tin whisker growthExpiredJul 16, 91Feb 28, 95[B05D]
5393613 Composition for three-dimensional metal fabrication using a laserExpiredDec 03, 93Feb 28, 95[B22F]
5388068 Superconductor-semiconductor hybrid memory circuits with superconducting three-terminal switching devicesExpiredOct 14, 93Feb 07, 95[G11C]
5382315 Method of forming etch mask using particle beam depositionExpiredSep 13, 93Jan 17, 95[H05K]
5368217 High force compression flip chip bonding method and systemExpiredAug 25, 93Nov 29, 94[H01L]
5358604 Method for producing conductive patternsExpiredSep 29, 92Oct 25, 94[B05D]
5344795 Method for encapsulating an integrated circuit using a removable heatsink support blockExpiredSep 22, 92Sep 06, 94[H01L]
5332879 Method for removing trace metal contaminants from organic dielectricsExpiredDec 02, 92Jul 26, 94[B23K]
5331172 Ionized metal cluster beam systems and methodsExpiredSep 29, 93Jul 19, 94[H01J]

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