MITSUBISHI GAS CHEMICAL COMPANY, INC.

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Technologies

Intl Class Technology # of Patents Rank
 
 
 
C07C ACYCLIC OR CARBOCYCLIC COMPOUNDS 18312
 
 
 
C08G MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS 11113
 
 
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM6856
 
 
 
C08L COMPOSITIONS OF MACROMOLECULAR COMPOUNDS 4637
 
 
 
C07D HETEROCYCLIC COMPOUNDS 3191
 
 
 
C08K USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS 3140
 
 
 
C01B NON-METALLIC ELEMENTS; COMPOUNDS THEREOF2917
 
 
 
C08F MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS 2774
 
 
 
B29C SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 2152
 
 
 
C09K MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR2142

Top Patents (by citation)

Patent # Title Filing Date Issue Date Intl Class Cited #
5,972,862 Cleaning liquid for semiconductor devicesJul 28, 97Oct 26, 99[C11D]106
5,770,765 Process for the production of high-purity isophthalic acidJul 08, 97Jun 23, 98[C07C]64
5,286,407 Oxygen absorbent composition and method of preserving article with sameApr 24, 91Feb 15, 94[C09K]62
6,097,089 Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said packageJan 27, 99Aug 01, 00[H01L, H05K]61
5,241,149 Food packing body for heat and microwave treatmentOct 11, 91Aug 31, 93[H05B]59
5,705,089 Cleaning fluid for semiconductor substrateMar 10, 93Jan 06, 98[H01L]58
5,777,161 Process for producing highly pure terephthalic acid by use of dispersion medium replacement apparatusJul 07, 97Jul 07, 98[C07C]54
5,712,412 Process for producing highly pure terephthalic acidNov 27, 95Jan 27, 98[C07C]54
5,684,187 Process for producing highly pure terephthalic acidApr 29, 96Nov 04, 97[C07C]53
5,132,450 Process for producing high purity isophthalic acidJun 25, 91Jul 21, 92[C07C]51

Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2013/0130,062 LAMINATE FILMJul 26, 11May 23, 13[B32B]
2013/0122,423 COMPOUND, RADIATION-SENSITIVE COMPOSITION AND RESIST PATTERN FORMATION METHODJul 25, 11May 16, 13[G03F, C07C]
2013/0123,380 OXYGEN-ABSORBING RESIN COMPOSITION AND METHOD FOR MANUFACTURING PACKAGING BODY USING THE SAMEMay 16, 11May 16, 13[C08L]
2013/0123,439 REACTIVE POLYAMIDE RESINS AND POLYAMIDE RESIN COMPOSITIONSMay 18, 12May 16, 13[C08G, C08L]
2013/0105,729 ETCHING LIQUID FOR FILM OF MULTILAYER STRUCTURE CONTAINING COPPER LAYER AND MOLYBDENUM LAYERMay 27, 11May 02, 13[C23F]
2013/0109,832 POLYAMIDE COMPOUNDFeb 23, 11May 02, 13[C08G]
2013/0101,863 HEAT CURABLE COMPOSITIONApr 19, 11Apr 25, 13[C09D, B32B]
2013/0102,775 PHOTOCHROMIC MATERIALJul 08, 11Apr 25, 13[C07D]
2013/0095,265 MULTILAYERED CONTAINER, DIE FOR MULTILAYERED CONTAINER, AND METHOD FOR PRODUCING MULTILAYERED CONTAINERApr 15, 11Apr 18, 13[B29C, B32B, B65D]
2013/0095,337 THERMOPLASTIC RESIN LAMINATEJun 17, 11Apr 18, 13[B32B]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8,440,756 Flame-retardant polyamide resin compositionSep 14, 10May 14, 13[C08K]
8,436,129 Polycarbonate resin having ultraviolet absorbing capability, resin composition and optical materialApr 23, 09May 07, 13[C08G]
8,431,653 Curing agent composition for epoxy resins and epoxy resin compositionDec 12, 06Apr 30, 13[C08F]
8,420,529 Copper wiring surface protective liquid and method for manufacturing semiconductor circuitSep 02, 09Apr 16, 13[H01L]
8,420,538 Liquid for protecting copper wiring surface and method for manufacturing semiconductor circuit elementSep 02, 09Apr 16, 13[C09K, C23F, H01L]
8,410,244 Vibration-damping filmJul 05, 10Apr 02, 13[C08G]
8,398,600 Prefilled syringeDec 17, 07Mar 19, 13[C08G, A61M]
8,399,256 Method for introducing gene into cell, and composition for use in the methodOct 13, 09Mar 19, 13[C12N, C07D]
8,394,501 Polyurethane resin compositionJul 24, 08Mar 12, 13[C08G, B32B]
8,394,920 Composition for resin and optical lens obtained therefromFeb 02, 09Mar 12, 13[C08G]

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Top Inventors for This Owner

Inventor Name Address # of Patent/Pub
Yui Tomoyuki
Yokkaichi, JP
46
Gaku Morio
Tokyo, JP
44
Johno Masahiro
Tokyo, JP
44
Ikeguchi Nobuyuki
Tokyo, JP
42
Ishii Kenji
Tokyo, JP
41
Takeuchi Motoharu
Tokyo, JP
39
Sugio Akitoshi
Omiya, JP
35
Norisue Yasumasa
Tokyo, JP
34
Hidaka Toshio
Tsukuba-shi, JP
33
Kihara Shuta
Kanagawa, JP
33