Mitsubishi Materials Silicon Corporation

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
C30B SINGLE-CRYSTAL GROWTH 1541
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 11351
 
 
 
G01N INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES 4202
 
 
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM3154
 
 
 
B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 264
 
 
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 299
 
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 2157
 
 
 
C01B NON-METALLIC ELEMENTS; COMPOUNDS THEREOF178

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7067428 Method for cleaning polysiliconJun 27, 02Jun 27, 06[H01L]
7033843 Semiconductor manufacturing method and semiconductor manufacturing apparatusOct 30, 03Apr 25, 06[G01R]
6995834 Method for analyzing impurities in a silicon substrate and apparatus for decomposing a silicon substrate through vapor-phase reactionFeb 01, 01Feb 07, 06[G01N]
6887721 Method of purging CVD apparatus and method for judging maintenance of times of semiconductor production apparatusesDec 19, 01May 03, 05[H01L]
6818197 Epitaxial waferMar 18, 03Nov 16, 04[C01B]
6815774 Dielectrically separated wafer and method of the sameOct 18, 99Nov 09, 04[H01L]
6794204 Semiconductor manufacturing method and semiconductor manufacturing apparatusSep 26, 02Sep 21, 04[H01L, G01R]
6776805 Semiconductor manufacturing apparatus having a moisture measuring deviceFeb 27, 01Aug 17, 04[H01L]
6693286 Method for evaluating the quality of a semiconductor substrateNov 19, 02Feb 17, 04[G01N]
6682597 Silicon wafer, and heat treatment method of the same and the heat-treated silicon waferJun 03, 02Jan 27, 04[C30B]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2003/0124,853 Anisotropic etching method and apparatusAbandonedJan 28, 03Jul 03, 03[H01L]
2002/0168,880 Method for cleaning polysiliconAbandonedMay 08, 01Nov 14, 02[G11C]
6261364 Semiconductor single-crystal growth systemExpiredSep 01, 98Jul 17, 01[C30B]
6096128 Silicon crystal, and device and method for manufacturing sameExpiredJun 05, 98Aug 01, 00[C30B]
5096854 Method for polishing a silicon wafer using a ceramic polishing surface having a maximum surface roughness less than 0.02 micronsExpiredJun 19, 89Mar 17, 92[H01L]
4981549 Method and apparatus for growing silicon crystalsExpiredFeb 22, 89Jan 01, 91[C30B]
4949034 Method for contactless evaluation of characteristics of semiconductor wafers and devicesExpiredMar 13, 89Aug 14, 90[G01R]
4897966 Polishing apparatusExpiredAug 18, 87Feb 06, 90[B24B]
4851263 Method and apparatus for application of wax on wafersExpiredOct 23, 87Jul 25, 89[B05C, B05D]
4756796 Method of producing waferExpiredOct 10, 86Jul 12, 88[C03B]
4699118 Apparatus for dressing cutting edgeExpiredMar 18, 86Oct 13, 87[B24B]

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