MULTEK FLEXIBLE CIRCUITS, INC.

Patent Owner

Watch Compare Add to Portfolio

Stats

Details

Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 8148
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM7150
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 150
 
  
 
G03F PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR 1103
 
  
 
H01B CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES 173
 
  
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 1132

Top Patents (by citation)

Upgrade to the Professional Level to View Top Patents for this Owner. Learn More

Recent Publications

  • No Recent Publications to Display

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
6060175 Metal-film laminate resistant to delaminationJul 10, 97May 09, 00[B32B]
5930117 Heat sink structure comprising a microarray of thermal metal heat channels or vias in a polymeric or film layerMay 07, 96Jul 27, 99[H05T]
5800650 Flexible multilayer printed circuit boards and methods of manufactureOct 16, 95Sep 01, 98[C25D]
5798171 Adherent film with low thermal impedance and high electrical impedance used in an electronic assembly with a heat sinkJul 03, 96Aug 25, 98[H01B, B32B]
5766740 Adherent film with low thermal impedance and high electrical impedance used in an electronic assembly with a heat sinkNov 05, 96Jun 16, 98[B32B, H05K]
5727310 Method of manufacturing a multilayer electronic circuitJun 11, 96Mar 17, 98[H05K]
5719749 Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit boardSep 26, 94Feb 17, 98[H01R, H05K]
5709979 Printed wiring board with photoimageable dielectric base substrate and method of manufacture thereforOct 21, 94Jan 20, 98[G03F]
5688584 Multilayer electronic circuit having a conductive adhesiveSep 27, 95Nov 18, 97[B32B]
5615477 Method for interconnecting a flip chip to a printed circuit substrateMay 10, 96Apr 01, 97[H05K]

View all patents..

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2006/0237,132 Flexible flat cable with insulating layer having distinct adhesives on opposing facesAbandonedJun 21, 06Oct 26, 06[B32B]
6515233 Method of producing flex circuit with selectively plated goldExpiredJun 30, 00Feb 04, 03[H05K]
5112462 Method of making metal-film laminate resistant to delaminationExpiredSep 13, 90May 12, 92[C25D]

Top Inventors for This Owner

Upgrade to the Professional Level to View Top Inventors for this Owner. Learn More

We are sorry but your current selection exceeds the maximum number of comparisons () for this membership level. Upgrade to our Level for up to -1 comparisons!

We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.