NANOPIERCE TECHNOLOGIES, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 2131
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 192
 
  
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 1158
 
  
 
H01H ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES 193
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1155

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
5506514 Electrical interconnect using particle enhanced joining of metal surfacesApr 12, 95Apr 09, 96[H01R]
5471151 Electrical interconnect using particle enhanced joining of metal surfacesSep 28, 92Nov 28, 95[B23K, G01R]
5430614 Electrical interconnect using particle enhanced joining of metal surfacesNov 08, 93Jul 04, 95[H01R, H05K]
5334809 Particle enhanced joining of metal surfacesFeb 11, 93Aug 02, 94[H01H]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
6853087 Component and antennae assembly in radio frequency identification devicesExpiredSep 19, 01Feb 08, 05[H01L]
2004/0087,128 Method and materials for printing particle-enhanced electrical contactsAbandonedApr 24, 03May 06, 04[H01L]
6630203 Electroless process for the preparation of particle enhanced electric contact surfacesExpiredJun 15, 01Oct 07, 03[B05D]
2002/0158,646 Spiral leaf spring contactsAbandonedJun 20, 02Oct 31, 02[G01R]
2002/0096,254 Optical device module and method of fabricationAbandonedJan 18, 02Jul 25, 02[B32B]
2002/0027,294 Electrical component assembly and method of fabricationAbandonedMar 19, 01Mar 07, 02[H01L]
2001/0033,179 Method and apparatus for handling electronic devicesAbandonedApr 25, 01Oct 25, 01[G01R]
6096982 Method and apparatus for conductively joining componentsExpiredFeb 18, 98Aug 01, 00[H05K]
5835359 Electrical interconnect using particle enhanced joining of metal surfacesExpiredNov 06, 96Nov 10, 98[H05K]
5670251 Patternable particle filled adhesive matrix for forming patterned structures between joined surfacesExpiredOct 07, 94Sep 23, 97[B32B]
5642055 Electrical interconnect using particle enhanced joining of metal surfacesExpiredApr 12, 95Jun 24, 97[H01R, H05K]
5634265 Electrical interconnect using particle enhanced joining of metal surfacesExpiredApr 12, 95Jun 03, 97[H01R]
5565280 Electrical interconnect using particle enhanced joining of metal surfacesExpiredApr 12, 95Oct 15, 96[H01M]
5083697 Particle-enhanced joining of metal surfacesExpiredFeb 14, 90Jan 28, 92[B23K]
4804132 Method for cold bondingExpiredAug 28, 87Feb 14, 89[B23K]

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