NEC Toppan Circuit Solutions, Inc.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 3202
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 285
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2360
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 2154
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 192
 
  
 
C09J ADHESIVES; ADHESIVE PROCESSES IN GENERAL 154
 
  
 
C22C ALLOYS 171
 
  
 
G01J MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED, VISIBLE OR ULTRA-VIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY 177
 
  
 
G01N INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES 1205
 
  
 
G03F PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR 1103

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7317610 Sheet-shaped capacitor and method for manufacture thereofNov 15, 05Jan 08, 08[H01G]
7303978 Board for mounting BGA semiconductor chip thereon, semiconductor device, and methods of fabricating such board and semiconductor deviceJan 06, 05Dec 04, 07[H01L]
7106426 Method of inspecting optical waveguide substrate for optical conduction at increased speed and also inspecting optical waveguide substrate for crosstalkDec 19, 02Sep 12, 06[G01N]
6791675 Optical waveguide path, manufacturing method and coupling method of the same, and optical waveguide path coupling structureNov 29, 01Sep 14, 04[G01J]
6775441 Optical waveguide connecting structure, optical element mounting structure and optical fiber mounting structureJul 31, 01Aug 10, 04[G02B]
6717494 Printed-circuit board, coaxial cable, and electronic deviceMar 20, 02Apr 06, 04[H01P]
6702176 Solder, method for processing surface of printed wiring board, and method for mounting electronic partDec 11, 01Mar 09, 04[B23K, C22C]
6608946 Optical module and method for manufacturing the sameDec 28, 01Aug 19, 03[G02B]
6420255 Mounting substrate with a solder resist layer and method of forming the sameJan 18, 00Jul 16, 02[H01L]
5571365 Adhesive for printed circuit boardNov 14, 94Nov 05, 96[C09J]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2007/0241,463 ELECTRODE, MANUFACTURING METHOD OF THE SAME, AND SEMICONDUCTOR DEVICE HAVING THE SAMEAbandonedApr 16, 07Oct 18, 07[H01L]
2007/0164,457 Semiconductor package, substrate with conductive post, stacked type semiconductor device, manufacturing method of semiconductor package and manufacturing method of stacked type semiconductor deviceAbandonedJan 18, 07Jul 19, 07[H01L]
6999643 Method of manufacturing optical waveguide and method of manufacturing opto-electric wiring boardExpiredNov 26, 02Feb 14, 06[G02B]
6938336 Methods of manufacturing board having throughholes filled with resin and multi-layered printed wiring board using the boardExpiredOct 18, 02Sep 06, 05[0000]
6882544 Printed circuit board, method for producing same and semiconductor deviceExpiredJun 25, 03Apr 19, 05[H05K]
6709803 Process for producing printed wiring boardExpiredFeb 20, 02Mar 23, 04[C23C, G03F, H05K]
2003/0155,638 Board for mounting BGA semiconductor chip thereon, semiconductor device, and methods of fabricating such board and semiconductor deviceAbandonedJan 24, 03Aug 21, 03[H01L, H01K]
6607981 Method for forming a Cu interconnect patternExpiredSep 07, 00Aug 19, 03[H01L]
2003/0097,311 Custom product order acceptance supporting apparatusAbandonedNov 18, 02May 22, 03[G06F]
6563057 Printed circuit board and method for manufacturing sameExpiredFeb 09, 00May 13, 03[H05K]
6560505 Automatic parts placement system, method, and mediumExpiredMar 10, 00May 06, 03[G06F]
6502228 Route determination support device, route determination support method and storage medium storing therein program for executing method thereof, and printed substrate wiring methodExpiredJun 15, 00Dec 31, 02[G06F]
2002/0176,950 Method of manufacturing laminate and grommet used for the methodAbandonedJul 03, 02Nov 28, 02[F16L, B23P, B21K, B29D, B65D, B21D, B32B]
2002/0159,913 Sn-Ag-Cu solder and surface treatment and parts mounting methods using the sameAbandonedApr 23, 02Oct 31, 02[C22C]
6412097 COMPACTING METHOD OF CIRCUIT LAYOUT BY MOVING COMPONENTS USING MARGINS AND BUNDLE WIDTHS IN COMPLIANCE WITH THE DESIGN RULE, A DEVICE USING THE METHOD AND A COMPUTER PRODUCT ENABLING PROCESSOR TO PERFORM THE METHODExpiredFeb 01, 00Jun 25, 02[G06F]
6385758 System and method for compacting a graphic layoutExpiredMar 24, 99May 07, 02[G06F]
6316731 Method of forming a printed wiring board with compensation scalesExpiredNov 17, 99Nov 13, 01[H05K]
6300771 Electrical inspection device for detecting a latent defectExpiredNov 23, 98Oct 09, 01[G01R]
2001/0023,002 Method of manufacturing laminate and grommet used for the methodAbandonedMay 24, 01Sep 20, 01[B32B]
6120670 Method of fabricating a multi-layered printed wiring boardExpiredJan 26, 98Sep 19, 00[C25D, H05K]

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