NEPES CORPORATION

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H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 11351

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9006872 Semiconductor chip package having via hole and semiconductor module thereofSep 28, 11Apr 14, 15[H01L]
8421211 Wafer level semiconductor package and fabrication method thereofJun 27, 10Apr 16, 13[H01L]
8237276 Bump structure and fabrication method thereofJul 07, 10Aug 07, 12[H01L]
8093721 Flip chip semiconductor package and fabrication method thereofAug 31, 07Jan 10, 12[H01L]
7977789 Bump with multiple vias for semiconductor package and fabrication method thereof, and semiconductor package utilizing the sameAug 28, 06Jul 12, 11[H01L]
7952210 Semiconductor package and fabrication method thereofJan 31, 08May 31, 11[H01L]
7919833 Semiconductor package having a crack-propagation preventing unitJan 31, 08Apr 05, 11[H01L]
7906842 Wafer level system in package and fabrication method thereofJul 26, 07Mar 15, 11[H01L]
7808095 Ultra slim semiconductor package and method of fabricating the sameJan 31, 08Oct 05, 10[H01L]
6897141 Solder terminal and fabricating method thereofMay 10, 04May 24, 05[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2012/0286,419 SEMICONDUCTOR PACKAGE WITH INTERPOSER BLOCK THEREINAbandonedApr 26, 12Nov 15, 12[H01L]
2012/0146,216 SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOFAbandonedMar 03, 11Jun 14, 12[H01L]
2010/0032,831 BUMP STRUCTURE FOE SEMICONDUCTOR DEVICEAbandonedFeb 12, 08Feb 11, 10[H01L]
2009/0146,281 SYSTEM IN PACKAGE AND FABRICATION METHOD THEREOFAbandonedApr 29, 08Jun 11, 09[H01L]
2009/0032,942 SEMICONDUCTOR CHIP WITH SOLDER BUMP AND METHOD OF FABRICATING THE SAMEAbandonedNov 01, 06Feb 05, 09[H01L]
2009/0020,871 SEMICONDUCTOR CHIP WITH SOLDER BUMP SUPPRESSING GROWTH OF INTER-METALLIC COMPOUND AND METHOD OF FABRICATING THE SAMEAbandonedFeb 08, 06Jan 22, 09[H01L]

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