NIKKO MATERIALS USA, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 2230
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM9148
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 794
 
  
 
C25C PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR 316
 
  
 
B41M PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING 247
 
  
 
B01D SEPARATION 1133
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 186
 
  
 
B22D CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES 148
 
  
 
B25D PERCUSSIVE TOOLS 119
 
  
 
C08F MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS 1124

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
6824880 Process for improving adhesion of resistive foil to laminating materialsMay 15, 03Nov 30, 04[B32B]
6771160 Resistor component with multiple layers of resistive materialAug 02, 01Aug 03, 04[H01C]
6622374 Resistor component with multiple layers of resistive materialSep 22, 00Sep 23, 03[H01F]
6531039 Anode for plating a semiconductor waferFeb 21, 01Mar 11, 03[C25B]
6489034 Method of forming chromium coated copper for printed circuit boardsFeb 08, 00Dec 03, 02[C23C, C25D, B32B]
6489035 Applying resistive layer onto copperJul 31, 00Dec 03, 02[C23C, C25D, B32B]
6447929 Thin copper on usable carrier and method of forming sameAug 29, 00Sep 10, 02[C25D, B32B, H05K]
6221176 Surface treatment of copper to prevent microcracking in flexible circuitsMar 17, 99Apr 24, 01[C23C]
6183607 Anode structure for manufacture of metallic foilJun 22, 99Feb 06, 01[C25D]
6171714 Adhesiveless flexible laminate and process for making adhesiveless flexible laminateApr 03, 97Jan 09, 01[B32B]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
RE39615 Adhesive compositions and copper foils and copper clad laminates using sameExpiredOct 17, 02May 08, 07[B23B]
6860481 Sheet stacking deviceExpiredNov 14, 02Mar 01, 05[B65H]
6841084 Etching solution for forming an embedded resistorExpiredFeb 11, 02Jan 11, 05[C03C, C23F, B44C]
6805964 Protective coatings for improved tarnish resistance in metal foilsExpiredMar 24, 03Oct 19, 04[B32B]
6770380 Resin/copper/metal laminate and method of producing sameExpiredAug 11, 98Aug 03, 04[B32B]
6770976 Process for manufacturing copper foil on a metal carrier substrateExpiredFeb 13, 02Aug 03, 04[H01L]
6691874 Sheet stacking deviceExpiredNov 05, 01Feb 17, 04[B07C]
6673471 Corrosion prevention for CAC componentExpiredFeb 23, 01Jan 06, 04[B32B]
6589381 Coatings for improved resin dust resistanceExpiredApr 10, 01Jul 08, 03[B32B]
6589413 Method of making a copper on INVAR.RTM. compositeExpiredAug 09, 01Jul 08, 03[C25D]
6537675 Protective coatings for improved tarnish resistance in metal foilsExpiredNov 15, 00Mar 25, 03[B32B]
2003/0017,357 Component of printed circuit boardsAbandonedJul 13, 01Jan 23, 03[B32B]
6426146 Treated copper foil and process for making treated copper foilExpiredFeb 10, 00Jul 30, 02[B32B]
6379487 Component of printed circuit boardExpiredMay 05, 00Apr 30, 02[B41M, C25D, B44C, B32B]
6376008 Resin/copper/metal laminate and method of producing sameExpiredSep 21, 99Apr 23, 02[B05D, B32B]
6361673 Electroforming cellExpiredJun 27, 00Mar 26, 02[C25D]
6341698 Sheet stacking deviceExpiredMay 08, 00Jan 29, 02[B07C]
6316733 Component for use in forming printed circuit boardsExpiredAug 18, 00Nov 13, 01[H05K]
6299721 Coatings for improved resin dust resistanceExpiredDec 14, 98Oct 09, 01[B32B]
6296949 Copper coated polyimide with metallic protective layerExpiredSep 16, 99Oct 02, 01[B32B]

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