NIPPON MICROMETAL CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 26336
 
  
 
C22C ALLOYS 1557
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 1479
 
  
 
H01B CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES 767
 
  
 
B21C MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES, PROFILES OR LIKE SEMI-MANUFACTURED PRODUCTS OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL417
 
  
 
C22F CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS 433
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM3154
 
  
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 1132
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1155

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0365,576 BONDING WIRE FOR SEMICONDUCTOR DEVICEDec 11, 15Dec 21, 17[H01L, B23K]
2017/0259,366 LEAD-FREE SOLDER BUMP JOINING STRUCTUREOct 30, 15Sep 14, 17[B23K, C22C]
2017/0040,281 BONDING WIRE FOR SEMICONDUCTOR DEVICEApr 21, 15Feb 09, 17[H01L, B23K, B32B, C22C]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9887172 Bonding wire for semiconductor deviceSep 17, 15Feb 06, 18[H01L, C22C]
9812421 Bonding wire for semiconductor devicesDec 04, 14Nov 07, 17[H01L, B23K, C22C]
9773748 Bonding wire for semiconductor deviceDec 28, 15Sep 26, 17[H01L, H01B]
9543266 Bonding wire for semiconductor device use and method of production of sameMar 31, 15Jan 10, 17[H01L, H01B, B21C, C22F, C22C]
9536854 Bonding wire for semiconductor device use and method of production of sameMar 31, 15Jan 03, 17[H01L, B23K, H01B, B21C, C22F, C22C]
9434027 Bonding wire and method for manufacturing sameJul 18, 14Sep 06, 16[H01L, B23K, B21C, C22F, B22D, B32B, C22C]
9427830 Copper alloy bonding wire for semiconductorJun 23, 10Aug 30, 16[H01L, B23K, B21C, C22F, C22C, B32B]
9331049 Bonding structure of bonding wireJul 10, 09May 03, 16[H01L]
9320152 Solder ball and electronic memberMay 12, 14Apr 19, 16[B23K, H05K, C22C]
9112059 Bonding wire for semiconductor deviceJan 12, 12Aug 18, 15[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
8501088 Solder alloy, solder ball and electronic member having solder bumpExpiredDec 30, 08Aug 06, 13[C22C]
2012/0038,042 LEAD-FREE SOLDER ALLOY, SOLDER BALL, AND ELECTRONIC MEMBER COMPRISING SOLDER BUMPAbandonedApr 12, 10Feb 16, 12[H01L, C22C]

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