NIPPON MINING & METALS CO., LTD.

Patent Owner

Watch Compare Add to Portfolio

Stats

Details

Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
B22F WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER 250
 
 
 
C30B SINGLE-CRYSTAL GROWTH 254
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2360
 
 
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 1100
 
 
 
H01J ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS 1127

Top Patents (by citation)

Upgrade to the Professional Level to View Top Patents for this Owner. Learn More

Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0009,335 PROCESS FOR PRODUCING A TARGET FORMED OF A SINTERING-RESISTANT MATERIAL OF A HIGH-MELTING POINT METAL ALLOY, SILICIDE, CARBIDE, NITRIDE OR BORIDESep 21, 16Jan 12, 17[C23C, H01J, B22F]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7767139 AlRu sputtering target and manufacturing method thereofApr 09, 07Aug 03, 10[B22F]
5716450 Growing method of gallium nitride related compound semiconductor crystal and gallium nitride related compound semiconductor deviceDec 06, 95Feb 10, 98[C30B]
5603763 Method for growing single crystalOct 18, 95Feb 18, 97[C30B]
5434100 Substrate for epitaxy and epitaxy using the substrateApr 23, 93Jul 18, 95[H01L]
5254507 Semi-insulating InP single crystals, semiconductor devices having substrates of the crystals and processes for producing the sameSep 11, 92Oct 19, 93[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2012/0189,811 COPPER ELECTROLYTIC SOLUTION AND TWO-LAYER FLEXIBLE SUBSTRATE OBTAINED USING THE SAMEAbandonedApr 02, 12Jul 26, 12[B32B, C22C]
8137460 Manufacturing method of GaN thin film template substrate, GaN thin film template substrate and GaN thick film single crystalExpiredSep 14, 07Mar 20, 12[H01L]
2010/0276,037 High strength titanium copper alloy, manufacturing method therefor, and terminal connector using the sameAbandonedDec 31, 07Nov 04, 10[C22C, C21D, C22F]
2010/0224,496 Copper electrolytic solution containing as additive compound having specific skeleton, and electrolytic copper foil manufactured therewithAbandonedFeb 23, 10Sep 09, 10[B32B]
2010/0101,486 SUBSTRATE FOR EPITAXIAL GROWTH AND METHOD FOR PRODUCING NITRIDE COMPOUND SEMICONDUCTOR SINGLE CRYSTALAbandonedMar 07, 08Apr 29, 10[C01F, C30B]
2010/0084,275 COPPER ELECTROLYTIC SOLUTION AND TWO-LAYER FLEXIBLE SUBSTRATE OBTAINED USING THE SAMEAbandonedMar 05, 08Apr 08, 10[B32B, C25D]
2010/0040,873 Two-Layered Copper-Clad LaminateAbandonedNov 14, 07Feb 18, 10[B32B]
2009/0277,559 METHOD FOR VULCANIZATION-ADHERING RUBBER COMPOSITION TO ADHERENT OF BRASS OR PLATED WITH BRASS, REINFORCING MEMBER FOR RUBBER ARTICLE, RUBBER-REINFORCING MEMBER COMPOSITE AND PNEUMATIC TIREAbandonedNov 28, 05Nov 12, 09[B60C, B32B]
2009/0022,993 Copper alloyAbandonedFeb 25, 08Jan 22, 09[B32B]
2009/0008,840 Apparatus for removing ruthenium from solution containing platinum group metalAbandonedMay 11, 07Jan 08, 09[C22B]
2008/0277,032 COPPER, COPPER ALLOY, AND MANUFACTURING METHOD THEREFORAbandonedJun 05, 08Nov 13, 08[C22C]
2008/0247,935 Compound Semiconductor SubstrateAbandonedFeb 15, 05Oct 09, 08[H01L]
2008/0224,313 Method for forming a seed layer for damascene copper wiring, and semiconductor wafer with damascene copper wiring formed using the methodAbandonedMar 13, 08Sep 18, 08[H01L]
2008/0149,494 Method for producing sheet-form electrolytic copper from halide solutionAbandonedMay 21, 07Jun 26, 08[C25C]
2008/0121,320 COPPER ALLOY AND PRODUCING METHOD THEREFORAbandonedJan 29, 08May 29, 08[C22C, C22F]
2008/0089,831 Method for producing ZnTe system compound semiconductor single crystal, ZnTe system compound semiconductor single crystal, and semiconductor deviceAbandonedNov 26, 07Apr 17, 08[C01B]
2008/0023,669 Metal Surface Treatment Agent for Promoting Rubber-Metal AdhesionAbandonedJun 15, 05Jan 31, 08[C09K, C08K]
2007/0269,680 Electroless Plating Pretreatment Agent and Copper-Clad Laminate for Flexible SubstrateAbandonedAug 22, 05Nov 22, 07[C23C]
2007/0120,880 Inkjet ink compositionAbandonedOct 22, 04May 31, 07[C09D, B41J]
2007/0123,681 Resin compositionAbandonedSep 30, 04May 31, 07[C08G]

View all patents..

Top Inventors for This Owner

Upgrade to the Professional Level to View Top Inventors for this Owner. Learn More

We are sorry but your current selection exceeds the maximum number of comparisons () for this membership level. Upgrade to our Level for up to -1 comparisons!

We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.