NIPPON MINING & METALS CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
B22F WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER 250
 
 
 
C30B SINGLE-CRYSTAL GROWTH 252
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2353
 
 
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 198
 
 
 
H01J ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS 1128

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0009,335 PROCESS FOR PRODUCING A TARGET FORMED OF A SINTERING-RESISTANT MATERIAL OF A HIGH-MELTING POINT METAL ALLOY, SILICIDE, CARBIDE, NITRIDE OR BORIDESep 21, 16Jan 12, 17[C23C, H01J, B22F]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7767139 AlRu sputtering target and manufacturing method thereofApr 09, 07Aug 03, 10[B22F]
5716450 Growing method of gallium nitride related compound semiconductor crystal and gallium nitride related compound semiconductor deviceDec 06, 95Feb 10, 98[C30B]
5603763 Method for growing single crystalOct 18, 95Feb 18, 97[C30B]
5434100 Substrate for epitaxy and epitaxy using the substrateApr 23, 93Jul 18, 95[H01L]
5254507 Semi-insulating InP single crystals, semiconductor devices having substrates of the crystals and processes for producing the sameSep 11, 92Oct 19, 93[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2012/0189,811 COPPER ELECTROLYTIC SOLUTION AND TWO-LAYER FLEXIBLE SUBSTRATE OBTAINED USING THE SAMEABANApr 02, 12Jul 26, 12[B32B, C22C]
8137460 Manufacturing method of GaN thin film template substrate, GaN thin film template substrate and GaN thick film single crystalExpiredSep 14, 07Mar 20, 12[H01L]
2010/0276,037 High strength titanium copper alloy, manufacturing method therefor, and terminal connector using the sameABANDec 31, 07Nov 04, 10[C22C, C21D, C22F]
2010/0224,496 Copper electrolytic solution containing as additive compound having specific skeleton, and electrolytic copper foil manufactured therewithABANFeb 23, 10Sep 09, 10[B32B]
2010/0101,486 SUBSTRATE FOR EPITAXIAL GROWTH AND METHOD FOR PRODUCING NITRIDE COMPOUND SEMICONDUCTOR SINGLE CRYSTALABANMar 07, 08Apr 29, 10[C01F, C30B]
2010/0084,275 COPPER ELECTROLYTIC SOLUTION AND TWO-LAYER FLEXIBLE SUBSTRATE OBTAINED USING THE SAMEABANMar 05, 08Apr 08, 10[B32B, C25D]
2010/0040,873 Two-Layered Copper-Clad LaminateABANNov 14, 07Feb 18, 10[B32B]
2009/0277,559 METHOD FOR VULCANIZATION-ADHERING RUBBER COMPOSITION TO ADHERENT OF BRASS OR PLATED WITH BRASS, REINFORCING MEMBER FOR RUBBER ARTICLE, RUBBER-REINFORCING MEMBER COMPOSITE AND PNEUMATIC TIREABANNov 28, 05Nov 12, 09[B60C, B32B]
2009/0022,993 Copper alloyABANFeb 25, 08Jan 22, 09[B32B]
2009/0008,840 Apparatus for removing ruthenium from solution containing platinum group metalABANMay 11, 07Jan 08, 09[C22B]
2008/0277,032 COPPER, COPPER ALLOY, AND MANUFACTURING METHOD THEREFORABANJun 05, 08Nov 13, 08[C22C]
2008/0247,935 Compound Semiconductor SubstrateABANFeb 15, 05Oct 09, 08[H01L]
2008/0224,313 Method for forming a seed layer for damascene copper wiring, and semiconductor wafer with damascene copper wiring formed using the methodABANMar 13, 08Sep 18, 08[H01L]
2008/0149,494 Method for producing sheet-form electrolytic copper from halide solutionABANMay 21, 07Jun 26, 08[C25C]
2008/0121,320 COPPER ALLOY AND PRODUCING METHOD THEREFORABANJan 29, 08May 29, 08[C22C, C22F]
2008/0089,831 Method for producing ZnTe system compound semiconductor single crystal, ZnTe system compound semiconductor single crystal, and semiconductor deviceABANNov 26, 07Apr 17, 08[C01B]
2008/0023,669 Metal Surface Treatment Agent for Promoting Rubber-Metal AdhesionABANJun 15, 05Jan 31, 08[C09K, C08K]
2007/0269,680 Electroless Plating Pretreatment Agent and Copper-Clad Laminate for Flexible SubstrateABANAug 22, 05Nov 22, 07[C23C]
2007/0120,880 Inkjet ink compositionABANOct 22, 04May 31, 07[C09D, B41J]
2007/0123,681 Resin compositionABANSep 30, 04May 31, 07[C08G]

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