NODA SCREEN CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 9353
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 3153
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 285
 
  
 
H01G CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE 264
 
  
 
B05C APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 144
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 192
 
  
 
B44B MACHINES, APPARATUS, OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING 16
 
  
 
G03B APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR 196
 
  
 
G03C PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES 145

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9761544 Semiconductor deviceNov 13, 15Sep 12, 17[H01L, H01G]
9653421 Semiconductor deviceApr 07, 15May 16, 17[H01L, H01G]
9627354 Semiconductor memory deviceJun 02, 15Apr 18, 17[H01L, H01G]
9431337 Semiconductor device having an inner power supply plate structureSep 29, 15Aug 30, 16[H01L]
9153549 Semiconductor deviceFeb 12, 13Oct 06, 15[H01L, H05K]
7716825 Method for manufacturing printed wiring boardDec 09, 02May 18, 10[H05K]
7172925 Method for manufacturing printed wiring boardDec 12, 02Feb 06, 07[H01L]
6792852 Vacuum print systemJan 08, 03Sep 21, 04[B05C, B44B]
6583849 Apparatus for exposure of photo-curing resin applied to printed circuit boardJul 31, 00Jun 24, 03[H01L, B05D, G03C, G03B]
6276599 Method and apparatus for forming solder bumpsApr 09, 99Aug 21, 01[B23K]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2006/0113,032 Method for manufacturing printed wiring boardAbandonedDec 09, 02Jun 01, 06[B29C]

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