NOVELLUS DEVELOPMENT COMPANY, LLC

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 6153
 
  
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 2131

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7405581 Probing system uses a probe device including probe tips on a surface of a semiconductor dieNov 19, 03Jul 29, 08[G01R]
6946859 Probe structures using clamped substrates with compliant interconnectorsApr 16, 03Sep 20, 05[H01R, G01R]
6924654 Structures for testing circuits and methods for fabricating the structuresApr 16, 03Aug 02, 05[H01R, G01R]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2008/0079,450 Intelligent probe chips/headsAbandonedOct 24, 07Apr 03, 08[G01R]
7170306 Connecting a probe card and an interposer using a compliant connectorExpiredMar 12, 03Jan 30, 07[G01R]
6998864 Structures for testing circuits and methods for fabricating the structuresExpiredJun 28, 05Feb 14, 06[G01R]
2006/0006,890 Interconnect structure that controls spacing between a probe card and a contact substrateAbandonedSep 08, 05Jan 12, 06[G01R]
6984996 Wafer probing that conditions devices for flip-chip bondingExpiredMay 01, 03Jan 10, 06[G01R]
2005/0289,415 Intelligent probe chips/headsAbandonedJun 24, 05Dec 29, 05[G01R]
6975127 Planarizing and testing of BGA packagesExpiredNov 19, 03Dec 13, 05[G01R]
2005/0231,222 Wafer probing that conditions devices for flip-chip bondingAbandonedJun 14, 05Oct 20, 05[G01R]
2004/0177,985 Structures for testing circuits and methods for fabricating the structuresAbandonedApr 16, 03Sep 16, 04[H01L]
2004/0177,995 Structures for testing circuits and methods for fabricating the structuresAbandonedMar 12, 03Sep 16, 04[H05K]
2004/0180,561 Structures for testing circuits and methods for fabricating the structuresAbandonedApr 16, 03Sep 16, 04[H01R]

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