NOVELLUS SYSTEMS, INC.

Patent Owner

Watch Compare Add to Portfolio

Stats

Details

Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 514100
 
 
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 17713
 
 
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 1671
 
 
 
B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 8811
 
 
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 399
 
 
 
B08B CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL 3029
 
 
 
H05H PLASMA TECHNIQUE 297
 
 
 
C25F PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR 252
 
 
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 2364
 
 
 
C25B ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON- METALS; APPARATUS THEREFOR 2213

Top Patents (by citation)

Upgrade to the Professional Level to View Top Patents for this Owner. Learn More

Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2016/0102,416 LOW COPPER/HIGH HALIDE ELECTROPLATING SOLUTIONS FOR FILL AND DEFECT CONTROLDec 14, 15Apr 14, 16[C25D]
2014/0235,069 MULTI-PLENUM SHOWERHEAD WITH TEMPERATURE CONTROLJul 03, 13Aug 21, 14[F28F, H01L]
2013/0319,329 PLASMA-ACTIVATED DEPOSITION OF CONFORMAL FILMSAug 09, 13Dec 05, 13[H01L]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9905423 Soft landing nanolaminates for advanced patterningJun 08, 16Feb 27, 18[C23C, H01L]
9899230 Apparatus for advanced packaging applicationsAug 08, 16Feb 20, 18[B44C, G03F, H01L, C25D]
9873946 Multi-station sequential curing of dielectric filmsJan 09, 15Jan 23, 18[C23C, H01L]
9856574 Monitoring leveler concentrations in electroplating solutionsMar 04, 16Jan 02, 18[G01N, C25D]
9852913 Wetting pretreatment for enhanced damascene metal fillingJan 09, 15Dec 26, 17[C23C, H01L, C25D]
9834852 Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplatingOct 12, 16Dec 05, 17[G01N, C25D]
9835388 Systems for uniform heat transfer including adaptive portionsDec 28, 12Dec 05, 17[F28F, H01L]
9828688 Methods and apparatus for wetting pretreatment for through resist metal platingJun 13, 16Nov 28, 17[H01L, C25D]
9822461 Dynamic current distribution control apparatus and method for wafer electroplatingNov 28, 12Nov 21, 17[H01L, C25D]
9816193 Configuration and method of operation of an electrodeposition system for improved process stability and performanceDec 13, 11Nov 14, 17[C25D]

View all patents..

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2015/0030,766 PEDESTAL BOTTOM CLEAN FOR IMPROVED FLUORINE UTILIZATION AND INTEGRATED SYMMETRIC FORELINEAbandonedJul 25, 13Jan 29, 15[C23C, H01L]
2014/0302,689 METHODS AND APPARATUS FOR DIELECTRIC DEPOSITIONAbandonedApr 09, 14Oct 09, 14[H01L]
2014/0216,336 METAL AND SILICON CONTAINING CAPPING LAYERS FOR INTERCONNECTSAbandonedApr 03, 14Aug 07, 14[H01L]
2014/0209,026 PLASMA ACTIVATED DEPOSITION OF A CONFORMAL FILM ON A SUBSTRATE SURFACEAbandonedApr 02, 14Jul 31, 14[C23C]
2014/0199,497 METHODS FOR REDUCING METAL OXIDE SURFACES TO MODIFIED METAL SURFACESAbandonedJan 14, 13Jul 17, 14[B05D]
2014/0127,912 PLASMA PROCESS ETCH-TO-DEPOSITION RATIO MODULATION VIA GROUND SURFACE DESIGNAbandonedNov 08, 12May 08, 14[H01L]
2014/0120,733 LOW DAMAGE PHOTORESIST STRIP METHOD FOR LOW-K DIELECTRICSAbandonedOct 29, 13May 01, 14[H01L]
2014/0094,038 ENHANCING ADHESION OF CAP LAYER FILMSAbandonedSep 13, 13Apr 03, 14[H01L]
2014/0080,324 MULTI-STATION SEQUENTIAL CURING OF DIELECTRIC FILMSAbandonedNov 21, 13Mar 20, 14[H01L]
2014/0069,459 METHODS AND APPARATUS FOR CLEANING DEPOSITION CHAMBERSAbandonedOct 17, 12Mar 13, 14[B08B, H05H]
2014/0053,867 PLASMA CLEAN METHOD FOR DEPOSITION CHAMBERAbandonedOct 30, 13Feb 27, 14[B08B]
2014/0049,162 DEFECT REDUCTION IN PLASMA PROCESSINGAbandonedAug 15, 12Feb 20, 14[H05H]
2014/0030,444 HIGH PRESSURE, HIGH POWER PLASMA ACTIVATED CONFORMAL FILM DEPOSITIONAbandonedJul 29, 13Jan 30, 14[C23C]
2014/0014,522 PHOTORESIST-FREE METAL DEPOSITIONAbandonedJul 23, 13Jan 16, 14[C25D]
2014/0001,050 ELECTROPLATING APPARATUSES AND METHODS EMPLOYING LIQUID PARTICLE COUNTER MODULESAbandonedJun 18, 13Jan 02, 14[C25D]
2013/0323,930 Selective Capping of Metal Interconnect Lines during Air Gap FormationAbandonedMay 29, 12Dec 05, 13[H01L]
2013/0316,094 RF-POWERED, TEMPERATURE-CONTROLLED GAS DIFFUSERAbandonedMay 23, 13Nov 28, 13[F24H, C23C]
2013/0237,063 SPLIT PUMPING METHOD, APPARATUS, AND SYSTEMAbandonedMar 01, 13Sep 12, 13[H01L]
2013/0206,725 CREATION OF OFF-AXIS NULL MAGNETIC FIELD LOCUS FOR IMPROVED UNIFORMITY IN PLASMA DEPOSITION AND ETCHINGAbandonedMar 16, 10Aug 15, 13[C23F, C23C]
2013/0157,466 SILICON NITRIDE FILMS FOR SEMICONDUCTOR DEVICE APPLICATIONSAbandonedFeb 13, 13Jun 20, 13[H01L]

View all patents..

Top Inventors for This Owner

Upgrade to the Professional Level to View Top Inventors for this Owner. Learn More

We are sorry but your current selection exceeds the maximum number of comparisons () for this membership level. Upgrade to our Level for up to -1 comparisons!

We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.