NUVOTRONICS, INC

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
H01P WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE 3130
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 19343
 
 
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 7198
 
 
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 7149
 
 
 
H01Q AERIALS 5105
 
 
 
H01S DEVICES USING STIMULATED EMISSION488
 
 
 
G01B MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS396
 
 
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 3130
 
 
 
H03F AMPLIFIERS 380
 
 
 
H01B CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES 272

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0330,836 CTE COMPENSATION FOR WAFER-LEVEL AND CHIP-SCALE PACKAGES AND ASSEMBLIESJul 17, 17Nov 16, 17[H01L]
2017/0170,592 BATCH FABRICATED MICROCONNECTORSJan 12, 17Jun 15, 17[H01R]
2016/0218,048 MICROFLUIDIC CHANNELS FOR THERMAL MANAGEMENT OF MICROELECTRONICSJan 26, 16Jul 28, 16[H01L]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9888600 Substrate-free interconnected electronic mechanical structural systemsMar 14, 16Feb 06, 18[H01P, H05K]
9843084 Three-dimensional microstructuresJul 28, 16Dec 12, 17[H01P]
9817199 Device package and methods for the fabrication and testing thereofMay 02, 17Nov 14, 17[H01L, G02B, H01S]
9666947 Dielectric-free metal-only dipole-coupled broadband radiating array aperture with wide field of viewDec 11, 14May 30, 17[H01Q]
9660614 Stacked, switched filter banksJul 25, 16May 23, 17[H03K, H03H]
9647420 Package and methods for the fabrication and testing thereofAug 08, 16May 09, 17[H01L, G02B, H01S, G01B]
9608303 Multi-layer digital elliptic filter and methodApr 20, 16Mar 28, 17[H01P]
9583856 Batch fabricated microconnectorsAug 26, 14Feb 28, 17[H01L, H01R, H05K]
9570787 Hollow core coaxial cables and methods of making the sameJul 20, 15Feb 14, 17[H01P, H01B, G02B, H01Q]
9570789 Transition structure between a rectangular coaxial microstructure and a cylindrical coaxial cable using step changes in center conductors thereofApr 07, 15Feb 14, 17[H01P]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0217,922 MULTILAYER BUILD PROCESSES AND DEVICES THEREOFAbandonedJan 22, 16Jul 28, 16[H01F]
2015/0327,410 DEVICE PACKAGE AND METHODS FOR THE FABRICATION THEREOFAbandonedJan 21, 15Nov 12, 15[C23C, B05D, H05K]
2015/0162,663 METAL-ONLY DIELECTRIC-FREE BROADBAND APERTURE-COUPLED PATCH ARRAYAbandonedDec 11, 14Jun 11, 15[H01Q]
2013/0333,820 MULTILAYER BUILD PROCESSES AND DEVICES THEREOFAbandonedAug 13, 13Dec 19, 13[H01F]

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