OAK-MITSUI, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01G CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE 561
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 348
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM2155
 
  
 
B21D WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING 155
 
  
 
D02J FINISHING OR DRESSING OF FILAMENTS, YARNS, THREADS, CORDS, ROPES, OR THE LIKE 19
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1155

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7862900 Multilayered construction for use in resistors and capacitorsAug 26, 09Jan 04, 11[H01G]
7672113 Polymer-ceramic composites with excellent TCCSep 14, 07Mar 02, 10[H01G]
7596842 Method of making multilayered construction for use in resistors and capacitorsFeb 22, 05Oct 06, 09[H01G]
7413815 Thin laminate as embedded capacitance material in printed circuit boardsFeb 19, 04Aug 19, 08[B21D]
7192654 Multilayered construction for resistor and capacitor formationFeb 22, 05Mar 20, 07[H01G]
6657849 Formation of an embedded capacitor plane using a thin dielectricAug 24, 00Dec 02, 03[H01G]
6629348 Substrate adhesion enhancement to filmMay 01, 01Oct 07, 03[D02J]
6610417 Nickel coated copper as electrodes for embedded passive devicesOct 04, 01Aug 26, 03[C25D, B32B]
6606792 Process to manufacturing tight tolerance embedded elements for printed circuit boardsMay 25, 00Aug 19, 03[H05K]
6117300 Method for forming conductive traces and printed circuits made therebyJul 09, 98Sep 12, 00[C25D]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2009/0034,156 COMPOSITE SHEETAbandonedJul 30, 07Feb 05, 09[H01B, H01G]
2004/0253,473 Metal foil composite structure for producing clad laminateAbandonedJun 13, 03Dec 16, 04[B32B]
6763575 Printed circuit boards having integrated inductor coresExpiredJun 11, 01Jul 20, 04[H01R]
2004/0075,528 Printed circuit heaters with ultrathin low resistivity materialsAbandonedOct 22, 02Apr 22, 04[H01C]
6500349 Manufacture of printed circuits using single layer processing techniquesExpiredDec 26, 00Dec 31, 02[C23F, B44C]
6495244 Manufacturing fire retardant circuit boards without the use of fire retardant resin additivesExpiredSep 07, 00Dec 17, 02[B32B]
2002/0130,103 Polyimide adhesion enhancement to polyimide filmAbandonedMar 15, 01Sep 19, 02[H01B, G11B, G01D]

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