OEM GROUP, LLC

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B08B CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL 3525
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 16346
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 1289
 
  
 
C03C CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS357
 
  
 
C23G CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS 310
 
  
 
H05H PLASMA TECHNIQUE 327
 
  
 
F26B DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM 228
 
  
 
A01G HORTICULTURE; CULTIVATION OF VEGETABLES, FLOWERS, RICE, FRUIT, VINES, HOPS, OR SEAWEED; FORESTRY; WATERING 131
 
  
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 135
 
  
 
C25B ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON- METALS; APPARATUS THEREFOR 134

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2002/0066,464 Processing a workpiece using ozone and sonic energyJan 16, 02Jun 06, 02[B08B]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8808513 Stress adjustment in reactive sputteringMar 25, 09Aug 19, 14[C23C, C25B]
8691057 Stress adjustment in reactive sputteringMar 25, 09Apr 08, 14[C23C]
8482375 Sputter deposition of cermet resistor films with low temperature coefficient of resistanceMay 24, 10Jul 09, 13[H01C]
7955870 Dry etch stop process for eliminating electrical shorting in MRAM device structuresSep 02, 09Jun 07, 11[H01L]
7645618 Dry etch stop process for eliminating electrical shorting in MRAM device structuresMar 14, 07Jan 12, 10[H01L]
7520286 Apparatus and method for cleaning and drying a container for semiconductor workpiecesDec 05, 05Apr 21, 09[B08B]
7467598 System for, and method of, etching a surface on a waferApr 09, 01Dec 23, 08[C23C]
7439188 Reactor with heated and textured electrodes and surfacesJun 22, 01Oct 21, 08[H01L]
7416611 Process and apparatus for treating a workpiece with gasesJun 18, 04Aug 26, 08[B08B]
7404863 Methods of thinning a silicon wafer using HF and ozoneJul 30, 03Jul 29, 08[B08B]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2008/0083,611 High-adhesive backside metallizationAbandonedSep 27, 07Apr 10, 08[C23C]
6691718 Wafer container cleaning systemExpiredMar 26, 02Feb 17, 04[B08B]
6660104 Dual cassette centrifugal processorExpiredJun 05, 02Dec 09, 03[B08B]
6620335 Plasma etch reactor and methodExpiredDec 07, 99Sep 16, 03[H01L]
6605198 Apparatus for, and method of, depositing a film on a substrateExpiredNov 29, 95Aug 12, 03[C23C]
6601594 Apparatus and method for delivering a treatment liquid and ozone to treat the surface of a workpieceExpiredApr 18, 01Aug 05, 03[B08B]
6500314 Plasma etch reactor and methodExpiredJul 03, 96Dec 31, 02[C23C]
6497768 Process for treating a workpiece with hydrofluoric acid and ozoneExpiredAug 14, 01Dec 24, 02[B08B, C23G]
6492280 Method and apparatus for etching a semiconductor wafer with features having vertical sidewallsExpiredMar 02, 00Dec 10, 02[H01L]
6486069 Cobalt silicide etch process and apparatusExpiredDec 03, 99Nov 26, 02[H01L]

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