OLIN MICROELECTRONIC CHEMICALS, INC.

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Technologies

Intl Class Technology Matters Rank in Class
 
  
 
G03F PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR 599
 
  
 
C08F MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS 3122
 
  
 
G03C PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES 343
 
  
 
C08G MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS 1119
 
  
 
C08J WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER- TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C C08F, C08G or C08H 177

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
5849808 Organic solvent soluble photoresists which are developable in aqueous alkaline solutionsApr 19, 96Dec 15, 98[C08J, C08G]
5446125 Method for removing metal impurities from resist componentsSep 03, 91Aug 29, 95[C08F]
5446126 Method for removing metal impurities from resist componentsSep 03, 91Aug 29, 95[C08F]
5436098 Positive photoresists with enhanced resolution and reduced crystallization containing novel tetra(hydroxyphenyl)alkanesJan 11, 94Jul 25, 95[G03F]
5334481 Positive diazo quinone photoresist compositions containing antihalation compoundApr 25, 91Aug 02, 94[G03C, G03F]
5296330 Positive photoresists containing quinone diazide photosensitizer, alkali-soluble resin and tetra(hydroxyphenyl) alkane additiveAug 15, 92Mar 22, 94[G03C, G03F]
5284737 Process of developing an image utilizing positive-working radiation sensitive mixtures containing alkali-soluble binder, o-quinonediazide photoactive compound and blankophor FBW actinic dyeAug 19, 93Feb 08, 94[G03F]
5275909 Positive-working radiation sensitive mixtures and articles containing alkali-soluble binder, o-quinonediazide photoactive compound and BLANKOPHOR FBW acting dyeJun 01, 92Jan 04, 94[G03C, G03F]
5274060 Copolymers crosslinkable by acid catalysisFeb 27, 92Dec 28, 93[C08F]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
6063549 Wet-chemical, developable, etch-stable photoresist for UV radiation with a wavelength below 200 nmExpiredMay 27, 98May 16, 00[G03F]
5985507 Selected high thermal novolaks and positive-working radiation-sensitive compositionsExpiredFeb 18, 98Nov 16, 99[G03F]
5928818 Photoresist compositionsExpiredFeb 26, 97Jul 27, 99[G03F]
5886119 Terpolymers containing organosilicon side chainsExpiredJul 16, 96Mar 23, 99[C08F]
5863701 Polymers containing protected styrene and unprotected hydroxbenzyl (meth) acrylamidesExpiredMay 05, 98Jan 26, 99[G03C]
5856065 Negative working photoresist composition based on polyimide primersExpiredFeb 14, 97Jan 05, 99[G03F]
5834531 Crosslinked polymersExpiredOct 29, 97Nov 10, 98[C08F]
5834581 Process for making polyimide-polyamic ester copolymersExpiredApr 15, 97Nov 10, 98[C08G]
5817610 Non-corrosive cleaning composition for removing plasma etching residuesExpiredSep 06, 96Oct 06, 98[C11D]
5789524 Chemical imidization reagent for polyimide synthesisExpiredApr 15, 97Aug 04, 98[C08G]
5789525 Process for making polyimides from diamines and tetracarboxylic diacid diesterExpiredApr 15, 97Aug 04, 98[C08G]
5780566 Polymers containing protected styrene and unprotected hydroxybenzyl (meth)acrylamidesExpiredOct 26, 95Jul 14, 98[C08F]
5776657 Wet-chemical developable, etch-stable photoresist for UV radiation with a wavelength below 200 NMExpiredMar 14, 96Jul 07, 98[G03F]
5759973 Photoresist stripping and cleaning compositionsExpiredSep 06, 96Jun 02, 98[C11D]
5714559 Crosslinked polymersExpiredDec 14, 95Feb 03, 98[C08F]
5674657 Positive-working photoresist compositions comprising an alkali-soluble novolak resin made with four phenolic monomersExpiredNov 04, 96Oct 07, 97[G03F]
5665688 Photoresist stripping compositionExpiredJan 23, 96Sep 09, 97[C11D]
5663038 Process for the preparation of partially protected phenolic resinsExpiredDec 14, 95Sep 02, 97[G03C]
5650262 High-resolution negative photoresist with wide process latitudeExpiredApr 05, 95Jul 22, 97[G03F]
5612304 Redox reagent-containing post-etch residue cleaning compositionExpiredJul 07, 95Mar 18, 97[C11D]

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