Optiz, Inc.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 33329
 
  
 
H04N PICTORIAL COMMUNICATION, e.g. TELEVISION 4238
 
  
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 2203
 
  
 
B29D PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE 156
 
  
 
G01N INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES 1205
 
  
 
G06K RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS 1197
 
  
 
H01J ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS 1127

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2015/0189,204 Semiconductor Device On Cover Substrate And Method Of Making SameDec 05, 14Jul 02, 15[H04N, G06K]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9893213 Method of forming a wire bond sensor packageApr 20, 17Feb 13, 18[H01L]
9893218 Sensor package with cooling featureOct 11, 16Feb 13, 18[H01L]
9853079 Method of forming a stress released image sensor package structureDec 05, 16Dec 26, 17[H01L]
9666625 Method of making low profile sensor package with cooling featureSep 13, 16May 30, 17[H01L]
9666730 Wire bond sensor packageJul 27, 15May 30, 17[H01L]
9667900 Three dimensional system-on-chip image sensor packageNov 26, 14May 30, 17[H01L, H04N, G02B]
9570634 Sensor package with exposed sensor array and method of making sameAug 12, 15Feb 14, 17[H01L, G01N]
9543347 Stress released image sensor package structure and methodFeb 05, 16Jan 10, 17[H01L]
9524917 Chip level heat dissipation using siliconMar 18, 15Dec 20, 16[H01L]
9496247 Integrated camera module and method of making sameAug 20, 14Nov 15, 16[H01L, H04N]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2014/0264,693 Cover-Free Sensor Module And Method Of Making SameAbandonedMar 07, 14Sep 18, 14[H01L]
2013/0249,031 Quantum Efficiency Back Side Illuminated CMOS Image Sensor And Package, And Method Of Making SameAbandonedMar 22, 12Sep 26, 13[H01L]
2013/0168,791 Quantum Efficiency Back Side Illuminated CMOS Image Sensor And Package, And Method Of Making SameAbandonedJan 04, 12Jul 04, 13[H01L]

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