Optopac, Inc.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 8354

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7494848 Flip-chip packaging of a photo-sensor die on a transparent substrateSep 15, 06Feb 24, 09[H01L]
7384818 Electronic package for image sensor, and the packaging method thereofOct 24, 06Jun 10, 08[]
7291518 Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereofMay 18, 05Nov 06, 07[H01L]
7141869 Electronic package for image sensor, and the packaging method thereofFeb 09, 05Nov 28, 06[H01L]
7122874 Electronic package having a sealing structure on predetermined area, and the method thereofSep 10, 04Oct 17, 06[H01L]
7038287 Electronic package of photo-sensing semiconductor devices, and the fabrication and assembly thereofDec 03, 04May 02, 06[H01L]
6943423 Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereofApr 22, 04Sep 13, 05[H01L]
6943424 Electronic package having a patterned layer on backside of its substrate, and the fabrication thereofJul 08, 04Sep 13, 05[H01L]
6864116 Electronic package of photo-sensing semiconductor devices, and the fabrication and assembly thereofOct 27, 03Mar 08, 05[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2006/0043,513 Method of making camera module in wafer levelAbandonedApr 01, 05Mar 02, 06[H01L]

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